Joaquin A. Santillan 480-***-**** ac16vw@r.postjobfree.com Gilbert, AZ

Semiconductor Materials Technologist

Specializing in Semiconductor Process Manufacturing, Materials Processing and Device quality Testing

Seasoned technical leader across fab semiconductor & packaging, lean six sigma, high volume manufacturing processes, optical devices and sensors, photonics PV generators-batteries, self-power IOT, and materials interactions in electronics. Experience ranging from early stage start-up R&D concept prototypes to running manufacturing volume and driving business organizations units. Experienced with semiconductor equipment strategy to the executive office including CEO, CTO, and Board. Strengths in driving strategy and road map based on innovative technologies and turning them into sustained and profitable manufacturing businesses. Enjoy working with entrepreneurs, suppliers and helping small startups get focused and moving forward quickly.

Bilingual in English and Spanish Ability to Read and Write in Italian, Portuguese, and French

Areas of Strength:

Medical/Semiconductor Devices

SCRUM/Lean Six Sigma (DMAIC)

FDA, ISO & Corporate Quality

Problem Solving

EHS, ROHs, Environment Standards

Wafer & Packaging Fabrication

Statistics/Data Analysis

Suppliers Quality & Test

SAP/SPC/Automation Control (CCB)

Thin Films (CVD, PVD, ECh)

MFMEA/DFMEA/PFMEA

PCB/PWB Packaging

Tooling & Equipment Design (OEMs)

NPI Process Readiness (BOM)

Thermo-Mechanical-Chemical Modeling

Design for Manufacturability (DFM)

Lab Testing SEM, TEM, DTA, TGA, Auger, XPS, UPS, FTIR, DSC, TMA, SPS

Contracts & Funding Proposals

Stakeholder Communication (SIPOC)

Cross-Functional Team Leadership

Customers/Sales/Marketing

Team Results, Coaching & Mentor

Company Compliances & Policies

Intellectual Property

Innovation & Entrepreneurship

Team Manager Performance

Professional Overview

M&T Solutions Inc (SBIR Ph1), San Diego, CA 2015-Actual

Engineering Manager PM CTO (A Start-up)

Lead of technical start-up and manager of 16 employees to lead operations, business, quality, contracts, sales, marketing and technical evaluations of nanomaterials & packaging of P-N diode semiconductors. Led customer hardware product design and asses R&D innovation team to low power battery technology fit for medical, IoT wearables and sensors for artificial intelligence industries. Follow all the FDA QSRs, ISO 13485 Design Control Procedures and ISO 14971. Wrote a SBIR Ph1 proposal and win a NSF grant. Designed a customer decision making process for critical supply chain of material assemblies via structured design, identified flow, manufacturing and metrology to successfully land a business. FMEA facility upgrades and NPI fit-up. Architected an automation technology to key handling packaging yield test equipment and worked with vendor in concert with sourcing to design handling product features, aggressively collect data and address data management decisions. Major wins: 20+ patents on R&D for vibration/piezoelectric, solar/PV, thermal/thermoelectric and RF/Electromagnetic areas. Led project management: $21.8M USD capital equipment expense, 1.5-year concept to completion with funding and proposal writing grants to NSF (SBIR Ph1), DoE and DoD.

Intel Corporation, Chandler AZ 2005 – 2015

Owner of design, development and release of next generation semiconductor packaging manufacturing equipment for new and existing suppliers of hardware, big data automation analysis and metrologies for labs and inline process. Oversee operations manufacturing meetings and lab thermo-electrical-chemical R&D. Managed 20+ PhDs by ensuring technical activities and customer targets fell within the specified operation targets. Managed engineering core competency and processing materials with materials lab characterization assessments of electrical, mechanical, chemical and thermal properties (0.5 B USD Capability Labs). Executed risk assessment, quality, materials modeling, experimental and process engineering to test new and existing technologies to assess most Silicon-package-socket failure analysis, materials interactions and corrosion reliability.

Test Product Materials Technologist LSSMBB (2013 – 2015)

Lead wafer single die testing equipment supplier evaluations in the Intel audit program to support the evaluation, selection, approval, and monitoring of suppliers and manufacturing partners. Lead by Lean Six Sigma, Kaizen, and Lean for over 30+ suppliers including 550+ employees, which included granting certification of 280+ as Green Belts. ROI of 29 M USD and cost savings calculated for product sales ~750 M USD. Conceptualized and drove new development of intellectual property including: 150+ Technical Reports, 75+ Patents, and 316+ Trade Secrets.

Fab Process Development Engineer LSSBB (2011 – 2013)

Leader of a dedicated Quality Manufacturing Operations team to provide Fab 14 nm direction in quality assurance within operations and other business functions, with a focus on preventative measures and continuous improvement of products, equipment and processes. Focused on NPI for wafer testing and yield. Also worked in Q&R areas including ceramic-thermal-structural-stress analysis on thermal head-socket predictive corrosion wear, repair and downtime of devices and manufacturing tooling. Introduced SolidWorks FEA & thermodynamic models to predict materials behaviors and FMEA to eliminate waste and time to repair and as well as lean external suppliers towards new heater-galvanic protection materials. This resulted in improved tool article delivery by five weeks and cost reduction of $1.86M USD per year.

Q&R Product Engineer LSSGB (2009 – 2011)

Partner with Product Development and Advanced Operations to define equipment design requirements and develop mapping of manufacturing processes and risk assessment of high-volume ramp. Leader of risk-management activities in the new product development process to ensure the highest level of product and process quality. Testing technologies research to focus on EOL quality and developing silicon photonic package technologies for data center and enterprise applications. Team was first in the world to demonstrate a tester for many optical building blocks (modulators, lasers, detectors) working in silicon at data rates >40Gbps.

Platform Packaging Integrator (2007–2009)

Developed products, materials, processes and equipment supply for projects of moderate complexity. Studied effects of PCB mechanical interactions/loading during placement test induced by thermal changes, vibration response and mechanical loadings. These resulted to evaluate new designs in both static and dynamic states for a new OEM equipment development. This derived supply chain to reduce waste for 1st article delivery by checking 1st time quality and saving cost of 20.5+ M USD.

Packaging Module Integrator (2005– 2007)

Champion efforts to comply with POR configurations for all safety, quality and operational documentation. Reduced assembly factory excursions by approximately 50%, and met development cost goals by 99.9 % by emphasizing inline data commonalities using SQL-Jump Scripts for Engineering Control. Launched lean test manufacturing assessed design drawings, lead times, first time quality, floor performance by delivering a control system to re-use preexisting engineering technologies. Cost reduction was $601.2 M USD/year.

GE Montupet S.A; Paris, France 2004-2005 2 2004-2005

R&D Scientist, Aerospace

Responsible for materials for new platforms to compensate demands on engine production that will require higher degrees, speed and efficiency. Innovated processes development using sophisticated automated and statistical control to rapidly produce complex, large-scale composite parts for future aircraft engine platforms. These processes involve the use of large robotic arms with more than a dozen spools spinning out fiber in precise, predetermined patterns to form a part. I co-authored papers on new technologies of advanced ceramic-composite materials wetting, adhesion and corrosion of interfaces e.g. Al2O3-Al, AlON-Al, SiC-Ti, BN-Al, Al203-Ti. Today those materials and processes are being used in an increasing number of products where their unique combination of properties such as high strength, low density and fatigue fracture resistance.

Education & Professional Development

Innovation and Entrepreneurship, MBA, Stanford University

PhD in Materials Science and Engineering, University of Alabama

MSc in Physico-Chemical Metallurgy, IPN

BSc in Metallurgy, IPN

Awards and Recognition

National Investigator of NSF-Level 1 (2014)

Dale Carnegie Leadership to Success (2014)

Intel TMG Excellence Award (2013)

National Polytechnic Institute: Distinguished Lecturer and Visitor (2013)

Intel Quality Award (2012)

Master Black Belt Lean Six Sigma Certification, Arizona State University (2012)

Scrum Master Certification, Intel Corporation (2012)

Black Belt Lean Six Sigma Certification, Intel Corporation (2010)

Professional Affiliations

Member & Editor, The American Ceramic Society (ACERS)

Member & Editor, IEEE Power and Energy Society

Publications (40+)

Joaquin Aguilar, Acta Materialia, Vol. 56, pp 2476-2487, 2008

Joaquin Aguilar, J. Nanomaterials, Art. l 629185, pp 1-12, 2008

Joaquin Aguilar, Metallurgical and Materials Transaction B, Vol 40B, pp. 377, 2009.

Joaquin Aguilar, Metallurgical and Materials Transaction A, Vol 41A, 2010.

Joaquin Aguilar, Metallurgical and Materials Transaction B, Volume 42, Issue 2, pp.412-423, 2011.

Joaquin Aguilar, Metallurgical and Materials Transaction A, Volume 44, Issue 5, pp 2299-2306, 2013

Joaquin Aguilar, Metallurgical and Materials Transaction A, Volume 45A, pp 3110-3115, 2014

Joaquin Aguilar, J. Metall and Mat Trans A. Volume 47, Issue 10, pp 4941–4950, 2016,

Joaquín Aguilar, Materials Research, On-line version ISSN 1980-5373, 2016

Joaquin Aguilar, J. Rare Earths, Volume 34, Issue 4, Pages 420–427, 2016

Joaquin Aguilar, Materials Characterization, Volume 120, Pages 168-174, 2016

Joaquin Aguilar, Journal of Alloys and Compounds, Vol. 705, Pages 1-8, 2017.

Joaquin Aguilar, Metals and Materials International, Vol. 212, Pages 1-10, 2017.

Software Skills

Languages/environments: FORTRAN, C/C++, PL/SQL, Ansys Icepak/Fluent, SolidWorks FEA, Matlab, Simulink, Python, Java, HTML

Operating Systems: DOS, LINUX, Mac and Windows

Databases: Oracle and Access,

Statistics: R, Minitab, JMP

Desktop applications: MS Office, S 360, AutoCAD, LabView

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