ROSALINA L. MANERA

**** ******** *** ******** ** 95035

ac0u4s@r.postjobfree.com

CELL 408-***-****

HOME 408-***-****

Summary

Manufacturing Process Technician with over 15 years of experienced leading and driving results in a fast faced manufacturing environment with exceptional skills in organizing tasks efficiently, manage time, quickly undertake new tasks, learn effectively, and have the ability to easily collaborate

May 2016- Present SUNPOWER CORP

R&D Tech

. Work with Engr's, process wafer for Solar with the process instructions of the

Engr's.

. Etch, MRL, SierraTherm, Print(Shmids), PCVD, Trion and all metrology

Nov 02,2015- March 2016 ALTA DEVICE

. PECVD, PVD, Front and Backend Process,

Wafer Metrology, measure wafer after process, solar Cells Metrology using Ellipsometer

Jan 14,2015- Oct 2016 INFINERA

Wet Tech

. Pour Acid, and mix acids/chemicals Process Apt 1 and 2 etching wafers

. Clean and strip wafers using chemicals such as HF, H2O2, HCL, HBR, H2SO4 etc. and some wafer metrology.

March 2014-Sept 2,2014 JDSU.

Manufacturing Tech(Photo)

. Certified in Photo Process - Coating, Photo Masking, Develop Inspect, Aligning, DUV(IPC) Posbake, CD SEM Measurement( Nikon), Gamma-Develop.

. Wet Etch

. Also cross trained in Die Fab Process

June 2013-Jan 2014. ENOVIX

Manufacturing Tech

•. Plating, Etching Cu, Cathode, Nickel, Ion Lithium

•. Mixing solutions/Chemicals

•. Inspection, Measuring thickness, Coating

•. Resist Apply, Expose Develop

Nov 2012-April 2013(Temp. THAT CORPORATION

Assembly tech

Oct 2008-July 25 2012 FUJIFILM DIMATIX

Process Tech 3

*. Manage in manufacturing of micro electro mechanical processes of piezoelectricity actuated inkjet print head products. Responsibility include wafer processing in photo,bonding, sputtering and thermal furnaces in clean room environment. Performed various task within manufacturing include carrying out instruction for lots disposition, inspection, metrology measurement and quality of the product. Creative capacity to develop new ways to do things better, cheaper, faster in alignment with the aggressiveFujifilm Dimatix approach to revolutionary product development. Strong ability to work and communicate effectively within a team and person manufacturing and engineering organization

•. Electro Mechanical Assemly, know to read Blue Prints, work and Inspect PC Board after SMT Process. And after bake

•. Use of Auto and Manual tools

•. Collect and gather Data

Certified in Bonding process include Raw Coupon, and production (Silicon)

Wafers, Triple Stack Bond, Flip, and Cleaning wafers,work in the High Powered Microscope, Inspect wafer and measure alignment using Karl Seuss Align,

Certified in running tools like :Gamma, Filmetrics, Metroline(asher), TelTrack for coating wafers, Karl Seuss Aligner, WykoTamar

Certified in Sputter using Oerlikon – NiCr, Au, TiW Metal

Certified in Wet Etch: NiCr Strip, NiCr Spray, Strip Gold(Au Etch),

Calibrate and Measure Equipment

Trained in Diffusion using VDF – process Anneal, Oxide Screen Ox

Collect and gather data using MES, Computer litirate

Nov 2006-Apr2008 DIELECTRIC SOLUTION INC.

Process Technician

Certified in Moat Etch, Strasbough Grinder, worked and inspect wafers and small parts using high powered Microscope.

Certified in Operating Reactor for EPI Deposition and

Growing Poly,Mechanical Inspection and Final Inspection. Read and understand Manufacturing Drawing,

Cross Trained to Plating.

Engineering Assistant, Assist in Research and Development

Certified in all Wafer Metrology.

Collect and gather Data, Computer Litirate

May 2005-Nov 2006 VISHAY CORPORATION

Fab Technician Specialists

Coating, Photo Masking, Develop Inspect, Aligning, DUV, Posbake

Masking Etch using Chemicals, Exposed in some Chemicals for Etch . Wafer Metrology Equipments: Ellipsometer(Alloy), Nano,CDE, FSI, Thermawave, Surfscan, ADE, Inspex (for particles use)

Certified in Wet and Dry Etch: HF, Nitride, Contacts, Pad, Via and Metals. Dry Etch: Gasonic,AMAT, PEP, FSN, Plasma Alliance.

Collect and Process data using Promis.

Jan 2002-Oct 2006 ANALOG DEVICES

Fab Specialists

Certified In all General Diffusion Equipments: Bruce, Tempress, Vertical, FSI Cleaning Machine.

Wafer Metrology Measurements: Thermawave, Surfscan, Nano, CDE, Ellipsometer

Certified in Wet Etch: Sulfuric, HF, Pad Oxide, Poly Back Etching Slope, BOE, Metal Etch, Via Nitride Etch, Aqua Regia(Platinum Etch), EKC Etch, Descum and Final Inspection to High Powered Microscope.

Certified in Dry Etching: AMAT, Fussion, Gasonic, PEP, FSN, Plasma Alliance, Certified to run EPI Reactors such as Gemini and LPE.

Certified in Photo Masking: Coating Aligning, Develop Inspect, KLA, CD Sem, DUV Posbake.

Collect and Gather Data using Promis.

July 1998-Dec 2000 ROHM DEVICE

Fab Operator

Certified in Photo Masking: Develop Inspect, DUV, Posbake and Align

Certified in Coating using Solitec and Strasbaugh for Back and Final Polish, Wafer Measurements to measure Particles and Thickness of Wafers, ADE

Cross trained in assembly inspection small part and finish product.

Certified in General Diffusion. Also Train Test Area.

Nov 1997-May 1998 NOEL TECHNOLOGY

Fab Operator

Clean and Etch All Wafers using HF1:1, Sulfuric for Cleaning Resist of the Wafers, Ultra Clean, Slopes, BOE, Oxide Etch, Resist Strip, Moat Etching, Platimum Etch TiWn and Gold Etching, Measure wafer before and after Etch.

General Diffusion, EPI, Thin Film and Final Inspection.

Sept 1996-Nov 1997 KULICKE AND SOFFA

Fab Operator

Job Includes Photoresists Application, mask align, Develop Inspect, Final Wet Etch, Sulfuric and resist strip clean, Certified in Diffusion Operations as well as profiling tubes or Furnaces.

Certified in all wafer measurements Equipments.

May 1994-Aug1996 V L S I

Etch Dry Operator

Certified in AMAT,Metal Etch, Gasonic, Asher, FSN, PEP, FSI, Poly Nitride, Inspection

Final Inspection, Develop Inspect,Collect/gather data using Promis

May 1993-Feb 1994 KOMAG CORP.

Lube Machine Operator

Lube machine Disk Processor, Coating, Plating and Sputter, Also operate Clean Wipe Machine, In process and final Inspector certified

SKILLS AND ABILITIES :

Work in a Clean room environment for over 10 years, Work well independently and reliably, organized, capable of handling responsibilities in confident manner as part of the team. Able to assess and priority work related task.

Familiar with manufacturing Process Instruction and

MSDS

Computer literate

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