Sr. 3D CAD Design Engineer
Resume:
MICHAEL R. DYE, CID+
**** ****** **** ********, ******** 61109
815-***-**** ********@*****.***
Sr. 3D CAD Design Engineer
Sr. Electronic Packaging Engineer,
Sr. PCB Layout Designer
Results-driven IPC Certified Interconnect Designer with a proven track record and years of experience designing printed circuit boards for the electronic controls of military and commercial aircraft. Skilled at utilizing computer-aided 2D and 3D modeling systems to facilitate the creation of Flex, Rigid / Flex and Embedded Passive PCBs for high-performance electronic products.
Skilled at designing the entire electronics package including 3d Modeling and package design for high vibration environments. Leverage superior communication skills to assist production teams with identifying and resolving PCB assembly issues. Oversee entire project lifecycles to ensure the on time delivery of high-quality components that meet and exceed IPC Class 3 specifications.
AREAS OF EXPERTISE
PCB Design & Layout Schematic Capture & Parts Library Creation Electronic Packaging Design
3D Modeling Project Life cycle Management Requirements Documentation Regulatory Compliance Quality Assurance Production Support Customer Service Rigid/Flex & Embedded Passives Technology
PRODUCT DESIGN EXPERIENCE
LOCKHEED MARTIN SPACE SYSTEMS,
Littleton, Co Dec 2015 to Nov 2016
Electronic Packaging Engineer
Using Creo2 to create 3D models and Detailed Drawings for the GPS III and Mars Manned flight capsule Electronic Control Enclosures
ARNOLD-HANAFIN CONTRACTED TO UTC AEROSPACE, GROUND SUPPORT SYSTEMS,
Rockford, IL March 2013 to August 2015
Electronic Packaging Engineer
Using Unigraphics NX, Design and Detail Electronic Control Enclosures for the LMSTAR Computer controlled Unit Test System used for the F-35 including the ITA’s Document All Cabling and Cooling Lines and the Coolant Supply Cart for both air and liquid coolants. Detail repair tools used in the field and repair stations.
MICHAEL R. DYE, CID+
3580 Baxter Road Rockford, Illinois 61109
815-***-**** ********@*****.***
ARNOLD-HANAFIN CONTRACTED TO UTC AEROSPACE, SPACE SYSTEMS,
Rockford, IL August 2012 to March 2013
Electronic Packaging Engineer
Design and Detail Electronic Control Enclosures for Space Flight using Unigraphics NX, PROE and Solid Edge, enter and update Customer Specs in DOORS. Create and update XCEL spreadsheet’s used for PCB parts area study’s.
CONTRACTED TO WILCOX ENGINEERING, Rockford, IL May 2012 to August 2012
Senior Designer
Design and Detail Automated Assembly Machines using Solidworks 2012
AEROTEK CONTRACTED TO DANFOSS, Loves Park, IL April 2011 to May 2012
Senior Designer
Layout complex high power PCB's using Zuken CR5000 schematic capture and PCB layout tools.
Work in the Prototype Test Lab setting up, designing troubleshooting and overseeing the testing of high power 3 Phase Motor Drives. Understanding the results as well as writing the UL Test Reports.
AEROTEK CONTRACT TO EMTEC, Milwaukee, WI Nov 2010 to Apr 2011
Senior Designer
Contracted to Layout LED driver and power supply IPC Class 3 PCB's using Orcad
ESTERLINE CONTROL SYSTEMS, Rockford, Illinois 2004-2009
Senior Designer – BVR Technologies
Collaborated with 6 electronic engineers to design PCB layouts for the electronic controls – including smart actuators, data concentrator units and cockpit gauges – of military and commercial aircraft. Oversaw the development of schematic diagrams and electronic packaging designs to facilitate the creation of Flex, Rigid / Flex and Embedded Passive PCBs. Served as BVR Technologies' sole PCB Layout Specialist tasked with placing and mounting all components onto electrical boards. Leveraged PCB design software – including Pads PCB, Pads Logic, DxDesigner and Schematic Capture – in addition to 3D Computer-Aided Design (CAD) systems – such as SolidWorks and CircuitWorks – to layout and modify circuit patterns on boards. Devised and implemented PCB design and layout procedures to ensure compliance with the aerospace industry's AS9100 quality standards. Administered and maintained the Standard Parts Library on BVR's PLM database.
Operational Highlights:
●Created, maintained and grew BVR's Standard Parts Library to include 1.5K PCB parts, which comply with IPC Class 3 requirements for high performance electronic products.
●Implemented Design for DFM methods to enhance the soldering ability of PCBs and create layouts compatible with automated testing equipment.
MICHAEL R. DYE, CID+
3580 Baxter Road Rockford, Illinois 61109
815-***-**** ********@*****.***
BARBER COLMAN AEROSPACE, Loves Park, Illinois 1987 to 2004
Senior Designer
Functioned as Barber Colman's only PCB Layout Specialist. Worked with up to 9 electrical engineers on the creation of PCB designs for temperature controllers used in military and commercial aircraft. Developed all schematic diagrams and electronic packaging designs to streamline the assembly of Flex and Rigid / Flex PCBs. Utilized a wide range of 3D CAD systems – including IGDS PCB Layout and Schematic Capture, VeriBest Designer NT, Aceplus, DxDesigner Schematic Capture, MicroStation 3D Drawing, SolidWorks and CircuitWorks – to model the outline of the PCB layout, circuit patterns and components on boards. Updated and maintained the PCB Parts Library.
Operational Highlights:
●Created all PCB designs and documentation for the C17-10 Channel Window De-Ice Controller; F18 Inferred Camera Compartment Temperature Sensor & Heating Element Controller; A10 Windshield De-Fog & De-Ice Controller; MD80 Windshield De-Fog & De-Ice Controller; Apache Helicopter Windshield De-fog Controller; and C17 Magnetic Bearing Controller for the HVAC Cabin Temperature Turbine.●Created Barber Colman's PCB Parts Library using Integraph's PCB layout software for the VAX 780 mainframe operating on UNIX; ensured compliance with MIL-STD-275 Class 3 specifications.
●Leveraged superior management skills to set priorities for ensuring the on time completion of multiple projects happening simultaneously.
●Successfully designed PCBs without the aid of any CAD systems upon joining Barber Colman Aerospace.
●Quickly climbed up the corporate ladder from Junior Draftsman to Senior Designer within only 4 years.
MICHAEL R. DYE, CID+
3580 Baxter Road Rockford, Illinois 61109
815-***-**** ********@*****.***
Career Note: Additional employment history includes serving as Sales Drawing Draftsman at BST of Rockford, Electrical Draftsman at Martin Automatic Inc., Central Office Equipment Installer at Automatic Electric Inc. as well as Mechanic & Stock Clerk at Sears Roebuck. Details provided upon request.
EDUCATION & TRAINING
SolidWorks Modeling Basic & Advanced Courses Digital Logic Electronic Business Writing Skills
Geometric Dimensioning & Tolerance per ANSI Y14.5 IPC Designer Course in HDI Layout Methods
Statistical Process Control IPC Designers Council Seminar on Flex Circuit Design
System EMC Compliance via PCB Design IPC Designer Symposium
AS9100 Internal Auditor Training
CERTIFICATIONS
Certified Interconnect Designer (CID) – IPC Designers Council, Northbrook, Illinois
CID+ Advanced Certification for PWB Design per IPC-2221 & IPC-2222
CID. Certification for PWB Design per IPC-2221 & IPC-2222
AFFILIATIONS
Member, IPC Designers Council
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