David Berry

** ****** ***** **.

Christiansburg, Virginia 24073

540-***-**** / ac0q15@r.postjobfree.com

Education

Ph.D. Materials Science and Engineering August 2014 Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, Virginia Dissertation: Design, Fabrication, and Reliability of Double-side Cooled Power Modules with Sintered Silver Interconnection for High-temperature Applications. M.S. Materials Science and Engineering December 2010 Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, Virginia Thesis: Characterization of Laminated Magnetoelectric Vector Magnetometers to Assess Feasibility for Multi-Axis Gradiometer Configurations.

B.S. Materials Science and Engineering, December 2006 Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, Virginia A.A.S in Industrial Instrumentation, May 1994

New River Community College, Dublin, Virginia

A.A.S in Electrical Science, May 1993

New River Community College, Dublin, Virginia

Experience

Senior Project Manager New Technologies Team 2014 – present Prime Photonics, LC

Blacksburg, VA.

Principal Investigator for NASA SBIR Phase I NNX14CA39P Wireless Surface Acoustic Wave Gradient Sensor. This project required design, fabrication and characterization of surface acoustic wave sensors on quartz substrates for embedding into refractory lining of NASA reentry vehicles. Sensor interrogation was wireless removing the requirement to penetrate shuttle linings. Final sensors utilized changes in sensor resonant to accurately predict sensor temperature allowing multiple sensors to calculate thermal gradient based on depth of deployment. Phase I sensors were limited by substrate and metallization temperature requirements warranting implementation of lithium niobate substrates and high temperature glass encapsulation for higher temperature regimes.

Principal Investigator for DOE SBIR Phase I DE-SC0013148 Radiation Resistant Fiber Optic Magnetic Field Sensor. This project required optical design of a magnetic field sensor utilizing a faraday rotator. A laser interrogated faraday rotator was placed into a magnetic field and the polarization state calibrated to determine vector field intensity. Optical components were chosen based on resistance to radiation and assembled for radiation testing. Magnetic field characterization was performed with pulsed fields of 2T and AC fields of several millitesla using equipment fabricated in-house. Phase II work was proposed to better understand component degradation as a function of both neutron fluence and gamma dose.

Integral part of NASA Phase II SBIR NNX13CG41C for the development of high permeability metallic glass cores for fluxgate sensor applications. The project required magnetic alloy optimization with primary consideration given to minimizing magnetostriction and coercivity while maximizing permeability. Optimized alloys were fabricated, consolidated and characterized in a systematic manner. Prime partnered with Virginia Tech for powder processing using mechanical alloying techniques.

Part of team for further development of miniature optical assemblies for high-velocity projectiles to determine height-of-burst and seeking assemblies that utilized four quadrant photodetectors for altering projectile flight path. Both assemblies were hardened to survive the high acceleration launch environment.

Principal Investigator and Co-inventor on utility patent for a class of composite materials designed for adjustment of the permeability, permittivity and their respective anisotropies for wearable antennas, complex antenna geometries and radome structures. The composite material would allow for control of localized EM properties that can be translated to 3D printing techniques offering the opportunity to make intricate physical structures with intricate EM signatures that are independent from each other.

Work on piezoelectrics and piezoelectric materials includes energy harvesting techniques using vibrating beam structures in varying configurations. Piezoelectric transducers were also an integral part of a patent-pending nondestructive inspection technique still in development. Project Manager/Packaging Engineer 2011 –2014

NBE Technologies LLC

Blacksburg, VA.

Principal Investigator for National Science Foundation Phase I SBIR: PowERazor: an Innovative Electronic Packaging Technology for Manufacturing High-reliability, High-density Power Electronics Modules. Feasibility study for commercialization of a three dimensional power electronics package enabled by utilizing patent pending compliant interface with nanosilver paste, developed by NBE Technologies, LLC.

Projects primarily for integration of proprietary nanosilver paste for electronics packaging. Paste chemistry, manufacturing, processing flow and application specific processing constraints are researched to develop a robust process for customers.

Adjunct Faculty Instructor 2010 – 2014

New River Community College

Dublin, VA.

Instructor for IND 113-114 Materials and Processes of Industry I-II – Introduction to material properties and basic selection techniques for use in design.

Instructor for ETR 113-114 D.C and A.C. Fundamentals I - First course for electrical science and instrumentation students covering the fundamentals of DC and AC circuit analysis.

Instructor for ETR 203-41 Electronic Devices – Course content further develops understanding of diodes and transistor and basic circuit topologies.

Graduate Research Assistant 2011 – 2014

Materials Science and Engineering Department (MSE)/ Center for Power Electronics (CPES), Virginia Tech

Fellowship recipient for Mitsubishi, a member of the High Density Integration (HDI) Consortium in the Center for Power Electronics (CPES). The project is to investigate the packaging of silicon carbide devices using advanced active metal brazed Si3N4 substrates and sintered silver interconnection for Mitsubishi High Density Consortium Fellowship in Center for Power Electronics (CPES).

Design and construction of power modules utilizing sintered silver device connection as a more reliable replacement for lead-free solder alloys. Research on processing parameters (time, temperatures and pressures) and redesign of fabrication fixtures was conducted to determine effects on density, microstructure and ultimately reliability of device attachment.

Design of new power module packages for increasing thermal management. New designs require knowledge of current substrate and device technologies and the capabilities of each. Combinations of various components into functional packages also necessitate modeling of thermo mechanical stresses using Ansys finite element analysis software.

Constructed high power double pulse and DC power stage test beds explicitly for characterization of power modules using nanosilver sintering.

Graduate Research Assistant 2009-2011

Materials Science and Engineering Department (MSE), Virginia Tech

Project required magnetoelectric (ME) sensor assembly and evaluation. Sensors are assembled by bonding various piezoelectric substrates to magnetic glass tapes. Responsible for the development of a robust and repeatable assembly process and design of fixtures for characterizing sensor performance.

Investigated the proximity effects of sensor-sensor interaction for assessing the feasibility of multi-axis magnetoelectric sensor arrays which can be tuned for use in magnetic anomaly detection. Senior Engineer 2010-2011

Passive Sensors Unlimited

Blacksburg, VA

Oversee process design, quality control and manufacturing of laminated magnetoelectric sensors and multi-axis sensor arrays. The bulk of this project required the design and fabrication of three axis enclosures which minimize vibration, and magnetic noise contributions. Lab Facilities Manager 2008 – 2009

Institute for Critical Technology and Applied Science (ICTAS), Virginia Tech

Diverse knowledge of advanced laboratory equipment, the resources required for operation and any safety hazards involved with the operation. This position worked closely with multi-disciplinary principal investigators and oversaw the Nanoscale Characterization and Fabrication Laboratory (NCFL). Publications (published, forthcoming and under review)

Li, M., Berry, D., Das, J., Gray, D., Li, J., & Viehland, D. (2011). Enhanced Sensitivity and Reduced Noise Floor in Magnetoelectric Laminate Sensors by an Improved Lamination Process. Journal of the American Ceramic Society, 94(11), 3738-3741.

Shen, Y., McLaughlin, K. L., Gao, J., Gray, D., Shen, L., Wang, Y., Li, M., Berry, D., Li, J., & Viehland, D.

(2012). AC magnetic dipole localization by a magnetoelectric sensor. Smart Materials and Structures, 21(6), 065007.

Viswan, R., Gray, D., Wang, Y., Li, Y., Berry, D., Li, J., & Viehland, D. (2011). Strong magnetoelectric coupling in highly oriented ZnO films deposited on Metglas substrates. physica status solidi (RRL) – Rapid

Research Letters, 5(10-11), 391-393.

Wang, Y., Gray, D., Berry, D., Gao, J., Li, J., Viehland, D., & Luo, H. (2011). Equivalent magnetic noise in magnetoelectric Metglas/Pb(Mg1/3Nb2/3)O3-PbTiO3 laminate composites. physica status solidi (RRL) – Rapid Research Letters, 5(7), 232-234.

Wang, Y., Gray, D., Berry, D., Gao, J., Li, M., Li, J., & Viehland, D. (2011). An Extremely Low Equivalent Magnetic Noise Magnetoelectric Sensor. ADVANCED MATERIALS, 23(35), 4111-4114.

Wang, Y., Gray, D., Berry, D., Li, J., & Viehland, D. (2012). Self-amplified magnetoelectric properties in a dumbbell-shaped magnetostrictive/piezoelectric composite. Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on, 59(5), 859-862.

Wang, Y., Gray, D., Berry, D., Li, M., Gao, J., Li, J., & Viehland, D. (2012). Influence of interfacial bonding condition on magnetoelectric properties in piezofiber/Metglas heterostructures. Journal of Alloys and Compounds, 513(0), 242-244.

Wang, Y., Gray, D., Gao, J., Berry, D., Li, M., Li, J., Viehland, D., & Luo, H. (2012). Improvement of magnetoelectric properties in Metglas/Pb(Mg1/3Nb2/3)O3–PbTiO3 laminates by poling optimization. Journal of Alloys and Compounds, 519(0), 1-3.

Zheng, H., Berry, D., Calata, J. N., Ngo, K. D. T., Luo, S., & Lu, G. Q. (2013). Low-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste. Components, Packaging and Manufacturing Technology, IEEE Transactions on, 3(6), 915-922.

H. Zheng, D. Berry, K. D. T. Ngo, and G.-Q. Lu, “Chip-Bonding on Copper by Pressureless Sintering of Nanosilver Paste Under Controlled Atmosphere,” IEEE Trans. Components, Packag. Manuf. Technol., vol. 4, no. 3, pp. 377–384, 2014.

A. Fukumoto, D. Berry, K. D. T. Ngo, and G.-Q. Lu, “Effects of Extreme Temperature Swings on Silicon Nitride Active Metal Brazing Substrates,” IEEE Trans. Device Mater. Reliab., vol. 14, no. 2, pp. 751–756, 2014.

D. Berry, “Characterization of Laminated Magnetoelectric Vector Magnetometers to Assess Feasibility for Multi-Axis Gradiometer Configurations,” MS Thesis, Virginia Tech, 2010

D. Berry and G. Q. Lu, “Thermal Characterization of Planar High Temperature Power Module Packages with Sintered Nanosilver Interconnection,” IEEE Microelectron. Reliab. In process.

I. Khalfallah, A. Aning, J. Chen, D. Gray, D. Berry, “The Effect of Sintering Temperature on the Microstructure of Fe-1.4 wt.% C Alloy Prepared by Mechanical Alloying,” Sintering and Related Powder Processing Science & Technologies Symposium. Presented at Materials Science & Technology 2016. Presentations

High Density Mini-Consortium Review Presentation September 2013 Denver CO. Presentation title: Packaging and Characterization of Planar Power Modules with Sintered Nanosilver Interconnection.

Poster Presentation. PCIM Europe May 2013 Nuremburg Germany. Poster title: Fabrication of a Double-side Cooled, High Temperature Power Module with Sintered Nanosilver Interconnect for Automotive Applications.

Poster Presentation. CPES Annual Conference April 2013 Blacksburg, VA. Poster title: Fabrication of a Double-side Cooled, High Temperature Power Module with Sintered Nanosilver Interconnect for Automotive Applications.

Poster Presentation. DARPA Program Review October 2010 Newport, RI. Poster title: Improvements in Composite Magnetoelectric Sensor Assembly.

Professional Organizations

The American Ceramic Society (ACerS)

Association for Iron and Steel Technology

(AIST)

The Materials Information Society (ASM)

The Minerals, Metals and Materials Society

(TMS)

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