Manager Quality

GENY GAO, PHD, MBA

*******@*****.***

Phone 510-***-****

PROFILE

• Dedicated and result-orientated Quality/Reliability specialist.

• Proved expertise in new product introduction prototype, product validation and management.

• Solid knowledge in Device Physics, Opto-Electronics, Materials, Packaging, and ALL IC’s.

• Navigated (but not limited) d/pFMEA, MTBF prediction, qualification, characterization, FA, QC, QA, SPC, DOE, MSA, KPI, DMAIC, Gage R&R, DFx, PLC, PLM, and product specifications.

• Hands-on and skilled in ANY Failure Analysis tools, Reliability Tests, and hardware handlings.

• Holding ISO 9001:2015/13xxx/14xxx, 21CFR, RoHS, WEEE, UI, ESD, IPC-6xx, Document Control certifications, JIRA, and Six Sigma Green Belt.

• Strong background in building, managing, motivating team, and consistently exceed expectations.

• Skilled at leverage cutting-edge technologies, apply methodologies to make under-performing operating efficiency in system level, and project management.

• Support revenue growth, reduce cost metrics, and maximize profitability.

• Interface and communication capabilities to manage suppliers and satisfy customers.

HIGHLIGHT ACCOMPLISHMENTS

PNY Technologies, Sr. Manager, Reliability and Quality System May 2015 – Present

• Characterized and debugged key components (NAND, DRAM, Controller, etc.) and created RDT and ORT processes on SSD, NVMe, and computer server product lines.

• Applied JEDEC and Telcordia standards and predicted MTBF of all products and built roadmap.

• Detected failure mode/rate and root cause, implemented CAPA, improved the field performance, reduced RMA, and achieved customer’s requirements of product quality and reliability.

• Validated design, managed product, drove vendor’s improvement, and assigned SCAR.

EMC Corporation, Quality and Reliability Manager Jan 2013 – Apr 2015

• Set up goals, developed strategies, and reduced ARR and AFR on core products.

• Established NVRAM, RF, and PCB qualification flow, developed hardware, software, firmware, and thermal test requirements as well as HTOL, HALT/HASS.

• Provided d/pFMEA and risk analysis to design team during NPI.

• Adopted Weibull Analysis, JMP, Tableau built reliability blocks, modeling, and analysis.

• Coordinated and drove cross-functional team, designed incoming inspection flow, investigated field returns, and generated effective FA8D reports, ECO, SCM, and SCAR.

• Published white paper and technical notes for corporate.

• Helped Sales team to calculate warranty cost.

Calmar Laser, Quality Assurance Manager, Sunnyvale, CA Jan 2012 – Dec 2012

• Created Corporate Quality manual and enabled company becoming ISO certified business.

• Conducted Internal Audit and provided corrective/preventive action plan for product quality improvement.

• Enabled corporate receiving ISO 9001:2008 Certificate.

Tomorrow’s Energy, Founder and Member of Management Jan 2011 – Dec 2011

• Researched new type of energy resources especially in re0use and re-cycle.

• Completed theoretical calculation and filed patent.

• Designed and manufactured prototype by using RF for heat collection and tested efficiency.

3PAR INC., Product Quality/Reliability Manager, Fremont, CA Dec 2007 –Dec 2010

• Built up Quality/Reliability team and Quality Management System (QMS), applied SPC and DOE (JMP), DFx increased product yield 30% more, developed quality standards, quality database, and qualified suppliers.

• Characterized three (3) generation of server systems, transferred new product to off shore for volume, and successfully managed the products from launch to wear out cycle.

• Lead Product Sustaining Team and focused on RMA and FA, analyzing root cause, provide corrective action, solved customer issues, published FA8D Reports, and documented error code.

• Designed test bench, plans, and procedures, created test programs and performed debug on HDDs and extracted key data to validate quality of performance in accordance with specifications.

• Supported Sales Team, understood customers’ needs and selected correct storage solutions from RAID levels (0 – 10) and DAS, NAS, SAN, SATA, FC, iSCSI, SaaS, and NVM.

INTEL CORPORATION, OPD, Q/R Staff Engineer, Fremont, CA Dec 2004 – Dec 2007

• Setup qualification processes and qualified large amount of commodity over 4,000+ (including digital, analog, mixed, and RF) for new printed circuit boards (PCB).

• Characterized Fiber Pull, Fiber Bent, and fiber attenuations during signal transition.

• Audited suppliers, built SCM team, maintaining BOM, and ensured testing from component level to system level.

• Managed Failure Analysis Laboratory and equipment purchasing. Supported FA on SFP, DWDM, Tunable Laser, TOSA/ROSA. 40Gb/s and 100Gb/s optical modulators, drivers, transceiver, receivers, amplifiers, RF, and 400Gb/s optical network.

• Instituted CAD, debug, DVT, EVT, PVT, MRB, KPI, and customer SKUs.

• Completed Cisco’s Level 1 and 2 qualification report and brought additional revenues.

• Monitored quality standards, yield, and training in overseas manufacturing lines.

NATIONAL SEMICONDUCTOR CORP., Program Manager, Santa Clara, CA Dec 1998 – Dec 2004

• Established a full reliability facility to support internal R&D Team in new product design and employed QC, QA, reliability principles in testing and final verification.

• Implemented Design for Manufacturing (DFM) and ensured it met new product test requirements.

• Designed test chips, printed circuit boards, load modules, fixtures, sockets, and heat spreads for ASIC (Analog, digital, MEMs, mixed signal, RF), GaAs and InP fabrication, and other products, achieving 100% product quality coverage on the test floor

• Developed, optimized, and wrote test plans, software, hardware, generated scripts, scheduled testing on test-chips, prototype, performed function test, structural test, integration test, regression test, Black/White Box testing, and large-scale enterprise software/appliances, verified debug results and increased 50% of yield and saved 80% of product cost and time.

• Built up an infrared laboratory, including detectors, MCT, IR cameras, thermal analysis, OBIRCH/EMMI systems, temperature testing equipment, probing systems, and automatic testing equipment (ATE) for failure localization on PFGA, CMOS (down to 45 nm), Bipolar, MEMS, Bio-wafer, Image sensors, and ASICs.

• Performed micro-probing, circuit analysis, RIE de-processing, cross sectioning, material analysis, and system troubling shooting.

• Decreased maintenance costs by 20% by negotiating equipment application support and services with vendors, improving supply chain relationships, and decreasing the test cycle.

• Obtained eight U.S. patents and published seven technical papers on reliability, quality assurance, failure analysis, and testing.

EDUCATION

MBA, General Management, San Jose University, San Jose, CA

PHD, Applied Physics, Oregon State University, Corvallis, OR

Master of Science, Electrical Engineering, Nankai University, China

Bachelor of Science, Apply Physics, Nankai University, China

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