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Project Technician

Location:
Hyderabad, AP, 500076, India
Posted:
June 29, 2013

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Resume:

MAHESH GALI

H.No:*-***; Mallapur, Nacharam, Uppal, Hyd-076

Mob: +91-988*******; E-mail: abzymv@r.postjobfree.com

Summary

12.6yrs of Experience in field of RF & Microwave Technology as a Technician. Experience

in soldering of SMT components up to 0402 size & working on all types of RF cable

assemblies.

Skill Set

o Lab Equipment: Network Analyzer, Programmable Cable Stripping Machine, High

Wattage Resistance Soldering, PIM (Passive inter modulation) test,

ESD Safe precautions Surface resistivity, Field Voltage, Static Neutralizer.

Software Tool

MS Office PowerPoint, Excel, Word, Windows NT/2000/XP

Training Programs

• Training in “Zero Defect Soldering” from Electronic Test Development Center

(STQC) Directorate.

• “Hardware Engineering” from HI-Tech Computers.

Education

• Pursuing Diploma Final year in Electronics & Communications Engineering

from CMJ University.

• National Council for Vocational Training (NCVT) (67.5%)

• Industrial Training Center, Tarnaka (Electronics Mechanic) (74.0%)

• SSC from Board of Secondary Education in 1997 (59.8%)

Work Experience

1. Assembler II & Lab Maintainer in Antenna Lab / RF Lab, Power Wave Tech.

R&D India Ltd, Hyderabad (July 2010 to Present)

Projects Handled

• Base Station Antennas

• New Lab Setup

Job Responsibilities

• Support engineering team members for soldering/reworks.

• Test setup for the new project teams.

• Purchase the accessories or lab requirements for the lab.

• Keep track of all sample components.

• Ensure ESD safe precautions are maintained in the lab.

• Support all Engineering teams for successful completion of their projects on time.

• PIM (Passive inter modulation) test for Antennas.

• 7/16 Connector’s Cable assembly

• Electro Mechanical support

2. Astra Microwave Products Ltd, Hyderabad (April 2005 to July 2010)

Projects Handled

• KU-Band Receiver (BDL, Hyderabad) Frequency

of operation: 12.7 to 13.5 GHz

• 10 Watt S- Band Transmitter (DRDL, Hyderabad)

Frequency of operation: 2255.5 MHz

• CAR1100 (Central Acquisition Radar) (LRDE, Bengaluru)

Frequency of operation: 3.1 to 3.5 GHz

• Beam Forming Receiver (LRDE, Bengaluru)

Frequency of operation: 3.1 to 3.5 GHz

• Naval Radio Proximity Fuse Transmitter (BDL, Hyderabad)

Frequency of operation: 12.7 to 13.5 GHz

• Automatic Weather Station (ISRO, Bengaluru)

• Mobile Satellite Service (ISRO, Bengaluru)

• Divya Dristi (DRDL, Hyderabad)

• CDMA Repeater (Reliance)

• Filters (BEL, Hyderabad)

• Built in Test Source (BEL, Bengaluru)

• Liquid Cool Multi Beam Antenna Array

Job Responsibilities

• Assembly on surface mount devices like PLCC’s, SOLITP’s, LCCC’s, ADSP,

CPLD ICs & Components of different packages like 1210, 1206, 0805, 0603, 0402.

• N-Type & BNC, TNC series Connector assembly for Antenna cables.

• RF Connector assembly

• SMA, SMB, SSMA RF Connectors assembly for system cables.

• Filters assembly.

• Installation of AWS & IMD towers.

• Wiring of sub-Modules & Integration.

• Cable forms for units.

• Involves in vibration & chamber testing.

• Having ability to planed interfacing projects

• Good Experience in soldering of DLI capacitors and small components less than

0201 under scope.

• Installation of AWS systems, Sensors& Antenna as per GPS at different sites of

ISRO.

3. LNT Electronics, Hyderabad (Oct 2003 to Apr2005)

Projects Handled

• Ellora Project, AC/DC Converter (BEL, Hyderabad)

• Samyukta Project, Power Supply (BEL, Hyderabad)

• High Voltage Power Supply - Mini TWT (BEL, Hyderabad)

• High Voltage Power Supply - High Band TWT (BEL, Hyderabad)

• Dual Command Transmitter (DRDO, Hyderabad)

Job Responsibilities

• Assembly of control cards,

• Quality Inspection of Printed Circuits Boards.

• Assembling, Routing and Wiring of Electronic Components.

• Preparation of BOM of Electronic Components.

• Involved in Potting of High Voltage Packaging like Circuits, Modules etc.

• Inspection of Components Link Resistors, Capacitors, Diodes, ICs, Relays.

• Interconnecting wiring of sub-modules in unit.

• Dealing with liaison officers of various Reputed Organizations at Bench test.

4. Technician in DOT-QA of Information Technology & Telecom Group Electronics

Corporation of India (ECIL) Limited, Hyderabad (December 1999 to April 2002)

Projects Handled

• MAX-XL, SBM-XL (Digital Switching System C-DOT Technology)

• Electronics Voting Machine (EVM)

• Cor DECT WLL (Wire Less in Local Loop) System

Job Responsibilities

• Verification of Dial Tones, announcement cards and testing of digital

Switching Systems.

• SBM-RAX, MAX-XL System integration, testing and Trouble Shooting.

• Preforming of various components like Micro Processors, Crystals & Tantalum

Capacitors.

• Integration testing of the control unit and Ballet unit.

• Assembly of DIU Cabinet.

• Wiring & Integration of Cor DECT WLL Systems.

• Soldering, Crimping & Wrapping of all type of MAX/WLL System cables.

Apprentice Trainee in the Transmitter Lab of Strategic Electronic R& D Centre

(SLRDC), Hindustan Aeronautics Limited (HAL), Hyderabad (April 2002 to April 2003)

Projects Handled

• State of Art Digital Communication Transceiver.

• SU-30 INCOM- 1215A Transceiver unit.

Job Responsibilities

• Carried out assembly of surface mount devices in the following packages:

PLCCs, QFPs, SOLITPs, LCCCs, ADSP, CPLD ICs.

• N-Type & BNC, TNC series RF Connector assembles for Antenna cables.

• SMA, SMB, SSMA RF Connectors assembly for system cables.

• Filter Power amplifier & Test JIG assembly.

• Cable forms & inter-connecting cable looms.

• Testing of Modules.

I hereby declare that the information furnished above is correct and true to the best of my

knowledge.

Place:

Date: Mahesh.Gali



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