Engineer Manufacturing

Jason Nipper

***** ********** ** **** *, Roscoe IL 61073

Mobile: 815-***-**** : abx2w4@r.postjobfree.com

Profile

Primarily focused on manufacturing processes in both OEM and EMS environments, I have 15 plus years’ experience working in mixed

technology facilities. I have extensive experience in soldering technologies which include both alloys and chemistries for reflow and wave

soldering processes. I have lead teams on global and localized scales. Although my primary focus has been in electronics manufacturing,

several of my positions have afforded the opportunity to gain working knowledge of die-casting, injection molding, and box builds. I am not

afraid to get my hands dirty and am comfortable in taking the lead on projects.

Areas of Expertise

New Product Introduction 8D's for Root Cause Analysis

Design for Manufacture Kaizen Teams

Printed Circuit Board Manufacturing Gauge R&R

Semiconductor Manufacturing Facility Layout

Soldering Processes (Selective, Wave, and Reflow) 5S

Soldering Alloys and Chemistries Lean Manufacturing

Rapid Prototyping Demand Flow Technology

Capital Projects Training

Design to Production Liaison Work Instructions

Product Line Relocation Failure Mode Effect Analysis (pFMEA)

Project Management Machine Programming

Design for Six Sigma Knowledge of PCB Laminates and Construction

Design of Experiments Working Knowledge of IPC and JDEC Standards

Professional Experience

Sr. Manufacturing Engineer (Contract Employee)

May 2013 to Current

Schneider Electric -- Loves Park, IL

Contract engineer responsible for sustainment of circuit board assembly production during facility relocation project. This includes

process and equipment maintenance.

Training of transition staff on production equipment and processes.

Manufacturing Engineer

November 2013 to May 2013

SSI Technologies, Inc. -- Janesville, WI

Sole owner of all circuit board manufacturing processes, responsible for all tactical and strategic projects for the circuit board

manufacturing department. This included design reviews, introduction of new products, and capital projects.

Justification and implementation of a 250 watt C02 Laser for the sole purpose of printed circuit board singulation. With the very

small footprints of SSI’s circuit boards, traditional singulation methods applied too much flexural stresses to the printed circuit board.

By using a high power laser and pulsing it to perforate the circuit board, we could depanel a PCB with zero physical contact,

removing all damage potential from traditional singulation processes.

Manufacturing Engineer

February 2012 to November 2013

The Morey Corporation -- Woodridge, IL

Manufacturing engineering ownership of new product introduction, which included rapid prototyping. In this EMS contract

manufacturing facility it was not uncommon to have five or more prototype builds per week.

Prepared all placement programs, work instructions, and other related documentation for manufacturing SMT.

Re-layout of facility to consolidate space, improve workflow, and optimize space in preparation for four new production lines.

Sr. Manufacturing Engineer

April 2006 to January 2012

Schneider Electric -- Loves Park, IL

Ownership of all soldering processes. This included wave soldering & reflow soldering. Having over 300 PCB assemblies, worked

to develop a reflow profile structure that used density, size, and weight of a PCBA to create 6 base reflow profiles.

Ownership of RoHS implementation, soldering alloy & chemistries, Printed Circuit Board design guidelines & materials

specifications, SMT & Thru-Hole processes, line layouts, and equipment selection.

Lead a project to reduce cost of raw printed circuit boards. This project saved $367K annually. This was achieved by going through

all PCB sku’s, and specifying Tg, Td, and Tc values of the laminate based upon how many layers the construction of the substrate

consisted of, and how dense the population and size were. Lessons learned were how large a PCBA can be at Tg140 before it

warps based upon no center board support usage. We were able to convert a large percentage of our PCB’s from Tg170 to Tg140.

Also, I specified plating requirements. If the PCBA had fine pitch, BGA, or CSP devices, the board was to be ENIG. If the PCB was

did not contain fine pitch devices, then I specified lead-free SN100C HASL plating.

Managing member of the Project Mustang team which was a full relocation of circuit board manufacturing from North Andover

Massachusetts to Loves Park Illinois. My roles in this project were documentation of current Andover processes and products.

Decommissioning, reconditioning, transportation, and recommisioning of the circuit board production lines. Harmonizing process

methods, work instructions, and training of production and technician staff on equipment.

Implemented in house solder reclaimation. By implementing the equipment to recycle our wave soldering process waste, we were

able to realize a savings of $88K annualized. This project also reduced hazardous waste output and solder purchases.

Advanced Manufacturing Engineer

November 2004 to April 2006

PHILIPS Lighting Electronics of North America -- Rosemont, IL

Lead the RoHS program for all North American Philips factories. Also assisting in equipment purchases from the corporate level in

order to convert production lines to RoHS compliance.

Member of the Philips Global Soldering Consortium. The GSC studied, tested, and specified soldering technologies, alloys,

chemistries, laminates, plating, and equipment used for all Philips Divisions worldwide.

Manufacturing design team representative for all new products ensuring designs would be producible when transferred to the

factory. Traveled to the factories to hand off new products to the factory based manufacturing engineers.

Managed engineering projects for offsite EMS contract providers such as Jabil.

New production line facilitation, including but not limited to assisting the factories justify capital purchases, and selecting equipment

based upon Philips’ build anywhere initiative.

Approval of factory expenses across two cost centers.

Member of Philips Phoenix Team. This team was the North American operations counsel. Phoenix Team reviewed, benchmarked,

costed, and approved factory initatives for cost savings, process improvements, KPI’s, NPI, and held tollgate meetings to assist or

mentor factories in-order to achieve goals. We also reviewed quality, field failure rates, and operating costs of each factory location.

Sr. Manufacturing Engineer

June 2000 to November 2004

Emerson Appliance Controls -- Elgin, IL

Facilitated manufacturing engineering projects from the corporate level. This included being a member of the design teams to

ensure Design For Manufacture, New Product Introductions, production quotations, component packaging approvals, capital

justifications/implementations, process specifications, process improvements, quality issues, pFMEAs, and approval of design

changes.

Lead two teams one relocated production from Elgin Illinois to Chihuahua Mexico, the other consolidated 2 Sparta Tennessee

facilities into one, and relocated production from Frankfort Indiana to Juarez Mexico.

Cost Saving Projects

Capital Equipment Savings – Negotiated & procured used equipment which presented a savings > $850K

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Product Service Group Relocation – Savings were presented in the form of line return salvage.

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Commodity Team – Qualification of an Asian Supplier for Membrane Switch Assemblies. $500K savings

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M520 Product Move Team – Relocation of the M520 production line. $3M savings

o

Process Engineer

August 1998 to June 2000

System Sensor -- Saint Charles, IL

Ownership of the selective soldering program. This consisted of custom fabricated immersion equipment. Speeding up selective

soldering by implementing selective wave solder pallets in lieu of slow and high cost machinery.

Design team interaction to ensure Design for Manufacturability, and to reduce costs through PCB layout improvements.

Implemented in house solder reclaimation which reduced purchases, reduced labor, and reduced hazardous waste output. Savings

> $175K annually.

Manufacturing Engineering Technician

October 1995 to August 1998

SHURE Incorporated -- Wheeling, IL

Member of Technical Operations Team, helping define, drive, and improve upon factory metrics and goals.

Creation of spare parts inventory tracking system. I was able to automate the minimum bin size and automatically reorder parts

when bin size hit minimum quantity.

Training and supervision of SMT production staff, production time studies, facilitation and supervision of prototype runs, product

improvement team member.

Equipment Technician II

July 1993 to October 1995

Motorola, Inc. -- Schaumburg, IL

Responsible for programming and maintenance of semi-conductor and crystal blank production equipment.

Education

ITT -- Hoffman Estates, IL

Bachelors of Science in Electronics Engineering Technology

Major: Electronics Engineering -- GPA: 3.8/4.0 Achieved Highest Academic Honors Entire Senior Year

Computer Experience

Microsoft Office Suite Microsoft Project Microsoft Visio Acrobat Professional

AutoCAD CAD/CAM utilities Gerber Utilities MRP/ERP

Certifications, Affiliations, and Continuing Education

Member: Surface Mount Technology Association (SMTA),

Member: Society of Manufacturing Engineers (SME)

Completed JCIT (John Costanza Institute of Technology) “Demand Flow Technology”

Completed Six Sigma, 5S, and Lean Thinking

Completed Design for Six Sigma

Completed Kepner Tregoe

Completed Karass Effective Negotiating

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