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Operator Mechanical

Location:
Deltona, FL, 32725
Posted:
April 18, 2013

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Resume:

Brenda Steinemer

386-***-****

**********@*****.***

Objective: To obtain a position within a growth-oriented company, utilizing my skills and

experience while contributing to the overall success of the company by becoming a

valued team member.

Qualifications: With over twenty years of experience in fabrication and assembly; which includes

thirteen years of experience with Surface Acoustic Wave devices (SAW), which includes

wafer level testing, assembly of SAW devices, sandblast, flip chip, and auto welding. Six

years in circuit board assembly, component level work and board preparation. Also

mechanical assembly, slide line and machine insertion.

Employment: Micross Components Apopka, FL

Assembly Operator 2009-2012

Second shift Saw operator with experience in Die substrate assembly, solder wave

assembly, ink marking, and QC inspection to 883 mil standard. Also assisted in assembly

reflow, inspection, component transfer, packaging, and manual tape and reel.

TriQuint Semiconductor Apopka, Florida

Assembly Operator / FAB Operator 1994-2008

Extensive experience in fabrication and assembly of SAW devices for both military and

commercial use. Two years of experience in fabrication. Usage of various machines

along with manual semi-auto and automatic test equipment and wafer probing. Eleven

years of high volume assembly. Qualified on various automated machines on four

production lines and various manual operations including inspection. Helped in

establishing CAM/BAN system in a High Volume Area to move product more effectively.

Worked in various fabrication areas such as probe, ink marking, short testing, and wafer

coating.

Siemens Lake Mary, Florida

Assembly Operator 1992-1994

Experience in most aspects of assembly from component forming thru insertion, board

preparation, and mechanical assembly. Third shift lead operator.

Emerson Electric Sanford, Florida

Assembly Operator 1989-1992

Experience in assembly from component forming thru insertion. Board preparation and

mechanical assembly. Was chosen to assist in the new product development line.



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