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Physical Design, Timing Closure, Design for Test

Location:
Austin, TX, 78757
Salary:
Negotiable
Posted:
March 27, 2013

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Resume:

Ed Seymour

Advisory Engineer and Research Scientist

**** ******** ****, **** *

Austin, TX 78757

512-***-****

**************@*****.***

Summary:

Over 10 years of work in SOC RTL to GDS processing. Detailed work with RTL

synthesis including RTL updates for optimization. Timing constraint

generation and Static Timing Analysis (STA) along with timing closure by

way of route adjustments, VT adjustments and metal allocation as a form of

CTS. I have worked on clock distribution and delivery of ECO solutions.

Throughout this time I have also worked extensively on scan insertion and

ATPG. In pulling chips together for tapeout I have always been an

essential member of the team to ensure tapeout readiness. I believe

strongly in crisp communication and ensure effective teaming. I have also

debugged issues in libraries, technology files as well as routing.

Within my teams, I have always been a member of the review team to

formulate plans for upcoming chips and helped streamline design flows to

remove months of schedule. Among other tasks I have often beta tested new

versions of the flow to ensure they will work for the mainstream.

In low power management I have experience with clock gating, power headers,

power gating and IR analysis. I am an experienced user of P&R in Cadence

tools. In are area of signal integrity, I have done noise analysis and used

the results to drive timing and routing adjustments. I am also considered

to be a DFT expert and have patents for a couple implementations I have

used for test and defect identification. I am very well versed in

delivering DFT solutions that have no timing impact but provide high

quality coverage.

From technology node of 45nm through 22nm CMOS SOI, responsible for

discovering root cause on defects. In my most recent project, this began

with a task force assignment in 32nm and then I built the business case and

saw that a new project was completed in time for 22nm bringup to

demonstrate yield doubling 3 times in 6 weeks based on a new way of process

monitoring and testing.

Architected countless key CAD development projects which have reduced

design cycle, increased productivity and solved problems that could not be

addresses otherwise. These projects spanned my entire career and covered

flow automation, analysis, pin placement, defect detection, manufacturing

feedback, design-for-test as well as synthesis methods.

Extensive experience in using tools to implement them for SOC designs.

Considered by team members to be an exceptional problem solver with

excellent ability to convey and communicate findings and produce results.

Student of team dynamics, known for dramatic results with even diverse and

international teams.

Ten years of collaboration on VHDL and Verilog ranging from RTL though Gate

Level including synthesis, timing, constraint definition and checking as

well as place and route. Throughout this process, I advised synthesis

developers, helped create more effective design tool flows and illustrated

issues that helped streamline the design process.

1992-2012 - Advisory Engineer - IBM

Drove design cycle time improvements in 32nm and 20nm technology in

conjunction with detailed defect identification and elimination. This was

all based on detailed analysis of ATPG pattern results over several lots of

wafers. In the process, my analysis skills yielded root cause on several

defects essential to correcting process and changing designs to get early

user hardware functioning. This effort was based on data derived from

manufacturing test on patterns created within Cadence Encounter Test. It

involved correlation of fails across several lots of manufacturing.

Arrival a root cause was essential to doubling yield three times in the

span of two months. Called upon my years of direct experience with circuit

teams developing complex analog devices used in Phase Locked Loops, Efuse

circuits, onchip instrumentation, chip decoupling and power management

circuits, as well as, SRAM and Register File designs to yield processors

with over a billion transistors.

Led a team that was based in Austin with team members in Germany, Vermont,

New York and Austin. My leadership included early project planning and

process flow through detailed test analysis and pattern delivery. During

this period we also managed to move detailed test analysis into the RTL

realm which resulted in design cycle savings of 1 year.

Held the responsibility of top level pervasive design while helping define

top level chip connections for test. During this task, had to utilize chip

level make files to annotate the file dependencies.

In physical design of units, cores and chips, I have extensive experience

in Placement and Routing Tools and approaches. In terms of timing closure I

have experience with hierarchical and flat. I know how to create

constraints and validate them. In 45nm, 32nm and 22nm CMOS SOI as well as

the issues surrounding imaging of lines and the corresponding manufacturing

defects that can arise. I understand noise coupling and the impact on

timing. In terms of design sign off process, I am experienced in all the

final checks and fixing errors including physical checks, timing checks and

design for test.

Created scripts in Cadence Skill, perl, ksh and awk to parse data and

automate flows. I have a limited use of Tcl and a cursory use of Python.

Verification of voltage domain crossings during power up, validation that

circuits were designed to accurately pass valid logic conditions and

validation of logic fences were among my responsibilities along with

patterns for non-standard logic such as PLLs and other analog circuits.

Given the size of the die, responsible for defining a partial good strategy

to allow chips with between 4 and 8 working cores to be selected and

fencing of the bad cores confirmed.

Six years of Silicon Validation while running a bringup lab for the

Somerset Design Center in Austin and assisting customer bringup on location

in Italy and France. I also assisted in sponsoring firmware and 64 bit unix

kernel development.

1989-1992 Customer Consultant - IBM

Worked with Semiconductor Industry on process and device modeling then

Automotive Industry to change design flow for electronics at Jeep and Ford

Electronics.

1983-1989 IBM VLSI Academic Program Leader - IBM

Ran a university program on 4 University Campuses to teach undergraduate

students to design standard cell chips and managed joint research projects

as well as ensured student designs were manufactured and delivered in 12

weeks time on an aggressive schedule. This program was on University of

Illinois, Purdue, Penn State and Minnesota

1981-1983 Cad Tool Developer - IBM

Automated the process of assembling and submitting checking and analysis

jobs on microprocessor designs within IBM

Education

BSEE from Rochester Institute of Technology with a specialization of

Microelectronics



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