Engineer Process

AHMAD FIRDAUS ZAKARIA

**** * ******* *** *** *** Tucson Arizona • +1-520-***-**** • ********@*****.***

EDUCATION

Dec 2005

University of Arizona, Tucson, AZ

Bachelor of Science in Systems Engineering

• Best Senior Design Project of 2005 (Baseline Capacity & Schedule Planning for Fire and EMS)

• Scholarship holder from Malaysian Government under Best Student Award Scheme

PROFESSIONAL EXPERIENCE

Q-Cells Malaysia Sdn. Bhd, Cyberjaya, Malaysia Jan 2009 – October 2012

Technology Line Engineer (Troubleshooting & Line Sustaining Group Leader)

• One of the Lead engineers of startup team that establish manufacturing processes from groundbreaking

until current production capacity at over 600 Megawatt Peak (MWP)

• Stabilized the process in term of electrical and optical values that increases solar cell efficiency from

14.6% to 17.3% in a period of 3 years

• Establishment of “Quality Management Tool” to minimize noises for each and every process to make

sure it operates at its’ full potential such as DOE (Minitab), Control Charts, Gauge GR&r, Yield,

Rootcause Analysis, Path Analysis and FMEA.

• Troubleshooting and line sustaining is done together with cross-functioning department to make sure

company goals are achieved and processes are at optimum condition

• Successfully implemented Sig Sigma (DMAIC Method) projects that reduce Contact Shunt (Hotspot)

for continuous improvement from 2% to 1% baseline and reduce the visual defect from 0.8% to 0.4%

Texas Instruments Malaysia Sdn. Bhd, Kuala Lumpur, Malaysia Apr 2008 – Dec 2009

Ramp/Productization Process Engineer

• Establish key process parameters at Diebond and Wirebond by coordinating information gathering from

cross-functioning departments and synchronizing the information to create and qualify processes from

ramp up phase to mass production - 2x2mm and StackDie package.

• Lead a project of new product qualification process at Die Bond and Wire Bond using the right methods

and guidelines by confirming the reliability of the designs, processes to make sure products and

packages exceeding customer requirements.

• Continuous improvement is done on specific processes such as Diebond and Wirebond using “Quality

Improvement Tools” such as DOE (JMP) Created new procedures and requirements using DOE (JMP)

for introduction and productization of new packages. Improve single defect rejection to meet the

minimum requirement of 95%

• Established manufacturing processes prior to entering the mass production processes to ensure optimum

processes at mass manufacturing level by identifying possible problems. This is crucial in ensuring cost

effectiveness at mass manufacturing level

Infineon Technologies, Malacca, Malaysia Jun 2006 – Mar 2008

Test Process Engineer Power Division

• Ensure the single defect yield for sub processes meet the KPI requirement – Process Owner of turret

type tester which integrate test (Electrical), mark (Laser), scan (Vision Layout) and packaging machines

• Introduced localization of packaging parts and hardware used in sub processes machine to contribute to

manufacturing cost savings

• Test Yield improvement activities where the main KPI is to have minimized rejection

• Lead a group of 5 technicians to monitor performance, quality and reliability of testing processes

• Part of a team to establish new equipment set-up GR&r, machine optimization (index time), tooling and

OEE improvement

• Implemented the use of SPC, DMAIC, DOE, 8D and FA techniques as well as related documentation

filing/ update.

• Understanding of Lean Manufacturing methods such as Poke-Yoke, 5S, Control Plan, SOP, Flowchart.

ADDITIONAL INFORMATION

Certifications: 6 Sigma, DMAIC, DOE, SPC, FMEA

Languages: English, Malay

Skills: Project management, problem solving, data analysis

Contact this candidate