Manager Customer Service

Tony Campbell

Email: **********@********.***

Address: **** ** ******* ******

City: Hillsboro

State: OR

Zip: 97124

Country: USA

Phone: 480-***-****

Skill Level: Management

Salary Range: $100,000

Willing to Relocate

Primary Skills/Experience:

See Resume

Educational Background:

See Resume

Job History / Details:

TONY A. CAMPBELL

3641 NE Brogden Street

Hillsboro, OR 97124

Work email: ****.*.********@*****.*** Personal email: **********@********.***

Cell: 480-***-**** Work: CELL/Text Ready: 480-***-****

PRESENT

Intel Corporation: March 1997-Present

Intel Hillsboro, Oregon Fab D1D/D1X Currently assigned to Hitachi Dry Etch M712, M712XT, HIN and REX tools for AZFSM Fab12/32/42/D1D/D1X and installing tools in Intel's state of the art factory located in Hillsboro Oregon.

Intel Chandler, Arizona Fab12/32/42 300mm Dry Etch Process/Equipment Engineer with semiconductor tool install experience. Assigned In Arizona Fab Sort Manufacturing with the task of installing, qualification and sustaining of process equipment. Responsible for keeping tools up to production and minimizing defects from a parametric and physical standpoint. Writing and implementing specifications, procedures for wafer production and tool maintenance. Instrumental in delivering High Performance Maintenance principles to the Dry Etch Area throughout Intel and to other internal customers. Customer driven by meeting the needs of internal and external customers. Responded to excursions in a timely manner. Mentored, trained and led junior engineers and technicians both in the Dry Etch area and externally through task forces and joint teams.

Intel Colorado Springs, Colorado FAB23 200mm: Assigned to thin-films process engineering team as a Process Equipment Engineer overseeing the HDP High Density Plasma tools. Led group with tool installs, upgrades, sustaining and equipment improvement projects with focus on cost, safety and up time availability. Directly and indirectly managed manufacturing technicians and various contractors for Intel. Also worked in the Total Chemical management (TCM) group in Fab 23 Colorado: In TCM, repaired and maintained Sub-Fab equipment, gas systems, chemical systems and assisted with projects, tool install and start-ups. Prior to TCM assigned to the F23 Thin-Film install team. Responsible for installing and qualifying the Precision 5000 and HDP tools and ensuring that all support equipment was here on time and functional. In addition to these duties, mentored and trained newly hired manufacturing technicians/engineers on the Thin-Film toolsets.

Intel Chandler, Arizona: FAB12 200mm

Assigned to Thin-Films Applied Materials Precision 5000 and HDP group as a Maintenance Technician and Area Coordinator. In this functional area, tasked with operating, maintaining, repairing, and improving the equipment. Trained F12 junior technicians to do this as well. Trained technicians from other Intel factories including: Ireland Israel, Oregon, Massachusetts, and New Mexico. Tasked with installation of the first high volume manufacturing HDP`s for Fab 12. Member of the Fab 12 for Fab 23 interviewing team prior to relocation.

PREVIOUS EXPERIENCE

Electronic Technician February 1995 - March 1997 Motorola Tempe, Arizona

At Motorola I was working under the Technician Rotation Program and I worked through four functional areas and two different technologies (BP1 Sort, Photo/Etch, MOS-6 Thin-Films, and Photo). During the rotations we were tasked with improvement projects.

Test Operator/Lead/Test Operator February 1991 - February 1995 VLSI Tempe, Arizona

Perform electrical testing of very large-scale integrated circuits using state of the art testers. Setup and performed troubleshooting on

Wafer and chip testers, handlers and wafer sort equipment. While working there, I created a dual socket testing device, allowing

real time testing without need to break the set-up down.

Lead Scan Operator/Test Operator April 1990 - February 1991 Sterling Enterprises Temporary Services

for VLSI Tempe, Arizona

Inspected and repaired leads on several electronic-device packages for final inspection prior to shipment to customers. Completed electrical testing of electronic devices as a Test Operator and then promoted to Lead Test Operator.

Manager November 1989 - June 1991 Radio Shack Phoenix, Arizona

1984-1986 Radio Shack Broomfield, Colorado

Managed daily store operations, sold and ordered electronic components, stereos, VCP/VCR`s computers and associated hardware and

software. Assisted store manager with all store operations. Actively engaged in customer service.

EDUCATION

MBA of Business Transformation and Information Technology, Colorado Technical University, Colorado Springs, Colorado June 2004

Bachelor of Science in Technical Management, DeVry Institute of Technology, Phoenix, Arizona October 1998

Associate of Applied Science in Electronics, DeVry Institute of Technology, Phoenix, Arizona June 1995

MILITARY: United States Navy, Machinist Mate

August 1986 - August 1989 Honorable Discharge

September 1980 - September 1984 Honorable Discharge

Main propulsion technician and air conditioning/refrigeration technician. Maintained/operated pumps, steam turbines, steam systems, air compressors, all air conditioning/refrigeration equipment and other shipboard equipment. Supervised and trained individuals. Maintained and developed extensive Preventive Maintenance System for Propulsion/Auxiliaries Division aboard ship.

AWARDS

*Intel`s Shift 7 Safety Employee of the Quarter *Intel Environmental Excellence Award

*Intel Fab Sort Manufacturing Excellence Award *Intel High Precision Maintenance Award

*Innovation Award, VLSI *Manager of the Month, Radio Shack

*Sailor of the Month, Navy *Battle Efficiency, Navy

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