Accurate Pre-layout Estimation of Standard Cell
Characteristics
Hiroaki Yoshida Kaushik De Vamsi Boppana
Zenasis Technologies, Inc. Zenasis Technologies, Inc. Zenasis Technologies, Inc.
Campbell, CA 95008-6900 Campbell, CA 95008-6900 Campbell, CA 95008-6900
*******@*******.*** *******@*******.*** *****@*******.***
ABSTRACT
Less Accurate
Approach 1
Faster
pre-layout
netlist
With the advent of deep-submicron technologies, it has become es- Cell
Design
Characterizer
timing/
Optimizer
sential to model the impact of physical/layout e ects up front in power etc.
all design ows [1]. The e ect of layout parasitics is consider-
Approach 2
able even at the intra-cell level in standard cells. Hence, it has pre-layout
pre-layout
become critically important for any transistor-level optimization to netlist
netlist Cell Layout
Design
consider the e ect of these layout parasitics as an integral part of
Characterizer
timing/ Estimator
Optimizer estimated
More Accurate
power etc. netlist
the optimization process. However, since it is not computationally
Approach 3
feasible for the actual layout to be a part of any such optimization
pre-layout pre-layout
procedures, we propose a technique that estimates cell layout char-
Slower
Layout
netlist netlist
Cell
Design
post-layout Synthesizer
Characterizer
timing/
Optimizer
acteristics without actually performing the layout and subsequent power etc. netlist
extraction steps. We demonstrate in this work that it is indeed fea-
sible to estimate the layout e ects to get timing characteristics that
Figure 1: Transistor-level optimization approaches.
are on average within about 1.5% of post-layout timing and that
the technique is thousands of times faster than the actual creation
of layout.
Categories and Subject Descriptors increasingly used in the creation of high-performance libraries and
B.7.2 [Hardware]: Integrated Circuits Design Aids are equipped to handle a variety of manufacturing, design and cost
considerations used in the creation of libraries [10].
General Terms Traditionally, transistor-level optimization techniques such as [2]
[11], have not attempted to account for the impact of layout para-
Algorithms, Measurement, Performance, Design sitics, which has become increasingly important at the 130nm and
at the 90nm process nodes [1]. The e ect of these layout parasitics
Keywords has become extremely important, even for circuits with a small
number ( 10) of transistors, rendering any optimization without
Standard cell, cell characterization, transistor-level optimization
considering these e ects to be impractical. In addition, reduced or-
der device models such as switch-level (RC) models of transistors
1. INTRODUCTION
are becoming increasingly incapable of modeling deep submicron
Design optimization at the transistor-level is well-known and
e ects. This leaves detailed simulation, often at the BSIM3/4 level
has been used successfully to achieve signi cant performance ben-
[12], or using detailed models built using simulation at that level,
e ts above and beyond gate-level design optimization. The ap-
as the only reliable option for obtaining accurate circuit timing.
proaches range from transformations such as sizing [2][3], all the
Hence, it has become critically important for any transistor-level
way to macro-cell based design methodologies [4]. More recently,
optimization to consider the e ect of these layout parasitics as an
transistor-level optimization techniques targeting a standard cell
integral part of the optimization process. In other words, out of the
based design ow have also been proposed [5]-[7]. These opti-
design optimization approaches outlined in Figure 1, Approach 1
mization techniques take advantage of the recent progress in auto-
is not practical for deep submicron geometries. On the other hand,
mated cell-layout solutions [8][9]. Such solutions are now being
it is also not computationally feasible to wait for the actual layout
to be a part of any such optimization procedures, as suggested by
Approach 3 in Figure 1. Hence, we propose a technique that pro-
vides an accurate estimate of cell layout characteristics without ac-
Permission to make digital or hard copies of all or part of this work for
tually performing the layout and subsequent extraction steps. This
personal or classroom use is granted without fee provided that copies are
not made or distributed for pro t or commercial advantage and that copies is Approach 2 outlined in Figure 1. We demonstrate in this work
that it is indeed feasible to estimate the layout e ects to get timing
bear this notice and the full citation on the rst page. To copy otherwise, to
republish, to post on servers or to redistribute to lists, requires prior speci c characteristics that are on average within about 1.5% of post-layout
permission and/or a fee.
timing and the technique is thousands of times faster than the actual
DAC 04, June 7 11, 2004, San Diego, California, USA.
creation of layout.
Copyright 2004 ACM 1-58113-828-8/04/0006 5.00.
The rest of the paper is organized as follows. Section 2 intro- A Maximal Transistor Series (MTS) is a maximal set of series-
duces the layout model, circuit model and problem de nition. Sec- connected transistors. In a physical layout, an MTS is typically
tions 3 and 4 describe the proposed statistical and constructive esti- implemented as transistors that are connected to each other by dif-
mation techniques respectively and Section 5 presents experimental fusion. An intra-MTS net is a net that connects two transistors in
results on two industrial processes at the 130nm and 90nm process an MTS and an inter-MTS net is a net that connects transistors in
di erent MTSes. Figure 4 shows an example of an MTS and its
nodes. Conclusions are drawn in Section 6.
physical implementation. MTS identi cation is an essential step in
building a high-quality estimator.
2. PRELIMINARIES
In this section, we rst present our models of cells, layouts and Inter-MTS Net
circuits. We then describe several notions used throughout this pa- B A C D F E
X Intra-MTS Net
per. Finally, the problem addressed in this paper is formulated.
A cell refers to a typical standard cell. Figure 2 illustrates our X
E
A C
cell layout model. A cell is of a single-height style, i.e., P-type
and N-type transistors are placed in di usion regions as shown. No F
B D
Y
transistor stacking is allowed. The region between the two di usion
MTS
regions is called as the di usion gap region. Maximum di usion Y
heights are either xed or exible, depending on the layout style.
Transistors are connected by using either wires or di usion. Figure 4: Maximal Transistor Series (MTS) and its physical
implementation.
Power Rail
Cell characterization refers to the process of determining vari-
Minimum Poly-to-Poly Spacing
ous characteristics (such as timing, power, input capacitances) of
Transistor Region Height
the cell. This process is used to create views/models of the cell that
P-type
P-type
Diffusion
Diffusion Gap Height
are used in various steps of the design ow. Of particular interest
Region
in this paper is the aspect of cell timing characterization. It refers to
the process of creating models such as the non-linear delay model
Minimum Poly-to-Contact Spacing
[13] based on detailed SPICE simulation of the transistor-level cir-
cuit representation of the cell. Cell timing represents four di er-
N-type
N-type
Diffusion Contact Width ent timing characteristics, i.e., cell rise, cell fall, transition rise and
Region
transition fall, for a pre-de ned set of output loads and input slews,
on every signal-carrying input-to-output path in the circuit.
Ground Rail
Without loss of generality, timing T (c) of a cell c can be de ned
as a delay or slew of an arc of the cell for a given output load and
Figure 2: Our layout model.
input slew. Pre-layout timing T pre (c), estimated timing T est (c) and
post-layout timing T post (c) are the timing values that are obtained
Figure 3 shows our circuit models. A pre-layout netlist is a set by characterizing a pre-layout netlist, estimated netlist and post-
of transistors and nets that connect transistors. Each transistor in layout netlist, respectively.
a pre-layout netlist has its length and width. An estimated netlist The problem addressed in this paper can be formulated as fol-
is de ned as a pre-layout netlist with the following modi cations. lows: Given a cell c and its pre-layout netlist, nd an estimated
Each transistor has the areas and perimeters of its drain and source timing such that the absolute di erence of the estimated timing and
di usion regions in addition to its width and length. Each net has post-layout timing:
an associated grounded capacitance. An estimated netlist is func-
D(c) = T est (c) T post (c) (1)
tionally identical to the corresponding pre-layout netlist but can be
structurally di erent due to transistor folding, i.e., a wide transistor
is minimized.
in a pre-layout netlist may be split into smaller parallel-connected
transistors in the estimated netlist.
3. STATISTICAL ESTIMATOR
M1 n1 a vdd vdd p W=2.0u L=0.13u
One can estimate post-layout timing from pre-layout timing based
+ AD=0.36e-12 AS=0.36e-12
on statistical analysis of di erences between pre-layout and post-
+ PD=4.36e-6 PS=4.36e-6
layout timing. The statistical estimator estimates the post-layout
M1 n1 a vdd vdd p W=2.0u L=0.13u C1 n1 vss 1.2f
timing of a cell by multiplying pre-layout timing by a predeter-
mined scale factor S .
Folded Transistors
T est (c) = S T pre (c) (2)
S is speci c to each technology and cell architecture, and is deter-
mined based on a small representative set of cells that are actually
laid out and characterized with respect to timing. More speci cally,
the scale factor is calculated as follows:
Wiring Capacitances
1
S= (T post (c)/T pre (c)) (3)
(b) Estimated netlist.
(a) Pre-layout netlist.
C c C
Figure 3: SPICE-level and schematic-level descriptions of our
where C is a representative set of cells.
circuit models.
with the di usion is an intra-MTS net or an inter-MTS net.
The advantage of this estimator is that it is applicable to any tech-
nology and cell architecture because it is formulated in a technology- S pp /2 if n is intra-MTS net
w= (10)
independent manner. On the other hand, the disadvantage is its in- Wc /2 + S pc if n is inter-MTS net
accuracy mainly due to the lack of consideration of the variation of
where S pp is the minimum poly-to-poly spacing, Wc is the contact
layout characteristics. The experimental results in Section 5 show
width and S pc is the minimum poly-to-contact spacing. These are
that this approach is not accurate enough. In the next section, we ll
given as design rules as shown in Figure 2. Figure 5 illustrates
introduce the constructive estimator that takes such variations into
the estimation of di usion area and perimeter. It is important to
account.
note the role of an MTS in this computation. It is the MTS that
typically controls di usion sharing and hence controls the di usion
4. CONSTRUCTIVE ESTIMATOR
parasitics. This is the key to getting an accurate estimate of the
The central problem with the statistical estimator is that it cannot di usion parasitics.
accurately capture the variation of layout characteristics present in
di erent standard cells even from within the same standard cell li-
brary. In this section, we introduce the constructive estimator that
takes such variations into account. The constructive estimator con-
Diffusion Region
Transistor Width
Diffusion Region
Transistor Width
structs an estimated netlist by applying the following transforma-
tions to a pre-layout netlist: a) folding each transistor, b) assigning
di usion areas and perimeters to each transistor, and c) adding a
wiring capacitance to each net. Then estimated timing is obtained
by characterizing the estimated netlist. These transformations are
described in detail in the following subsections. Contact Width+
Minimum Poly-to-Poly Spacing
2*(Minimum Poly-to-Contact Spacing)
4.1 Transistor Folding
(a) Intra-MTS (b) Inter-MTS
Since the height of a cell is xed, a wide transistor in a pre-layout
Figure 5: Estimation of di usion area and perimeter.
netlist is divided into smaller transistors to meet the cell height.
Folded transistors are connected in parallel to preserve the original
Note that this transformation must be done after transistor fold-
functionality as illustrated in Figure 3.
ing because the widths of transistors may be di erent before and
The folded transistor width W f and the number of the folded
after transistor folding. It should also be noted that di usion area
transistors N f are calculated as follows:
and perimeter modeling should be made in conjunction with the
W f (t) = W (t)/N f (t) (4) transistor models of the target technology.
N f (t) = W (t)/W f max (t) (5)
4.3 Wiring Capacitance
R(Htrans Hgap ) if t is P-type
W f max (t) = (6) This transformation adds a wiring capacitance to each net in
(1 R)(Htrans Hgap ) if t is N-type
a pre-layout netlist. Intra-MTS nets are not considered because
they are typically implemented in di usion. Similar to di usion
where W (t) is the width of a given transistor t, x denotes the
area/perimeter estimation, this transformation must be done after
smallest integer greater than or equal to x, R is the ratio of heights
of the P and N di usions, Htrans is the height of a transistor region transistor folding.
and Hgap is the height of a di usion gap region as shown in Figure The capacitance C (n) of a net n is estimated by the following
2. formula:
Our model allows two transistor folding styles, a xed P/N ratio
C (n) = M T S (t) + M T S (t) + (11)
style and an adaptive P/N ratio style. In the xed P/N ratio style,
t T DS (n) t TG (n)
R is speci c to a given technology and cell architecture. In the
where, and are constants, T DS (n) is a set of transistors whose
adaptive P/N ratio style, R is speci c to a cell and is determined
drain or source is connected to a net n, TG(n) is a set of transistors
such that the width of the cell is minimized:
whose gate is connected to a net n and MT S (t) is an MTS that
R= W (t) W (t) (7) includes a transistor t. According to our experiments presented in
t P(c) t P(c) N (c) Section 5, the above formula gives an excellent correlation to actual
wiring capacitances. Again, it is important to note the importance
where P(c) is a set of P-type transistors in a cell c and N (c) is a set
of MTS in obtaining an accurate estimate of wiring capacitance.
of N-type transistors.
It is the MTS connectivity that typically dictates the length of the
4.2 Diffusion Area and Perimeter wire and hence the capacitance of the wire.
Formula (11) requires three constants, and to be determined
Given the width w and height h of the di usion region of a tran-
sistor, the di usion area A and perimeter P are calculated as fol- in advance. These constants are determined by multiple regression
analyses based on a small representative set of cells that are actually
lows:
laid out. This calibration process has to be done only once for a
A = wh, P = 2w + 2h (8) given technology and cell architecture.
The height of a di usion region is estimated as the width of the
5. EXPERIMENTAL RESULTS
associated transistor t:
The proposed technique has been implemented within the frame-
h = W (t) (9)
work of a standard cell characterization ow. Given a pre-layout
The width of a di usion region is estimated by using one of the fol- netlist, cell timing is generated based on both statistical and con-
lowing formulas depending on whether the net n that is associated structive estimations and compared with post-layout timing. As
Table 1: Quality of proposed estimation techniques for two industrial standard cell libraries.
No Estimation Statistical Estimator Constructive Estimator
Feature Size
Avg. Abs. Di . Std. Dev. Avg. Abs. Di . Std. Dev. Avg. Abs. Di . Std. Dev.
#Cells #Wires
[nm]
[%] [%] [%] [%] [%] [%]
130 57 276 8.85 4.08 3.60 2.76 1.55 1.79
90 53 221 8.81 4.80 4.10 3.35 1.52 1.40
8
6. CONCLUSIONS
6
Estimated capacitance [fF]
Estimated capacitance [fF]
7
We have demonstrated that it is feasible to estimate timing char-
5
6
acteristics of transistor-level circuits in a standard-cell design frame-
4
5 work to on average within about 1.5% of post-layout timing based
on a fast and accurate constructive estimation technique. This tech-
4 3
nique solves a critical problem a ecting transistor-level optimiza-
3
2
tion techniques at deep submicron geometries. It has been imple-
2
mented in an industrial software system and has been successfully
1
1
used at today s leading edge process nodes.
0 0
0 1234567 8 0 1 2 3 4 5 6
Extracted capacitance [fF]
Extracted capacitance [fF]
7. REFERENCES
(a) 130nm technology (b) 90nm technology [1] International Technology Roadmap for Semiconductors 2002
Update, Semiconductor Industry Association, 2002.
Figure 6: Extracted versus estimated capacitances.
[2] J. P. Fishburn and A. E. Dunlop, TILOS: A posynomial
programming approach to transistor sizing, in Proc. of IEEE
discussed in Section 4, for the statistical technique, cell timing
International Conference on Computer-Aided Design, pp.
is generated based on calibrating simulation results from a pre-
326 328, Nov. 1985.
layout netlist. For the constructive technique, the estimated netlist
[3] A. Conn et al., Gradient-Based Optimization of Custom
(with transistor folding, di usion area/perimeter and wiring capac-
Circuits Using a Static-Timing Formulation, in Proc. of
itances) is simulated.
ACM/IEEE Design Automation Conference, pp. 452 459,
We conducted experiments on two di erent state-of-the-art stan-
Jun. 1999.
dard cell libraries implemented in 130nm and 90nm technologies.
[4] J. L. Burns and J. A. Feldman, C5M A Control- Logic
These libraries were chosen at di erent process nodes and from
Layout Synthesis System for High-Performance
di erent vendors in order to measure the e ectiveness of the tech-
Microprocessors, IEEE Trans. on Computer-Aided Design,
niques across varying layout styles and design rules. The cells vary
vol. 17, no. 1, pp. 14 23, Jan. 1998.
from simple cells such as an inverter to complex cells that consist of
30 unfolded transistors. The simulator used in these experiments [5] R. Panda et al., Migration: A new technique to improve
synthesized designs through incremental customization, in
was HSPICE[14].
Proc. of ACM/IEEE Design Automation Conference, pp.
First, we present results that demonstrate the e ectiveness of the
388 391, Nov. 1998.
constructive technique on estimating wiring capacitances. Wiring
[6] M. Cote and P. Hurat, Faster and Lower Power Cell-Based
capacitances critically determine the quality of the constructive es-
timator due to their increased e ects at the deep submicron geome- Designs with Transistor-Level Cell Sizing, in Closing the
Gap Between ASIC & Custom, pp. 225 240, Kluwer
tries. Figure 6 shows scatter plots that compare extracted and es-
Academic Publishers, 2002.
timated wiring capacitances for the cells in the 130nm and 90nm
[7] D. Bhattacharya and V. Boppana, Design Optimization with
technologies, respectively. The extracted capacitance values are
Automated Flex-Cell Creation, in Closing the Gap Between
calculated from lumped C extracted netlists. The three constants
ASIC & Custom, pp. 241 268, Kluwer Academic Publishers,, and in Formula (11) for these technologies are calculated by
multiple regression analyses. This data shows the excellent corre- 2002.
lation achieved by our wiring capacitance estimation technique. [8] M. Guruswamy et al., CELLERITY: A Fully Automatic
Finally, Table 1 demonstrates the e ectiveness of the estimators Layout Synthesis System for Standard Cell Libraries, in
Proc. of ACM/IEEE Design Automation Conference, pp.
on overall cell timing for the two standard cell libraries under con-
sideration. All four kinds of cell delays (cell rise, cell fall, transition 327 332, Jun. 1997.
rise, transition fall) are measured in this experiment. Columns 1, 2 [9] abraCAD Documentation, Synopsys, Inc., 2003.
and 3 show the feature size of the library, the number of cells used [10] C. Bittlestone et al., Architecting ASIC Libraries and Flows
in this experiment and the number of wires whose capacitances are in Nanometer Era, in Proc. of ACM/IEEE Design
estimated in this experiment. The rest of the columns compare Automation Conference, pp. 776 781, Jun. 2003.
the quality of the cell timing for each of the proposed techniques. [11] S. S. Sapatnekar et al., An Exact Solution to the Transistor
For example, for the 90nm technology library, if no estimation was Sizing Problem for CMOS Circuits Using Convex
used, the average of the absolute di erences in timing is 8.85% and Optimization, IEEE Trans. on Computer-Aided Design, vol.
a standard deviation of 4.08%. The statistical approach produces 12, no. 11, pp. 1621 1634, Nov. 1993.
an average absolute di erence of 4.10% and a standard deviation
[12] W. Liu et al., BSIM3v3.2 MOSFET Model Users Manual,
of 3.35%. And nally, the best results are obtained by the construc-
University of California, Berkeley, 1998.
tive estimator, with an average absolute di erence of 1.52% and a
[13] Library Compiler User Guide: Modeling Timing and Power
standard deviation of 1.40%. It is worth noting that the runtimes of
Technology Libraries, Synopsys, Inc., 2003.
the constructive estimators are very small, with typical overheads
[14] HSPICE Data Sheet, Synopsys, Inc., 2003.
being less than 0.1% of typical SPICE simulation times.
Copyright 2004 ACM 1-58113-828-8/04/0006 5.00.