Electrical Engineer Project

Craig A. Lewis

*** ******* *** *** 781-***-****

Roslindale MA, 02131 ************@***.***

Summary of QualificationsComprehensive understanding of IC design, fabrication related to Photodiodes, ICs and MEMSExperienced in testing and characterization of Photodiodes, MEMS, and semiconductor devicesExperienced in layout and verification using Cadence, including DRC and SPICE extractionSkilled in test system automation and control using GPIB, C++, Visual Basic, and Labview

Technical Skills

Computer Languages: C, C++, Visual Basic

Computer Applications: Cadence, MEDICI, TSUPREM, Spice, Matlab, SigmaPlot, Labview

Lab Skills: Semiconductor Processing, Wafer Metrology, Device Characterization

Lab Equipment: Wet and Dry Oxidation Furnace, Contact Aligner, LPCVD Furnace, Sputtering Machine, ICP Etcher, Four Point Probe, Dektak profilometer, Nanospec Semiconductor Analyzer, Oscilloscope, Polytec Laser Doppler Vibrometer, Monochromator, Spectrum Analyzer

Experience

Continuum Photonics Inc., Billerica, Massachusetts August 02 – June 03

MEMS Inspection and Test Engineer

Project: Direct Light All Optical SwitchResponsible for delivering MEMS devices to the packaging group, free of defects that meet the design specifications. This involved making detailed measurements of device features, performing a visual inspection, and performing vibration analysis using a Polytec Laser Vibrometer.Automated a Laser Vibrometer used for determining the resonant modes of the MEMS devices. This automation allows the operator to make batch measurements of up to 24 devices at a time.Assisted the Director of MEMS and the Vice President of Engineering in drafting the MEMS specification document.Tasked with developing and streamlining the inspection and measurement procedures so that they could be transferred from the engineering group to the manufacturing group.Wrote MEMS Inspection documentation needed for technicians to take over the task of inspection.Made cross-sections of devices used to correlate the device dimensions to the modes of vibration.Assisted the operations group in setting up a cleanroom, acting as the liaison for the Director of MEMS, managing a portion of the logistics, including setting up a wet bench, and Laser Vibrometer.Wrote cleanroom documentation that included the gowning procedure, laboratory rules and policies.

3D-IC Inc., Somerville, Massachusetts Dec 00 - Nov 01

Electrical Engineer

Project: Advanced High Definition 3D Image SensorResponsible for providing engineering support wherever it was needed.Laid out test circuits using Cadence, for the transistors and sub-circuits found in the imager.Implemented a wafer scale device test system, which included a wafer probe station, and semiconductor analyzer.Analyzed the spectral response of photodiodes used as part of the 3D Image Sensor.Assisted the designer of the 3D Image Sensor.Examined the imager design, gathering sub-circuit and transistor statistics.Designed and implemented a small cost effective network facilitating both Windows and UNIX computers.

Trex Enterprises 3D Group, Somerville, Massachusetts June - July 00

Oct - Nov 00

Electrical Engineer (Consultant)

Project: Advanced High Definition 3D Image SensorSet up a small optics lab for measuring the electro-optical characteristics of photodiodes.Improved the custom software and performed hardware upgrades for spectroscopy system.

Northeastern University, Boston, Massachusetts Sept 97-June 00

Electrical Engineer (Research Assistant)

Project: Three-Dimensional Computational Sensors for Advanced Low-Power Visual Processing Designed and laid out a photodiode test chip to evaluate characteristics of Back-Illuminated photodiodes.Designed and implemented an automated test system to measure quantum efficiency of Back-Illuminated photodiodes, using a monochromator, semiconductor analyzer, calibrated optical detector, C++, and GPIB.Provided semiconductor process support at MIT Lincoln Laboratory, measuring device and process characteristics.Interfaced wafer metrology equipment to a data acquisition system using Labview, and wrote a program in Matlab to estimate the thickness of the dielectric film, using the acquired data.

Northeastern University, Boston, Massachusetts Sept 96 - Mar 97

Electrical Engineer (CO-OP)

Project: Micro Switch Research ProgramModified, constructed, and debugged two automated Micro Switch testing systems.Modified Labview code used to automate a test system, steam-lining the measurement process.Completed the fabrication process for Micro Switches and packaged the Micro Switches.

OKI Semiconductor, Boston, Massachusetts Mar-Jun 96

Jun-Dec 95

ASIC Applications Engineer (CO-OP) Evaluated floor-planning schemes, to ensure proper timing of critical modules in design.Re-targeted FPGA Libraries manually.Inserted Scan and JTAG Boundary Scan into various designs, and inserted PLL’s.Simulated circuit timing under various conditions, generating test vectors and fault grading designs.Consulted with clients providing technical assistance on the design requirements and device characteristics.Performed extensive manual edits of Verilog netlists.

Education

Northeastern University, Boston, Massachusetts June 00

Masters of Science in the Field of Electrical Engineering

Thesis: Evaluation of the Spectral Response for Thin Epi Back-Illuminated Photodiodes

Bachelor of Science in Electrical Engineering (Computer Option) Cum laude June 97

Publications

Burns, J.; McIlrath, L.; Keast, C.; Lewis, C.; Loomis, A.; Warner, K.; Wyatt, P., Three-Dimensional Integrated Circuits for Low-Power, High-Bandwidth Systems on a Chip, IEEE International Solid-State Circuits Conference 2001, pp. 268-269,453.

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