Manufacturing International
Resume:
Curriculum Vita
R. WAYNE JOHNSON
Alumni Professor
Department of Electrical & Computer Engineering
Auburn University, AL 36849-5201
334-***-**** (tel)
334-***-**** (fax)
*******@***.******.***
EDUCATION
Ph.D. in Electrical Engineering from Auburn University, August 1987, Dissertation:
"Hybrid Silicon Wafer Scale Packaging Technology". Minor sequence in Materials
Engineering. 1985 IEEE Solid State Circuits Council Fellowship, (GPA 4.0/4.0).
Masters of Science in Electrical Engineering from Vanderbilt University, December 1982,
Masters Thesis: "Polymer Thick Film Materials for Microwave Applications". Minor
sequence in Materials Science, (GPA 4.0/4.0).
Bachelor of Engineering in Electrical Engineering (Summa Cum Laude) from Vanderbilt
University, May 1979. Received Dean's Award and Tau Beta Pi Award. Projects included
fabrication of microwave circuits, packaging of analog circuits and high temperature
hybrids, (GPA 3.0/3.0).
WORK EXPERIENCE
Professor (tenured) Auburn University, September 15, 2002 Present, Research interests
in electronics manufacturing, advanced packaging, and high temperature electronics.
Director, Information Technology Peak of Excellence Auburn University, May 16, 2002
Present. Coordinate research effort between four Samuel Ginn College of Engineering
Research Centers and develop other potential research areas within Information
Technology.
Alumni Professor (tenured) - Auburn University, September 15, 1997 September 14,
2002. Research interests in electronics manufacturing, advanced packaging, and high
temperature electronics.
Director, Center for Advanced Vehicle Electronics A NSF Industry/University
Cooperative Research Center Auburn University, July 1, 1999 May 16, 2002. The
focus of the Center is the electronics packaging and manufacturing technologies for harsh
environments. The Center has 11 industrial members with annual funding of $895,000
from memberships and NSF. Additional funding through the Center is approximately
$1,400,000 per year. The Center is interdisciplinary with faculty from Mechanical,
Industrial & System, and Electrical & Computer Engineering and Physics participating.
The Center has a full time staff of seven professional and administrative employees.
Director Laboratory for Electronics Assembly & Packaging, September 16, 1987
Present. Responsible for research, teaching and facilities in the Laboratory for Electronics
Assembly & Packaging. This facility includes over $2,750,000 in state-of-the-art
electronics manufacturing equipment.
Professor (tenured) - Auburn University, September 15, 1995 - September 14, 1997.
Research interests in multichip modules, electronic materials and processing, power
electronics, and high temperature electronics.
Chairman - Consortium for Vehicle Electronics Management Committee, March 1995 -
September 30, 1997. Consortium of five companies and Auburn University working to
develop low cost packaging technology for automotive and aerospace applications. Funded
($12,800,000) by the Consortium members and DARPA. Responsible for program
management and reporting.
Acting Director - The Center for the Commercial Development of Space Power and
Advanced Electronics, September 1, 1995 - May 1, 1996. Responsible for overall Center
operation and coordination with NASA and industrial partners. Also responsible for
program management for research in power and advanced electronics including silicon
carbide, electronics packaging, electronics manufacturing, and power electronics.
Associate Director - The Center for the Commercial Development of Space Power and
Advanced Electronics, February 1, 1994 - August 31, 1995. Responsible for research
programs in advanced electronics including silicon carbide, electronics packaging and
electronics manufacturing. Also responsible for new industrial ember recruitment.
Associate Professor (tenured) - Auburn University, September 15, 1991 - September 14,
1995. Research interests in multichip modules, electronic materials and processing, power
electronics, and high temperature electronics.
Assistant Professor - Auburn University, September 15, 1987 - September 14, 1991.
Research interests in multichip modules, electronic materials and processing, and power
electronics. Established teaching and research program in thick and thin film
microelectronics including laboratory facilities. Also taught undergraduate circuits and
design courses.
Graduate Research Assistant - Auburn University, September 17, 1984 - September 14,
1987. Studied for Ph.D. in Electrical Engineering with research interests in multichip
packaging, electronic materials and processing, and power hybrids. Research funded by
the Semiconductor Research Corporation.
Graduate Teaching Assistant - Auburn University, September 17, 1984 - August 25, 1985.
Taught undergraduate circuits and electronics courses.
Senior Product Engineer - Amperex Electronics Corp., February 15, 1984 - September 14,
1984. Primary responsibility: applications engineering and product management for
custom hybrid and discrete semiconductor products.
Hybrid Electronics Engineer - Eaton Corporation, January 3, 1983 - February 15, 1984.
Primary responsibility: establish in-house, thick film facility to produce 3-5 million
industrial hybrid circuits per year. Tasks included process development, hybrid design,
process documentation, production scheduling, cost estimating and supervision of
operators.
Instructor - Vanderbilt University, January 1, 1982 - May 15, 1982. Taught hybrid
microelectronics course and laboratory.
Product Specialist - DuPont, Electrical Materials Division, July 1, 1979 - December 31,
1980. Primary responsibilities: to assist DuPont customers with the processing of thick
film materials with responsibility for all military accounts and several key high-volume
commercial accounts. Laboratory facilities were used to produce and evaluate prototype
and test parts to verify materials and processes and for military qualification tests. Other
responsibilities included failure analysis, evaluation of new materials and processes,
customer training seminars and supervision of laboratory personnel.
Project Engineer - Microsystems Technology, Inc., May 1977 - April 1979 (part-time).
Major projects: evaluation of materials and processes to produce circuits for use in high
temperature (275 C) environments; and design, layout, fabrication, and testing of thick-
film multilayer hybrid microcircuits for the F18 Multi-Purpose Display Group.
AWARDS
Best Paper of Symposium Award for, Reliability of Small BGAs in the Automotive
Environment, by Jeffrey C. Suhling, R. Wayne Johnson, John L. Evans, Nokibul Islam,
Jing Lui, and Shyam Gale, the 35th International Symposium on Microelectronics, Denver,
CO, September 4-6, 2002.
Best Paper of Conference Award for Wafer Applied Underfills for Flip Chip Assembly,
by Wayne Johnson, Qing Wang, Fei Ding, Renzhe Zhao, Larry Crane, Mark Konarski,
Erin Yaeger, Afranio Torres, Marc Chason, Jan Danvir, Nadia Yala, Jing Qi, and Prasanna
Kulkanari, The International Conference on Advanced Packaging and Systems, Reno, NV,
March 10-13, 2002.
Best Paper of Conference Award for the paper entitled, Assembly and Reliability of Flip
Chip-on-Laminate with Lead Free Solder, by Zhenwei Hou, Casey Hatcher, R. Wayne
Johnson, Erin Yaeger, Mark Konarski and Larry Crane, 2001 HD International
Conference, Santa Clara, CA April 18-20, 2001.
Best Paper of Conference Award for the paper entitled, Comparison of Die Level Stress
with Convection and Variable Frequency Microwave Encapsulant Curing for Chip-on-
Board, by Yida Zou, R. Wayne Johnson, Jeffery C. Suhling, Joe Harris, Cheryl Kromis,
Iftikhar Ahmad, Denise Tucker, and Zak Fathi, International Conference on High Density
Packaging and MCMs, April 6-9, 1999, Denver, CO.
Outstanding Paper of Conference Award for the paper entitled, Flip Chip on Laminate
Manufacturability, by Jing Qi, R. Wayne Johnson, Erin Yaeger, Mark Konarski, and
Larry Crane, International Conference on High Density Packaging and MCMs, April 6-9,
1999, Denver, CO.
1997 Daniel C. Hughes Award from the International Society for Hybrid Microelectronics
for significant technical contributions and continued academia impact on the industry .
This is the top award given by the Society and includes life membership.
1997 Senior Faculty Research Award presented by the Auburn Alumni Engineering
Council.
1997 Alumni Professorship presented by the Auburn Alumni Association. This is a five-
year appointment.
1994 Fellow of the Society Award from the International Society for Hybrid
Microelectronics for his significant and continuing contributions to ISHM over the course
of many years .
1993 John A. Wagnon, Jr. Technical Achievement Award from the International Society
for Hybrid Microelectronics for his contributions in establishing teaching and research
programs in multichip modules, electronic materials and processing, power electronics,
and high temperature electronics. He was instrumental in the start of the ISHM National
Technical Program Committee, Multichip Module Workshops and Conferences, as well as
professional development courses .
PROFESSIONAL ORGANIZATIONS
International Microelectronics and Packaging Society (IMAPS)
Technical Vice President 2000-2004
Vice President for Information Dissemination 1997-1999
Chairman of the Publications Committee 1997-1999
Technical Chair for the Flip Chip Advanced Technology Workshop 1999
Daniel C. Hughes Memorial Award, 1997
Fellow of the Society, 1994
John A. Wagnon Jr., Technical Achievement Award, 1993
First Past-President 1992
President 1991
President-Elect 1990
Southeast Regional Director 1987-1989
Chairman Executive Committee 1991
Awards Committee Chair 1992
Chair General for the 8th International Conference on Multichip Modules 1998
Co-Chair General for the 7th International Conference on Multichip Modules 1997
General for the 3nd International Conference on Multichip Modules 1994
Co-Chair General for the 2nd International Conference on Multichip Modules
1993
Technical Co-Chair for the 1st International Conference on Multichip Modules
1992
Session Chairman for the International Conference on Multichip Modules 1994,
1995, 1996
Technical Chairman for the Automotive Advanced Technology Workshop 1996
Session Chair for the MCM Advanced Technology Workshop 1990 and 1991
Faculty Advisor for Auburn University Student Chapter of ISHM 1987-Present
Associate Editor for the ISHM International Journal of Microcircuits and
Electronic Packaging, 1995, 1996, 1997, 1998
Editor of the International Journal for Hybrid Microelectronics 1980-1982
Publication Committee Chairman 1980-1982
Member of National Technical Committee 1993, 1994, 1995, 1996
Chairman of the Packaging Subcommittee (NTC) 1994, 1995
Session Chairman at ISHM Symposiums 1982, 1983, 1984, 1995, and 1996
President Tennessee Valley Chapter 1983 and 1987
President-Elect Tennessee Valley Chapter 1982
Vanderbilt Student Chapter President 1979, 1981
Institute of Electrical and Electronics Engineers (IEEE), Senior Member 1994,
Components, Hybrids, and Manufacturing Technology Society
Board of Govenors, 1994-1997
Surface Mount Technology Association, member 1994-present
Member of the Charles Hutchins Grant Committee
IPC, Auburn representative 1998-present
Interconnection Technology Research Institute, ITRI, Auburn representative 1999-2001
International Electronic Packaging Society (IEPS)
Board of Directors, 1994-1996
Vice President for Publications, 1995-1996
Nominations Committee, 1995
Eta Kappa Nu
Tau Beta Pi
Kentucky Colonel
PATENTS
"Automotive Electronics Test System" with Neil Borkowicz, David Muir, and John Evans
of Chrysler Corporation, Patent Number 543813, issued August 1, 1995.
PUBLICATIONS
Refereed Journal Articles (Published)
Jeffrey E. Naefe, R. Wayne Johnson, and Richard R. Grzybowski, High-Temperature
Storage and Thermal Cycling Studies of Heraeus-Cermalloy Thick Film and Dale Power
Wirewound Resistors, IEEE Transactions on Components and Packaging Technology,
Vol. 25, No. 1, March 2002, pp. 45-52.
Zhenwei Hou, Guoyun Tian, Casey Hatcher, R. Wayne Johnson, Erin Yaeger, Mark
Konarski and Larry Crane, Lead Free Solder Flip Chip-on-Laminate Assembly and
Reliability, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4,
October 2001, pp. 282-292.
Haiwei Peng, R. Wayne Johnson, George Flowers & Abbey-Gayle Ricketts, Erin Yeager,
Mark Konarski, Afranio Torres, and Larry Crane, Underfilling Fine Pitch BGAs, IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, October 2001, pp.
293-299.
Jing Qi, R. Wayne Johnson, Erin Yaeger, Mark Konarski, Todd Doody, Z. Andrew
Szczepaniak, and Larry Crane, Manufacturability Issues in Flip Chip on Laminate
Assembly, International Journal of Microcircuits and Electronic Packaging, Vol. 22,
No. 3, 3rd Qtr., 1999, pp. 270--279.
Lawrence Crane, Afranio Torres-Filho, Chris Ober, and Wayne Johnson, Development of
Reworkable Underfills, Materials, Reliability and Processing, IEEE Transactions on
Advanced Packaging, Vol. 22, No. 2, 1999.
Y. Zou, Jeffery Suhling, R. Wayne Johnson, R. C. Jaeger, and A. K. M. Mian, In-Situ
Stress State Measurements During Chip-on-Board Assembly, IEEE Transactions on
Electronics Packaging Manufacturing, Vol. 22, No. 1, 1999, pp. 38-52.
R. Wayne Johnson, Michael Palmer, Michael Bozack and Tamara Issac-Smith,
Thermosonic Gold Wire Bonding to Laminate Substrates with Palladium Finishes, IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 1, 1999, pp. 7-15.
R. Wayne Johnson, David Price, Dan Maslyk, Michael Palmer, Stuart Wentworth, Charles
Ellis, John Czarnowski and Justin Bolger, Patterned Adhesive Flip Chip Technology for
Assembly on Polyimide Flex Substrates, International Journal of Microcircuits and
Electronic Packaging, Vol 20, No. 3, 3rd Qtr., 1997, pp. 309-316.
Chris Dunn, R. Wayne Johnson, Mike Bozack, Cheryl Kromas, Joe Harris, and Marnie
Knadler, Thermosonic Gold Ball Bonding to Immersion Gold/Electroless Nickel Plating
Finishes on Laminate MCM Substrates, International Journal of Microcircuits and
Electronic Packaging, Vol 20, No. 3, 3rd Qtr., 1997, pp. 317-324.
Marcus Lankford, Kyle Davis, R. Wayne Johnson, M. E. Baginski, and Hayden Hontgas,
Electromagnetic Compatibility Design and Performance of Multichip Modules,
International Journal of Microcircuits and Electronic Packaging, Vol 20, No. 3, 3rd Qtr.,
1997, pp. 333-338.
Robert Newberry, R. Wayne Johnson, Larry Bosley, and John Evans, Analysis of an
MCM Implementation for an Automotive Controller, International Journal of
Microcircuits and Electronic Packaging, Vol 20, No. 3, 3rd Qtr., 1997, pp. 325-332.
R. M. Nelms and R. Wayne Johnson, 200oC Operation of a 500-W DC-DC Converter
Utilizing Power MOSFET s, The IEEE Transactions on Industrial Applications, Vol. 33,
No. 5, 1997, pp. 1267-1272.
Stuart M. Wentworth, Brian L. Dillaman, Jon R. Chadwick, Charles D. Ellis, and R.
Wayne Johnson, Attenuation in Silver-filled Conductive Epoxy Interconnects, The IEEE
Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol.
20, No. 1, 1997, pp. 52-59.
J. B. Casady and R. W. Johnson, Status of Silicon Carbide (SiC) as a Wide-Bandgap
Semiconductor for High Temperature Applications: A Review, Solid -State Electronics,
Vol. 39, No. 10, 1996, pp. 1409-1422.
J. B. Casady, W. C. Dillard, R. W. Johnson, and U. Rao, A Hybrid, 6H-SiC Temperature
Sensor Operational from 25oC to 500oC, The IEEE Transactions on Components,
Packaging and Manufacturing Technology - Part A, Vol.19, No. 3, September 1996, pp.
416-422.
J. B. Casady, J. D. Cressler, W. C. Dillard, R. W. Johnson, A. K. Agarwal, and R. R.
Siergiej, DC Characterization of Depletion-Mode 6H-SiC MOSFET s from 294K to
723K, Solid-State Electronics, Vol. 39, No. 6, June 1996, pp. 777-784.
J. B. Casady, E. D. Luckowski, M. Bozack, D. Sheridan, R. W. Johnson, and J. R.
Williams, Etching of 6H-SiC and 4H-SiC Using NF3 in a Reactive Ion Etching System,
Journal of the Electrochemical Society, Vol. 143, No. 5, May 1996, pp. 1750-1753.
J. B. Casady, W. Dillard, R. W. Johnson, A. K. Agarwal, R. R. Siergiej, and W. E.
Wagner, "Low Frequency Noise in 6H-SiC MOSFETs," IEEE Electron Device Letters.,
Vol. 16, No. 6, June 1995, pp. 274-276.
John L. Evans, Larry Bosley, and R. Wayne Johnson, "MCM-L Technology: System Cost
Comparisons for High Volume Automotive Electronics," IEEE Transactions on
Components, Hybrids and Manufacturing Technology Part B: Advanced Packaging, Vol.
18, No. 1, February 1995, pp. 28-32.
Jon Aday, R. Wayne Johnson, John L. Evans, and Chris Romanczuk, "Wire Bonded Thick
Film Silver Multilayers for Under-the-Hood Automotive Applications," The International
Journal of Microcircuits and Electronic Packaging, Vol. 15, No. 3, 1994, pp. 302-311.
Richard C. Jaeger, Jeffrey C. Suhling, Martin T. Carey, and R. Wayne Johnson, "Off-Axis
Sensor Rosettes for Measurement of the Piezoresistive Coefficients of Silicon," IEEE
Transactions on Transactions on Components, Hybrids, and Manufacturing Technology,
Vol. 16, No. 8, December 1993, pp. 925-931.
R. Wayne Johnson, G. Bennett Weir, and James R. Bromstead, "200oC Operation of
Semiconductor Power Devices," IEEE Transactions on Transactions on Components,
Hybrids, and Manufacturing Technology, Vol. 16, No. 7, November 1993, pp. 759-764.
Miro Tomana, R. Wayne Johnson, Richard C. Jaeger, and William C. Dillard, "A Hybrid,
Silicon Carbide Differential Amplifier for 350oC Operation," IEEE Transactions on
Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 16, No. 5,
August 1993, pp. 536-542.
R. E. Beaty, R. C. Jaeger, J. C. Suhling, R. W. Johnson, and R. D. Butler, "Evaluation of
Piezoresistive Coefficient Variation in Silicon Stress Sensors Using a Four Point Bending
Test Fixture", IEEE Transactions on Components, Hybrids and Manufacturing
Technology, Vol. 15, No. 5, October 1992, pp. 904-914.
Kevin D. Robb and R. Wayne Johnson, "Analysis of Slot-Fed Microwave Feed Structures
Using the Transmission Line Matrix (TLM) Method", The International Journal of
Microcircuits and Electronic Packaging, Vol. 15, No. 2, Second Quarter 1992, pp. 103-
112.
R. Ramesham, T. Roppel, R. W. Johnson, and J. M. Chang, "Characterization of
Polycrystalline Diamond Thin Films Grown on Various Substrates, Thin Solid Films, Vol.
212, Nos. 1-2, May 1992, pp. 96-103.
R. W. Johnson, E. L. Thomas, R. Duren, D. W. Curington, and A. C. Lippincott,
"Insulated Metal Substrates for the Fabrication of a Half-Bridge Power Hybrid", IEEE
Transactions on Components, Hybrids and Manufacturing Technology, Vol. 14, No. 4,
December 1991, pp. 886-893.
D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, and R. W. Johnson, "Piezoresistive
Stress Sensors for Structural Analysis of Electronic Packages", Journal of Electronic
Packaging, Vol. 113, No. 3, September 1991, pp. 203-214.
Kevin D. Robb, Fred J. German, Stuart M. Wentworth, and R. Wayne Johnson, "Analysis
of Microstrip Resistors Using the Transmission Line Matrix (TLM) Method",
International Journal for Hybrid Microelectronics, Vol. 14, No. 2, June 1991, pp. 62-69.
C. L. Chen, R. Wayne Johnson, R. C. Jaeger, M. B. Cornelius and W. A. Foster,
"Packaging Technology for a Low Temperature Astrometric Sensor Array, IEEE
Transactions on Components, Hybrids and Manufacturing Technology, Vol. 13, No. 4,
December 1990, pp. 1083-1089.
F. German and R. Wayne Johnson, Full Wave Three-Dimensional Simulation of
Maxwell s Equations for the Electrical Characterization of High-Speed Interconnects,
IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 13, No.
2, June 1990, pp. 341-346.
R. Wayne Johnson, T. L. Phillips, K. Weidner, S. F. Hahn, D. C. Burdeaux and P.
Townsend, Benzocyclobutene Interlayer Dielectrics for Thin Film Multichip Modules,
IEEE Transactions on Components, Hybrids and Manufacturing Technology. Vol. 13,
No. 2, June 1990, pp. 347-352.
T. A. Baginski and R. Wayne Johnson, A Novel RF Insensitive EED Utilizing a Balanced
Reactive Bridge, IEEE Transactions on Electromagnetic Compatibility, Vol. 32, No. 1,
February 1990, pp. 69-73.
R. Wayne Johnson, R. Weeks, D. Hopkins, J. Muir, and J. Williams, Plated Copper on
Ceramic Substrates for Power Hybrid Circuits, IEEE Transactions on Components,
Hybrids and Manufacturing Technology, Vol. 12, No. 4, December 1989, pp. 530-536.
R. Wayne Johnson, T. L. Phillips, R. C. Jaeger, S. F. Hahn and D. C. Burdeaux,
Multichip Thin Film Technology on Silicon, IEEE Transactions on Components,
Hybrids, and Manufacturing Technology, Vol. 12, No. 2, June 1989, pp. 185-194.
R. Wayne Johnson, Michael Cornelius, Jimmy L. Davidson and Richard C. Jaeger, Planar
Hybrid Interconnection Technology, International Journal for Hybrid Microelectronics,
Vol. 10, No. 1, 1st Quarter, 1987.
R. Wayne Johnson, Jim Davidson, Richard Jaeger and David Kerns, Silicon Hybrid
Wafer Scale Package Technology, IEEE Journal of Solid State Circuits, October 1986,
pp. 845-851.
R. Wayne Johnson, P. W. Rich, D. D. Rich and L. K. Wilson, Advances in Thick Film
Conductors for Microwave Integrated Circuits, Electro Component Science and
Technology, Vol. 6, Nos. 3 and 4, 1980.
R. Wayne Johnson, Larry Wilson and Donald Kinser, Characterization of Thermal
Compression Wire Bonds to Thick Film Conductors on Porcelain Substrates, IEEE
Transactions on Components, Hybrids and Manufacturing Technology, Vol. 2, No. 3,
September 1979, pp. 288-293.
Refereed Journal Articles (Accepted for publication)
S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith and M. J. Bozack, Wetting
Characteristics of some Pb-free Solder alloys and PWB Finishes, accepted by the IEEE
Transactions on Electronics Packaging Manufacturing.
Yun Zhang, Renzhe Zhao, Daniel K. Harris, and R. Wayne Johnson, A Computational
Study On Solder Bump Geometry, Normal, Restoring, And Fillet Forces During Solder
Reflow In The Presence Of Liquefied Underfill, accepted by the IEEE Transactions on
Electronics Packaging Manufacturing.
Yida Zou, R. Wayne Johnson, Jeffery C. Suhling, Joe Harris, Cheryl Kromis, Iftikhar
Ahmad, Denise Tucker, Zak Fathi, Die Level Stress with Convection and Variable
Frequency Microwave Encapsulant Curing for Chip-on-Board Assembly, accepted by the
International Journal of Microcircuits and Electronic Packaging.
Ahsan Mian, Jeffrey C. Suhling, R. Wayne Johnson and Richard C. Jaeger, Measurement
of Backside Flip Chip Die Stresses Using Piezoresistive Test Die, accepted by the
International Journal of Microcircuits and Electronic Packaging.
Refereed Journal Articles (Submitted for publication)
Jing Liu & R. Wayne Johnson, Erin Yaeger, Mark Konarski and Larry Crane, Processing
and Reliability of CSPs with Underfill, submitted to the IEEE Transactions on
Electronics Packaging Manufacturing.
Renzhe Zhao, R. Wayne Johnson, Greg Jones, Erin Yaeger, Mark Konarski, Paul Krug
and Larry Crane, Processing of Fluxing Underfills for Flip Chip-on-Laminate Assembly,
submitted to the IEEE Transactions on Electronics Packaging Manufacturing.
Invited Lectures
"High Temperature Electronics Packaging", National Research Council Committee on
Materials for High-Temperature Semiconductor Devices, Washington D.C., February 10,
1994.
"Silicon Multichip Modules", Multichip Module Seminar - IEEE Society for Components,
Hybrids, and Manufacturing Technology, April 13, 1991, San Diego, CA.
A Review of High Temperature Electronics Packaging, High Temperature Electronics
Workshop, June 1989.
Thin Film Silicon Hybrids, VLSI and GaAs Packaging Workshop, September 1988.
Books and Book Chapters
Chapter 19: Flip Chip Assembly and Underfilling in the Handbook of Area Array
Packaging published to McGraw Hill, 2001.
Hybrid Assembly and Packaging, R. Wayne Johnson, Chapter 8 in High Temperature
Electronics, edited by Randall Kirschman, IEEE Press, 1998.
Automotive Multichip Modules, R. Wayne Johnson and John L. Evans, Chapter 15,
Advanced Electronic Packaging, edited by William D. Brown, IEEE Press, 1998.
Assembly, R. Wayne Johnson, Chapter 8 in Multichip Module Technology Handbook,
edited by Iwona Turlik and Philip Garrou, McGraw-Hill, New York, NY 1997.
"Introduction to Hybrid Microelectronics", R. Wayne Johnson, Chapter 1 in the Handbook
of Hybrid Microelectronics, 2nd Edition, edited by Jerry Sergent and Charles Harper,
McGraw-Hill, Inc., New York, NY, 1994
"Silicon Multichip Modules", R. Wayne Johnson, Chapter 16 in Multichip Module
Technologies and Alternatives - The Basics, edited by D. A. Doane and Paul Franzon, Van
Nostrand Reinhold, New York, NY, 1992.
Multichip Modules: Systems Advantages, Major Constructions, and Materials
Technologies, edited by R. Wayne Johnson, Robert Teng, and John Balde, IEEE Press,
New York, NY, 1991.
Modular Series in Hybrid Microelectronics, edited by R. Wayne Johnson, The
International Society for Hybrid Microelectronics, Reston, VA, 1991.
"Introduction to Hybrid Microelectronics", R. Wayne Johnson, Chapter 1 in Modular
Series in Hybrid Microelectronics, edited by R. Wayne Johnson, The International Society
for Hybrid Microelectronics, Reston, VA, 1991.
"Wafer-Scale Multichip Packaging Technology", R. Wayne Johnson, Richard C. Jaeger,
and Travis N. Blalock, Chapter 10 in Wafer Scale Integration, edited by Earl E.
Swarzlander, Jr., Kluwer Academic Press, Boston, 1989.
Advisory Board
Advanced Packaging, Lake Publishing Corporation, Libertyville, Illinois.
Editorial Board
Associate Editor - The International Journal of Microcircuits and Electronic Packaging
Associate Editor - IEEE Transactions on Electronics Packaging Manufacturing
Papers at Professional Meetings
Jeffrey C. Suhling, R. Wayne Johnson, John L. Evans, Nokibul Islam, Jing Lui, and
Shyam Gale, Reliability of Small BGAs in the Automotive Environment, Proceedings of
the 35th International Symposium on Microelectronics, Denver, CO, September 4-6, 2002,
pp. 524 532. Winner of the Best Paper of Symposium Award .
Tan Zhang and R. Wayne Johnson, Assembly on Liquid Crystal Polymer (LCP)
Substrates for Advanced Packaging, accepted for the 35th International Symposium on
Microelectronics, Denver, CO, September 4-6, 2002, pp. 1-9.
Robert Dean, R. Wayne Johnson, Holly Garison, Nicole Schutz, Mike Kranz, Ron
Legowik, Bill Bowers, and Bill Payne, Strategies for Successfully Integrating MEMS Die
onto Laminate, Proceedings of the 35th International Symposium on Microelectronics,
Denver, CO, September 4-6, 2002, pp. 109-114.
R. Wayne Johnson, John L. Evans, Peter Jacobsen, and Rick Thompson, High
Temperature Automotive Electronics, Proceedings of the International Conference on
Advanced Packaging and Systems, Reno, NV, March 10-13, 2002, pp. 77-87.
Wayne Johnson, Qing Wang, Fei Ding, Renzhe Zhao, Larry Crane, Mark Konarski, Erin
Yaeger, Afranio Torres, Marc Chason, Jan Danvir, Nadia Yala, Jing Qi, and Prasanna
Kulkanari, Wafer Applied Underfills for Flip Chip Assembly, Proceedings of the
International Conference on Advanced Packaging and Systems, Reno, NV, March 10-13,
2002, pp. 195-205. Winner of the Best Paper of Conference Award .
Jing Qi, Prasanna Kulkarni, Nadia Yala, Jan Danvir, Marc Chason,R. Wayne Johnson,
Renzhe Zhao, Larry Crane, Mark Konarski, Erin Yaeger, Afranio Torres, Rebecca
Tishkoff, and Paul Krug Assembly of Flip Chips Utilizing Wafer Applied Underfill,
Proceedings of the 2002 APEX Technical Program, January 19-24, 2002, San Diego, CA,
pp. S18-3-1 to S18-3-7.
Jing Liu, R. Wayne Johnson, Erin Yaeger, Mark Konarski and Larry Crane, CSP
Underfill, Processing and Reliability, Proceedings of the 2002 APEX Technical Program,
January 19-24, 2002, San Diego, CA, pp. S16-1-1 to S16-1-7.
Larry Crane, Mark Konarski, Erin Yaeger, Afranio Torres, Rebecca Tishkoff, Paul Krug,
Steve Bauman,Wayne Johnson, Prasanna Kulkanari, Renzha Zhao, Marc Chason, Jan
Danvir, Nadia Yala, and Jing Qi, Development of Wafer Scale Applied Reworkable
Fluxing Underfill for Direct Chip Attach, Part II, Proceedings of the 2002 APEX
Technical Program, January 19-24, 2002, San Diego, CA, pp. S36-2-1 to S36-2-6.
Renzhe Zhao, R. Wayne Johnson, Greg Jones, Erin Yaeger, Mark Konarski, Paul Krug
and Larry Crane, Processing of Fluxing Underfills for Flip Chip-on-Laminate
Assembly, Proceedings of the 2002 APEX Technical Program, January 19-24, 2002, San
Diego, CA, pp. S18-1-1 to S18-1-7.
Erin Yaeger, Z. Andrew Szczepaniak, Mark Konarski, Larry Crane, Zhenwei Hou,
Guoyun Tian, and R. Wayne Johnson, Underfill Materials, Processing and Reliability for
Fine Pitch Flip Chip on Laminate Assembly, Proceedings of the 2002 APEX Technical
Program, January 19-24, 2002, San Diego, CA, pp. S17-3-1 to S17-3-6.
S. V. Sattiraju, B. Dang, R. W. Johnson, Y. Li, J. S. Smith and M. J. Bozack,"Wetting
Characteristics of Pb-free Solder Pastes and Pb-free PWB Finishes," Proceedings of the
51st IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL.
May 29 - June 1 2001, S37p12
Renzhe Zhao, Yun Zhang, R. Wayne Johnson, Daniel K. Harris, A Study of Normal,
Restoring, and Fillet Forces and Solder Bump Geometry during Reflow in Concurrent
Underfill/Reflow Flip Chip Assembly, 51st IEEE Electronic Components and Technology
Conference, Lake Buena Vista, FL. May 29 - June 1 2001,
Zhenwei Hou, Casey Hatcher, R. Wayne Johnson, Erin Yaeger, Mark Konarski and Larry
Crane, Assembly and Reliability of Flip Chip-on-Laminate with Lead Free Solder,
Proceedings of the 2001 HD International Conference, Santa Clara, CA April 18-20,
2001, pp. 323-330. Received Best Paper of Conference Award.
Nael Hannan, Puligandla Viswanadham, Larry Crane, Erin Yaeger, Afranio Torres, and R.
Wayne Johnson, Reworkable Underfill Materials For Improved Manufacturability And
Reliability Of Csp Assemblies, Proceedings of the 2001 APEX Conference, San Diego,
CA, January 14-18, 2001, pp. AT8-3-1 AT8-3-10.
Wayne Johnson, Roger Lugo, Seshu V. Sattiraju, and Greg Jones, Improved Thermal
Process Control for Lead-free Assembly, Proceedings of the 2001 APEX Conference, San
Diego, CA, January 14-18, 2001, pp. LF1-2-1 LF1-2-10.
Larry Crane, Mark Konarski, Erin Yaeger, Paul Neathway, Ken Tojima, Marc Chason, Jan
Danvir, Nadia Yala, Jing Qi, Wayne Johnson, and Prasanna Kulkarni, Development of
Wafer Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach, Proceedings
of the 2001 APEX Conference, San Diego, CA, January 14-18, 2001, pp. AT6-1-1 AT6-
1-5.
S.V.Sattiraju, R.W.Johnson, D.Z.Genc and M.J.Bozack, "Wetting Performance of Several
Lead-free Board Finishes and Solder Alloys", IPCWorks 2000 Proceedings, Sept 9-14,
2000, Miami pp. S-01-2-1 to S-01-2-12.
S. Sattiraju, R. W. Johnson, D. Genc, and M. J. Bozack, Wetting Performance vs Flux
and Board Finish for Several No-Pb Solder Alloys, Proceedings of the 25th International
Electronics Manufacturing Technology (IEMT) Symposium, Santa Clara, CA, Oct 2-3,
2000, pp. 253-262.
R. Wayne Johnson, Shannon Pan, Mike Palmer and Robert Dean, Conductive Adhesives
for Under-the-Hood Automotive Applications, Proceedings of the 5th International High
Temperature Electronics Conference, June 12-15, 2000, Albuquerque, NM.
Zhenwei Hou, R. Wayne Johnson, Erin Yaeger, Mark Konarski, and Larry Crane,
Compatibility of Current Flipchip Process with Lead Free Solder Bumps, Proceedings
of the 37th IMAPS Nordic Annual Conference, Helsing r, Denmark, September 10 13,
2000, pp. 123-127.
Larry Crane, Afranio Torres, Erin Yaeger and R. Wayne Johnson, Reworkable Underfill
Development, Processing and Reliability, Proceedings of the 3rd Annual HDI Expo,
Phoenix, AZ, September 25-27, 2000, pp. 65-70.
R. Wayne Johnson, Shannon Pan, Mike Palmer and Robert Dean, Conductive Adhesives
th
for Under-the-Hood Automotive Applications, Proceedings of the 5 International High
Temperature Electronics Conference, June 12-15, 2000, Albuquerque, NM.
Haiwei Peng, R. Wayne Johnson, George Flowers, Erin Yeager, Mark Konarski, Afranio
Torres, and Larry Crane, Underfilling Micro-BGAs, Proceedings of the International
Conference on High-Density Interconnect and Systems Packaging, Denver CO, April 25-
28, 2000, pp. 134-140.
Prasanna Kulkarni, R. Wayne Johnson, Erin Yaeger, Mark Konarski, Afranio Torres, Paul
Krug and Larry Crane, Manufacturing of Flip Chip-on-Laminate, Proceedings of the
APEX Technical Program, Long Beach, CA, March 12-16, 2000, pp. P-AP3/2/1 5.
Ahsan Mian, Jeffrey C. Suhling, R. Wayne Johnson and Richard C. Jaeger, Measurement
of Backside Flip Chip Die Stresses Using Piezoresistive Test Die, Proceedings of the
1999 International Microelectronics Symposium, October 26-28, 1999, Chicago, IL.
Yida Zou, R. Wayne Johnson, Jeffery C. Suhling, Joe Harris, Cheryl Kromis, Iftikhar
Ahmad, Denise Tucker, Zak Fathi, Comparison of Die Level Stress with Convection and
Variable Frequency Microwave Encapsulant Curing for Chip-on-Board, Proceedings of
the 1999 International High Density Packaging and MCM Conference, Denver, CO, April
6-9, 1999, pp. 77-16. Winner of Best Paper of Conference Award
Jing Qi, R. Wayne Johnson, Erin Yaeger, Mark Konarski, Todd Doody, Z. Andrew
Szczepaniak and Larry Crane, Flip Chip on Laminate Manufacturability, Proceedings of
the 1999 International High Density Packaging and MCM Conference, Denver, CO, April
6-9, 1999, pp. 345-352. Winner of Best Paper of Outstanding Paper of Conference
Award
R. Wayne Johnson, Vicky Wang, and Michael Palmer, Thermal Cycle Reliability of
Solder Joints to Alternate Plating Finishes, Proceedings of the 1998 Surface Mount
International Conference, San Jose, CA, August 25-27, 1998.
C. S. White, R. M. Nelms, R. W. Johnson, and R. R. Grzybowski, High Temperature
Electronic Systems Using Silicon Semiconductors, Conference Record of the 1998
Industry Applications Society Thirty-Third IAS Annual Meeting, Vol. 2, October 1998, pp.
967-976.
Jeffrey E. Naefe, R. Wayne Johnson, and Richard R., Grzybowski, High-Temperature
Storage and Thermal Shock Studies of Passive Component Attach Materials, Proceedings
of the 4th International High Temperature Electronics Conference, Albuquerque, NM,
June 16-19, 1998, pp. 68-78.
Jeffrey E. Naefe, R. Wayne Johnson, and Richard R.Grzybowski, High-Temperature
Storage and Thermal Cycling Studies of Heraeus-Cermalloy Thick Film and Dale Power
Wirewound Resistors, Proceedings of the 4th International High Temperature Electronics
Conference, Albuquerque, NM, June 16-19, 1998, pp. 191-206.
Jay S. Salmon, R. Wayne Johnson, and Mike Palmer, Thick Film Hybrid Packaging
Techniques for 500oC Operation, Proceedings of the 4th International High Temperature
Electronics Conference, Albuquerque, NM, June 16-19, 1998, pp. 103-108.
R. Wayne Johnson, M. Albert Capote, Sherry Zhu, Ligui Zhou, and Bing Gao, Reflow-
Curable Polymer Fluxes for Flip Chip Encapsulation, Proceedings of the International
Conference and Exhibition on Multichip Modules and High Density Packaging, Denver,
CO, April 15-17, 1998, pp. 41-46..
R. Wayne Johnson, Michael Palmer, Michael Bozack and Tamara Issac-Smith,
Thermosonic Gold Wire Bonding to Palladium Finishes on Laminate Substrates,
Proceedings of the International Conference and Exhibition on Multichip Modules and
High Density Packaging, Denver, CO, April 15-17, 1998, pp. 291-299.
Y. Zou, Jeffery Suhling, R. Wayne Johnson, and R. C. Jaeger, Complete Stress State
Measurements in Chip on Board Packages, Proceedings of the International Conference
and Exhibition on Multichip Modules and High Density Packaging, Denver, CO, April 15-
17, 1998, pp. 405-415.
R. Wayne Johnson, M. Albert Capote, Z. Ming Zhou, Sheery Chu, and Ligui Zhou,
Reflow-Curable Polymer Fluxes for Flip Chip Assembly, Proceedings of Surface Mount
International Technical Program, San Jose, CA September 7-11, 1997, pp. 267-272.
S. T. Lin, J. C. Suhling, R. W. Johnson, B. Han, and J. L. Evans, Finite Element and
Moire Interferometry Study of Chip Capacitor Reliability, Proceedings of InterPACK
97, Hawaii, June 15-19, 1997.
John L. Evans, Robert Newberry, Larry Bosley, Steven G. McNeal, Andrew Mawer, R.
Wayne Johnson, and Jeff Suhling, PBGA Reliability for Under-the-Hood Automotive
Applications, Proceedings of InterPACK 97, Hawaii, June 15-19, 1997.
R. Wayne Johnson, The Student Factory at Auburn University, Proceedings of the 47th
Electronic Components and Technology Conference, San Jose, CA, May 19-21, 1997, pp.
589-592.
J. Naefe, M. Palmer, M. Lankford, and W. Johnson, High Temperature Characterization
of Heraeus-Cermalloy Thick Film and Dale Power Wirewound Resistors, Proceedings of
the 17th Capacitor and Resistor Technology Symposium, Jupiter Beach, FL, March 24-27,
1997, pp 244-250.
R. Wayne Johnson, David Price, Dan Maslyk, Michael Palmer, Stuart Wentworth, Charles
Ellis, John Czarnowski and Justin Bolger, Adhesive Based Flip Chip Technologies for
Assembly on Polyimide Flex Substrates, Proceedings of the 1997 International
Conference on Multichip Modules, Denver, CO, April 2-4, 1997, pp. 81-86, Best Paper of
Session Award.
Chris Dunn, R. Wayne Johnson, Mike Bozack, Cheryl Kromas, Joe Harris, and Marnie
Knadler, Thermosonic Gold Ball Bonding to Alternate Plating Finishes on Laminate
MCM Substrates, Proceedings of the 1997 International Conference on Multichip
Modules, Denver, CO, April 2-4, 1997, pp. 170-176, Best Paper of Session Award.
Marcus Lankford, Kyle Davis, R. Wayne Johnson, M. E. Baginski, and Hayden Hontgas,
Investigation of Design and Performance of Multichip Modules Including
Electromagnetic Compatibility, Proceedings of the 1997 International Conference on
Multichip Modules, Denver, CO, April 2-4, 1997, pp. 187-192.
Robert Newberry, Larry Bosley and R. Wayne Johnson, A Comparative Analysis of a
MCM Implementation for an Automotive Controller, Proceedings of the 1997
International Conference on Multichip Modules, Denver, CO, April 2-4, 1997, pp. 323-
328.
Brian L. Dillaman, Stuart M. Wentworth, and R. Wayne Johnson, Attenuation and
Reliability of Conductive Adhesive Interconnects, Proceedings of the 1996 Electronics
Packaging Conference, Austin, TX, Sept. 29-Oct. 1, 1996, pp. 130-139.
John M. Czarnowski, Mark E. S. Reynolds, Justin C. Bolger, Matthew T. Hayes, Charles
D. Ellis, R. Wayne Johnson, and Michael J. Palmer, Evaluation of Area Bonding
Conductive Adhesives for Flip Chip Attach of Area Bonded Die, Proceedings of the 1996
International Electronics Manufacturing Technology Symposium, Austin, TX, Oct. 14-16,
1996, pp. 476-481.
W. C. Dillard, J. B. Casady, R. C. Jaeger, D. C. Sheridan, and R. W. Johnson, High-
o
Temperature (623 K), 4H-SiC, Thick-Film, Hybrid Operational Amplifier: Design,
Fabrication, and Performance, Proceedings of the 3rd International High Temperature
Electronics Conference, Albuquerque, NM, June 9-14, 1996, pp. VIII-15 - 20.
J. B. Casady, R. W. Johnson, Charles D. Ellis, Rongxiang Hu, Chin-Che Tin, Tamara
Isaacs-Smith, W. C. Neely, and T. Kwasigro, High Temperature Performance of
Dielectrics on Silicon Carbide for Use in Device Passivation and Gate Dielectric,
Proceedings of the 3rd International High Temperature Electronics Conference,
Albuquerque, NM, June 9-14, 1996, pp. IX-27 - 32.
David C. Sheridan, Charles D. Ellis, William C. Dillard, and R. Wayne Johnson,
Evaluation of Si3N4/SiO2 Stack, and Commercially Available MOS Capacitors for High
Temperature Electronics, Proceedings of the 3rd International High Temperature
Electronics Conference, Albuquerque, NM, June 9-14, 1996, pp. VI-27 - 32.
William Dillard, Jeffery Naefe, Michael Palmer, and R. Wayne Johnson, A Test Fixture
for High Temperature, Low Noise Testing of Electronic Components, Proceedings of the
3rd International High Temperature Electronics Conference, Albuquerque, NM, June 9-
14, 1996, pp. XIV-9 - 14.
Eric D. Luckowski, John R. Williams, Chin-Che Tin, Rongxing Hu, J. B. Casady, R. W.
Johnson, High Temperature Performance of 4H and 6H-SiC MESFETs for Small Signal
Analog Applications, Proceedings of the 3rd International High Temperature Electronics
Conference, Albuquerque, NM, June 9-14, 1996, pp. P-101 - 106.
Jeffery E. Naefe, M. J. Palmer, R. Wayne Johnson, and R. R. Grzybowski, High
Temperature Performance of Thick Film and Wire Wound Resistors, Proceedings of the
3rd International High Temperature Electronics Conference, Albuquerque, NM, June 9-
14, 1996, pp. P-107 - 112.
J. B. Casady, D. C. Sheridan, W. C. Dillard, and R. W. Johnson, Characterization of 4H-
o
SiC Jets for Use in Analog Amplifiers Capable of 723 C Operation, Proceedings of the
1996 Spring Meeting of the Materials Research Society, San Francisco, CA April 8-12,
1996.
R. Wayne Johnson, Roy W. Knight, and Jeffrey C. Suhling, Thermo-Mechanical Analysis
of Metal Backed Circuit Boards, Proceedings of the 1st Conference on Commercial
Development of Space, Albuquerque, NM, Jan 7-11, 1996, pp. 245-250.
E. D. Luckowski, J. B. Casady, J. R. Williams, and R. W. Johnson, Electrical
Characterization and Charge Transport in 6H-SiC Misfit s, Proceedings of the 1st
Conference on Commercial Development of Space, Albuquerque, NM, Jan 7-11, 1996, pp.
251-256.
J. B. Casady, W. C. Dillard, R. W. Johnson, A. K. Agarwal, and R. R. Siergiej, DC and
o o
Low Frequency Noise Characterization of 6H-SiC MOSFET s from 25 C to 350 C,
Proceedings of the 6th International Conference on SiC and Related Materials, Kyoto,
Japan, Sept. 18-21, 1995.
J. B. Casady, E. D. Luckowski, M. Bozack, D. Sheridan, R. W. Johnson, and J. R.
Williams, Fabrication Procedures and Characterization of 6H-SiC Misfit s for Use in
High Temperature Electronics, Proceedings of the 6th International Conference on SiC
and Related Materials, Kyoto, Japan, Sept. 18-21, 1995.
J. B. Casady, R. W. Johnson, and W. C. Dillard, "Characterization of 6H-SiC JFETs for
Use in a Temperature Monitor Operating from 25oC to 350oC," Proceedings of the 45th
Electronic Components and Technology Conference, Las Vegas, NV, May 21-24, 1995.
J. B. Casady, E. D. Luckowski, R. W. Johnson, J. Crofton, and J. R. Williams,
"Fabrication Procedures and Characterization of 6H-SiC MESFETs for Use in High
Temperature Electronics, Proceedings of the 45th Electronic Components and Technology
Conference, Las Vegas, NV, May 21-24, 1995.
R. Wayne Johnson, Marnie Knadler, George Petrovic, Chauvet Parker, Jay Desai, Larry
Bosley, Mike Witty and Kevin Prodromides, "Consortium for Automotive Electronics: An
Approach to MCM Technology Development," Proceedings of the 4th International
Conference on Multichip Modules, Denver, CO, April 19-21, 1995.
John L. Evans, Larry E. Bosley, Chris Romanczuk, and R. Wayne Johnson, "MCM
Packaging Alternatives for Automotive Electronics: Comparing Fine Pitch, Ball Grid
Array, and Polyimide Chip Carriers," Proceedings of the 4th International Conference on
Multichip Modules, Denver, CO, April 19-21, 1995.
J. D. White, J. C. Suhling, R. W. Johnson, R. W. Knight, and C. S. Romanzcuk,
"Reliability of Plastic Quad Flat Pack Solder Joints in Potted Automotive Engine
Controllers," Proceedings of the 1994 International Symposium on Microelectronics,
Boston, MA, Nov. 1994.
R. Mark Nelms, David W. Campbell, and R. Wayne Johnson, "200oC Operation of a
500W DC-DC Converter Utilizing Power MOSFET's," Proceedings of the 1994 IEEE IAS
Annual Meeting, Denver, CO.
R. Mark Nelms, David W. Campbell, and R. Wayne Johnson, "Design of a DC-DC
Converter for Operation at 200oC", Proceedings of the Second International High
Temperature Electronics Conference, Charlotte, NC, June 5-10, 1994.
John L. Evans, Chris Romanczuk, Larry Bosley, and R. Wayne Johnson, "High
Temperature Requirements for Automotive Electronic Controllers," Proceedings of the
Second International High Temperature Electronics Conference, Charlotte, NC, June 5-
10, 1994.
Kang, Y. L., Suhling, J. C., Johnson, R. W. and Jaeger, R. C., "Silicon and Silicon Carbide
Stress Sensors for Application to Electronic Packaging," Proceedings of the 1994 SEM
Spring Conference on Experimental Mechanics, pp. 311-320, Baltimore, MD, June 6-8,
1994.
Jeff C. Suhling, R. Wayne Johnson, Jeff D. White, Kevin W. Matthai, Chris S.
Romanczuk, John L. Evans, and Steve W. Burcham, "Solder Joint Reliability of Surface
Mount Chip Resistors/Capacitors on Insulated Metal Substrates," Proceedings of the 44th
Electronic Components and Technology Conference, Washington D.C. May 2-4, 1994.
John L. Evans, Larry Bosley, and R. Wayne Johnson, "MCM-L Technology: System Cost
Comparisons for High Volume Automotive Electronics," Proceedings of the International
Conference on Multichip Modules, Denver, CO, April 13-15, 1994.
R. Wayne Johnson, Jon Aday, John L. Evans, and Chris S. Romanczuk, 'Using MCM-L
Technology for Under-the-Hood Automotive Environmental Conditions," Proceedings of
the 1993 International Symposium on Microelectronics, Dallas, TX, November 9-11,
1993, pp. 584-588.
Roy W. Knight, R. Wayne Johnson, Chris S. Romanczuk, Stephen W. Burcham, and John
L. Evans, "Finite Element Analysis of the Thermal Characteristics of an Automotive
Powertrain Controller," Proceedings of the 1993 International Symposium on
Microelectronics, Dallas, TX, November 9-11, 1993, pp. 650-655.
Jon Aday, R. Wayne Johnson, John L. Evans, and Chris S. Romanczuk, "Thick Film
Silver Multilayers for Under-the-Hood Automotive Applications," Proceedings of the
1993 International Symposium on Microelectronics, Dallas, TX, November 9-11, 1993,
pp. 126-131.
Richard C. Jaeger, Jeffrey C. Suhling, Martin T. Carey, and R. Wayne Johnson, "A
Piezoresistive Sensor Chip for Measurements of Stress in Electronic Packaging",
Proceedings of the 43th Electronic Components and Technology Conference, Lake Buena
Vista, FL, June 2-4, 1993.
David S. Meir, Neil Borkowicz, John L. Evans, and R. Wayne Johnson, "Using MCM
Technology to Enhance the Development of Electronic Control Modules", Proceedings of
the International Conference on Multichip Modules, Denver, CO, April 14-16, 1993.
James R. Bromstead, G. Bennett Weir, and R. Wayne Johnson, "200oC Operation of
Semiconductor Power Devices", Proceedings of the Tenth Symposium on Space Nuclear
Power and Propulsion, Albuquerque, NM, January 10-14, 1993, pp. 617-623.
Miro Tomara, R. Wayne Johnson, Richard C. Jaeger, and John Palmour, "A SiC, Hybrid
Operational Amplifier for 350oC Operation", Proceedings of the 42th Electronic
Components and Technology Conference, San Diego, CA, May 18-20, 1992, pp. 157-161.
Richard C. Jaeger, Jeff C. Suhling, and R. Wayne Johnson, "Errors Associated with the
Design, Calibration, and Application of Silicon Piezoresistance Stress Sensors",
Proceedings of the First Joint Conference on Electronic Packaging, Milpitas, CA, April
8-12, 1992.
James Bromstead, G. Bennett Weir, R. Wayne Johnson, Richard C. Jaeger, and Eric
Baumann, "Performance of Power Silicon Devices at High Temperature", Proceedings of
the First International High Temperature Electronics Conference, June 16-20, 1991.
Martin Carey, Jeff C. Suhling, and R. Wayne Johnson, "Piezoresistive Stress Sensors for
High Temperature Microelectronics", Proceedings of the First International High
Temperature Electronics Conference, June 16-20, 1991.
Jeff C. Suhling, Robert E. Beaty, Richard C. Jaeger, and R. Wayne Johnson,
"Piezoresistive Sensors for Measurement of Thermally-Induced Stresses in
Microelectronics", Proceedings of the 1991 SEM Spring Conference on Experimental
Mechanics, June 1991.
E. Thomas, M. Weil, A. Lippincott, and R. W. Johnson, "Insulated Metal Substrates for
Power Hybrids", Proceedings of the 1990 International Symposium in Microelectronics,
October 15-17, 1990, pp. 329-337.
K. D. Robb, F. J. German, and R. W. Johnson, "Modeling Thick Film Resistor
Configurations at Microwave Frequencies Using the Transmission Line Matrix (TLM)
Method", Proceedings of the 1990 International Symposium in Microelectronics, October
15-17, 1990, pp. 513-517.
C. Chen, R. W. Johnson, R. C. Jaeger, M. B. Cornelius, and W. A. Foster, "Multichip
Thin-Film Technology for Low Temperature Packaging", Proceedings of the 40th
Electronic Components and Technology Conference, Las Vegas, NV, May 20-23, 1990,
pp. 571-579.
R. E. Beaty, J. C. Suhling, C. A. Moody, D. A. Bittle, R. W. Johnson, R. D. Butler, R. C.
Jaeger," Calibration Considerations for Piezoresistive-Based Stress Sensors", Proceedings
of the 40th Electronic Components and Technology Conference, Las Vegas, NV, May 20-
23, 1990, pp. 797-806.
P. H. Townsend, P. C. Burdeaux, S. F. Hahn, M. Thomsen, J. N. Carr, R. Wayne Johnson
and K. Weidner, Multilayer Interconnection Structure Using Second Generation Polymers
Derived from Bis-Benzocyclobutene, Proceedings of the 1989 International Symposium
in Microelectronics, October 24-26, 1989, pp. 447-453.
F. German, J. Jackson, and R. Wayne Johnson, Three-Dimensional Full Wave
Electromagnetic Analysis of Hybrid Interconnections Using the Transmission Line Matrix
(TLM) Method, Proceedings of the 1989 International Symposium on Microelectronics,
October 24-26, 1989, pp. 601-606.
R. Wayne Johnson, Douglas Hopkins and Richard Jaeger, The Microelectronics Program
at Auburn University, Proceedings of the 1989 International Symposium on
Microelectronics, October 24-26, 1989, Best paper of Session Award, pp. 367-375.
Richard Weeks, R. Wayne Johnson, Douglas Hopkins, James Muir and Janette Williams,
Plated Copper on Ceramic for Power Hybrid Applications, Proceedings of the 39th
Electronic Components Conference, Houston, Texas, May 22-24, 1989, pp. 544-550.
R. Wayne Johnson, Thin Film Multichip Hybrids: An Overview, Proceedings of the
Technical Program of the National Electronic Packaging and Production Conference,
Anaheim, California, March 7-9, 1989.
R. Wayne Johnson, Timothy L. Phillips, Stephen F. Hahn, David C. Burdeaux, and Paul
Townsend, Multilayer Thin Film Hybrids on Silicon, Proceedings of the 1988
International Symposium on Microelectronics, October 1988, Best Paper of Session
Award, pp. 365-373.
F. German, B. Dillard, L. Riggs and R. Wayne Johnson, Transmission Line Matrix
Method for Modeling Electrical Performance of Interconnections, Proceedings of the
1988 International Symposium on Microelectronics, October 1988, Best Paper of Session
Award, pp. 492-495.
R. Wayne Johnson, T. L. Phillips, R. C. Jaeger, S. F. Hahn, and D. C. Burdeaux, Thin
Film Silicon Multichip Technology, Proceedings of the 38th Electronic Components
Conference, May 1988, pp. 267-275.
R. Wayne Johnson and R. C. Jaeger, Thin Film Hybrids on Silicon, Abstracts of the
Engineering Foundation Conference on Advanced Materials and Processes for High
Density Packaging, March 1988, (Abstract Only)
R. Wayne Johnson, R. C. Jaeger and J. L. Davidson, Hybrid Wafer Scale Integration
Utilizing Planar Interconnection Technology, VLSI and GaAs Packaging Workshop,
September 1987, (Abstract Only)
R. Ramanathan, C. R. Ellis, R. C. Jaeger and R. Wayne Johnson, Optical Fiber Interfaces
to Diode Detectors for Wafer Scale Packaging, VLSI and GaAs Packaging Workshop,
September 1987, (Abstract Only)
R. Wayne Johnson, Michael Cornelius, Jimmy L. Davidson and Richard C. Jaeger, Planar
Hybrid Interconnection Technology, Proceedings of the 1986 International Symposium
on Microelectronics, October 1986, Best Paper of Session Award, pp. 758-765.
Richard C. Jaeger, Jimmy L. Davidson and R. Wayne Johnson, Silicon-Based Hybrid
Wafer Scale Packaging, IFIP Workshop on Wafer Scale Integration, Paper K1, March
1986.
Jimmy L. Davidson, Richard C. Jaeger, David V. Kerns and R. Wayne Johnson, Hybrid
Wafer Scale Integration Packaging Technology, IEEE Southcon Proceedings, Paper 19/3,
March 1986.
R. Wayne Johnson, Jim Davidson, Richard Jaeger and David Kerns, Hybrid Silicon
Wafer-Scale Packaging Technology, IEEE International Solid-State Circuits Conference
Digest, February, 1986, pp. 166-167.
R. Wayne Johnson, Jim Davidson and Richard Jaeger, Microelectronics at Auburn
University, Proceedings of the Fifth Annual International Electronics Packaging
Conference, October 1985, pp. 353-360.
R. Wayne Johnson, Polymers in Microwave Applications, Proceedings of the 1982
International Electronics Packaging Society Conference, November 1982, pp. 615-622.
R. Wayne Johnson, A Status Report on Polymer Thick Film Technology, Proceedings of
the 1982 International Microelectronics Symposium, November 1982.
Bob Allen and R. Wayne Johnson, Membrane Tough Switches: Review of Technology,
Trends and Applications, Proceedings of the 1982 International Microelectronics
Conference, May 1982.
Vernon A. Pitt, Christopher R. S. Needes and R. Wayne Johnson, Ultrasonic Aluminum
Wire Bonding to Thick Film Copper Conductors, Proceedings of the 1981 Electronics
Components Conference, May 1981, pp. 18-23.
R. Wayne Johnson and Rene Cote, Thermosonic Gold Wire Bonding to Silver Bearing
Conductors, Proceedings of the 1980 International Microelectronics Symposium,
October 1980, pp. 313-321.
James Pierce, R. Wayne Johnson, Helen Schmidt and John Larry, New Thick Film
Resistors for Potentiometer Applications, Proceedings of the 1980 International
Microelectronics Symposium, October 1980, pp. 214-228.
R. Wayne Johnson, Phil Rich, Debra Rich and Larry Wilson, Advances in Thick Film
Conductors for Microwave Integrated Circuits, Proceedings of European Hybrid
Microelectronics Conference 1979, May 1979.
R. Wayne Johnson and Donald Kinser, Examination of the Relationship Between
Structure, Adhesion, and Conductivity in Copper Thick Film Systems, Proceedings of the
1978 International Microelectronics Symposium, September 1978, pp. 73-78.
SHORT COURSES
Hybrid Microelectronics: This five day course provides a hands-on discussion of thick
film, thin film and cofired ceramic substrate technologies, bare semiconductor assembly
and packaging methods and surface mount technology. The students fabricated a pulse
generator using thick film, chip-and-wire technology as part of the course.
Semiconductor Fabrication: This five-day course covers the basic semiconductor
fabrication processes and materials. In the laboratory, the students fabricate N-MOS
transistor designs.
Multichip Module Fundamentals: This one-day course discusses the materials and
processes for fabrication and assembly of multichip modules along with a discussion of
design issues.
Area Array Assembly: Flip Chip, Chip Scale Package and Ball Grid Array: This one-day
course describes the various area array packaging options and the assembly materials and
processes for their use.
Flip Chip Technology: This one-half day course describes bumping of wafers, substrate
design, assembly and reliability.
Chip Scale Package Assembly: This one-half day course describes different chip scale
packages, assembly issues and reliability.
Packaging for High Temperature: This one-half day course explores the issues associated
with packaging electronics for operating temperatures ranging from 200oC to 500oC.
UNITED NATIONS DEVELOPMENT PROGRAM
Served as Expert in MultiChip Module Technology during two visits (4 weeks in 1993 and
2 weeks in 1995) to Telebras CPqD in Campinas, Brazil. Worked in research laboratories
and taught short course during visits.
Contact this candidate