Mr. Voi. Nguyen

Orlando/Oviedo, FL

407-***-****, cell 407-***-****

abqcos@r.postjobfree.com

Apps Developer

Seek position utilizing my developmental skills for iPhone/iPad applications

CAD SKILLS

Intralink 3.3, Wildfire V1.0 to V4.0, Mechanism module, Pro/Cable module, Animation module, Pro/Advanced Rendering Extension module, SolidWorks 2001-2008, Ideas Master Series 9.0, Ironcad 4.0, AutoCAD 2005 and J-Link (Pro/Toolkit).

SOFTWARES DEVELOPMENT SKILLS

Objective C, J-Link, Pro/Toolkit, Java, Visual Basic/VB.Net, Delphi, C/C++, C++ Builder, AutoCAD VBA, SolidWorks VBA, Pro/Program, SDRC script and AutoLISP, iOS iPhone Apps Developement

DESIGN SKILLS - 4+ years designing apps. 17 plus years of Electromechanical, Software Development, and Design Automation experiences. Experienced with sheet metal fabrication, electronic packaging (Commercial/Military), power supplies, machining, injection molding, backplanes, daughter cards, fixturings/tooling, mechanisms, stepper/servo DC motors, linear slides, vacuum molding, FDM, liquid metal(sintered metal), WEDM, extrusion, FDA Class III Medical devices, C3P CAD, and Geometric Tolerance, stack-up tolerance analysis, and ASME Y14.5M-1994.

SOFTWARE ENGINEER FOR iPHONE/1PAD

Self-Employed (2007-Present)

Use iOS SDK to design/build Medical, Engineering, Educational, Science, Entertainment and Game apps for iPhone/iPad/iPod devices. Currently I have developed more than 100+ apps and submitted to iTunes.

ELECTROMECHANICAL PACKAGING DESIGNER

Harris Corporation, FL (February 2004 – Present)

Utilizing Wildfire V1/V2/V3/V4, Mechanism module, Pro/Cable module, Advanced Assembly module, Advanced Rendering module, Sheet Metal module, and Animation module to design air-cooled VME chassis and electronic packaging, tooling/fixturing in severe airborne environments. Work closely with Engineers, managers and electronic designers to ensure products and schedules are within the customers’ requirements. Extensive using of Mechanism/Animation modules to study motion and interfering problems. I often use ARX module to generate photorealistic pictures for presentations and proposals. Support and test new Versions of Pro/Engineer tool roll-out, point of contact. Mentor various levels of Pro/E users on Pro/E and IntraLink software and conduct lunch time ProE training sessions. Continue to develop advanced automation software using J-Link and Pro/Toolkit to reduce design cycle, R&D and cost. Training: EHS Ergonomics, Integrated Process Overview, Kickbacks and Gratuities, Procurement Integrity, product Substitution, Truth in negotiations Act.

ACHIEVEMENTS:

Three months after beginning with Harris, I received a Certificate and plaque for innovative ideas and for delivering a proto-type six months ahead of schedule.

First year of service, received TOP 20 Engineers award from a field of 10,000+ employees.

Has received several Next Level Awards thru out the years. Co-inventor/developer of a patent pending designs straight-pass heat exchanger with integral chassis locking feature. The locking feature eliminates the traditional gasket found in conventional air-cooled systems while minimizing the pressure drop. This approach provides a 20 C improvement in thermal performance and cuts board deflections by 30%.

ELECTROMECHANICAL PACKAGING DESIGNER

Deka Research and Development, NH (February 2002 – February 2004)

Team Member – iBot Department. (April 2001 – June/2002)

Utilizing Pro/E/Intralink 2001 to design/redesign/test and modify components for iBot, 1st generation robotic wheelchair and designed components for iBot, 2nd generation robotic wheelchair which includes injection molding, extrusion, aluminum die cast parts and powder metal parts. Redesign & design mechanical parts and production tools for ergonomic features, functionality, improve costs and ensure parts manufacturability. Liaison to Engineering department and vendor/customer. Built prototypes, give presentations. Converted company to utilizing off-shelf parts verses custom design parts and saved company more than 250k.

ELECTROMECHANICAL PACKAGING DESIGNER

Teradyne Inc. (Contracting), Boston, MA (June 2002 – February 2003)

Utilizing Pro/E Intralink 2001 to design fixturings, tooling and alignment plates for SEMI Test Equipments base on customers’ requirements. Each SEMI Test Head runs from $500k to $1000k. The size of each Test Head runs from 2000-5000 pounds. An Interface plate and alignment are both mounted between the Test Head and the Microchip Handler or Prober. Work involves designing shipping cases, ECO’s, liaison to customers and vendors.

ELECTROMECHANICAL PACKAGING DESIGNER

Teradyne Inc. (Contracting), Boston, MA (May 2000 - March 2001)

Utilizing Pro/E Intralink 2000i to do general design work per engineering request. Designed fixturings/tooling, Catalyst SOC Test System. Worked closely with Engineers designing test equipment for microchips from prototype to production stage. Design involved molding parts, machine parts, sheet metal parts, sliding/moving parts, PC boards and cables.

ELECTROMECHANICAL DESIGNER,

Dana Corporation, Reading, PA (4 month assignment)

Responsibilities included designing/detailing truck frames using C3P cad package. Frames were modeled using mostly natural curves/surfaces. Assisted team & improved productivity by creating a technique for drawings and Assembly models, which added more views per drawing files, without slowing down computers/productivity. Reduced drawing regenerating time significantly.

ELECTROMECHANICAL PACKAGING DESIGNER

Seagate Technology (Contracting), Bloomington, MN (May 1999 - February 2000)

Create/design and maintain solid 3d models for mechanical piece parts and assemblies. Converted DN 2000 Cad Models to SDRC. Train Designers and troubleshoot SDRC problems for department.

ELCTROMECHANICAL PACKAGING DESIGNER

Lambda Novatronics (Contracting), Pompano Beach, FL (February 1999 - June 1999)

Utilizing SDRC to design custom military power supplies per customer specification, MIL-STD-704/MIL-STD-461.

ELCTROMECHANICAL PACKAGING DESIGNER

Seagate Technology (Contracting), Bloomington, MN (August 1998 - February 1999)

Utilizing SDRC. Create/design and maintain solid 3d models for mechanical piece parts and assemblies. Convert DN 2000 Cad Models to SDRC. Train Designers and trouble shoot SDRC problems for department.

ELECTROMECHANICAL PACKAGING DESIGNER

Teradyne Inc. (Contracting), Boston, MA (September 1995 - March 1998)

Designed tooling, alignment tooling & fixtures for Teradyne Catalyst SOC Test System. Worked closely with Engineers utilizing Pro/E to design test equipment for microchips from prototype to production stage. Design involves molding parts, machine parts, sheet metal parts, sliding /moving parts, PC boards and cables.

ELECTROMECHANICAL DESIGNER

Agfa (formerly Miles), Wilmington, MA (April 1995 - September 1995)

Using EMS 3.01 to design prepress and color separation machines. Projects involved design machining, sheet metal and moving and sliding parts. Also test-drive SDRC Master Series System for three months period for them.

PACKAGING DESIGNER (Direct Employee)

Altron Incorporated, Wilmington, MA (July 1990 - April 1995)

Interfaced with Project Manager using 3D Solid/Wire frame Modeling AutoCAD Release 12, Cad key, Pro E & SDRC to design customized, VME, Extrusion, and Sheet metal card cages from prototype to production stage. Electrical experience in rack and stack consoles, breakout boxes & cabling. Developed automated programs to run within AutoCAD and Visual Basic to increase productivity to reduce design cycle. Primary duties included mechanical layout, design, documentation, presentation and software development. Coordinated rapid data interchange with customers and vendors for quick cycle manufacturing. One-year project on CAT Scan Chassis.

EDUCATION

MINNEAPOLIS DRAFTING SCHOOL

Minneapolis, MN

Certificate, Advanced Mechanical/Electronic Design Management (July 1989)

NORMANDALE COMMUNITY COLLEGE

Bloomington, MN

Pre-engineering /Associates (September 1986 - December 1989)

UNITED STATES CITIZEN

References: Furnished upon request.

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