Engineer Mechanical

Hailong Ji

Email: *******.**@********.***

Address: **** ****** **, *** ***, Boulder, CO-80302 Phone: 720-***-****

EDUCATION

University of Colorado at Boulder, USA

-Master of Science, Mechanical Engineering GPA: 3.4/4 [Expected: May 2013]

-Concentration: Microsystems

Shanghai University, Shanghai, China

-Bachelor of Science, Mechatronics & Automation Sept 2007-May 2011

COURSEWORK & LAB

Micro-electromechanical Systems (MEMS) Sept 2011-Dec 2011

• Built a gyroscope model in CoventorWare, including schematic creation, layout verification, analyzed, validated and optimized the model, conducted FEM and architect analysis. Also including model the package and device interaction.

• Conducted a RF switch design, simulated the designed cantilever beam resistive switch, including FEM verification.

• Familiarized with CoventorWare: process editing, model construction, device analysis (modal analysis, harmonic analysis, contact, pull-in, hysteresis, thermal analysis, transient mechanical analysis).

Thin Film Materials Jan 2012-May 2012

• Developed a PZT thin-film actuated triple-beam micro-scanner which was based on the SOIMUMPS process.

• Conducted FEA simulations, thermal analysis and characterization of the designed device by using CoventorWare. Optimized the dimensions of beams, the scanner achieved a high frequency of 36 kHz resonant and SVGA resolution.

Colorado Nanofabrication Lab (CNL) May 2012-Oct 2012

• Acquired working knowledge of MEMS fabrication and process interactions.

• Gained hands-on experience with handling photoresist, conducting lithography, performing DRIE, PECVD etching equipment.

• Experience with electrical and mechanical test setups: probe stations, microscopes, profilometers, etc.

• Involved in the design and fabrication of mask layout for transfer printing prototype module.

• Acquired knowledge in MEMS packaging, CSP, WLP, Wire-Bonding, Flip-Chip Bonding, etc.

• Conducted lab experiments for designed devices, including debug and measurement equipment operation.

Finite Element Analysis (FEA) Aug 2012-Dec 2012

• Utilized ANSYS, different mechanical components were built and analyzed in 2D and 3D, conducted stress/strain, thermal analysis, design modification was achieved.

EXPERIENCES

Shanghai General Motors (SGM), Powertrain Department, Assistant Engineer Intern July 2010-Aug 2010

• Took part in the manufacturing and assembly of GM’s 2.0/2.4/2.0 Turbo engine.

• Used CAD to conduct engineering drawing and file documentation.

• Scheduled GM’s new engine manufacturing, contacted and collaborated with outside engineer teams.

• Monitored assembly line efficiency, recorded and investigated cycle time issues.

SKILLS

AutoCAD, Solidworks, ANSYS, Mathematica, C, Assembly, CoventorWare, Clewin

LEADERSHIP

Shanghai University, Student Union of School of Mechatronics Engineering and Automation Sept 2008-Sept 2009

President: Managed an organization of 50+ students; The size of the union expanded by 30% under my leadership.

HONORS

Scholarship for Freshmen of Shanghai University, Excellent Student Leader of Shanghai University (1%) Scholarship of Shanghai University, Excellent Student of Shanghai University, Excellent Graduate of Shanghai University (7%)

VOLUNTEER

Home for Mental Disability Patients in Shanghai, Shanghai Science and Technology Museum, Shanghai EXPO 2010

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