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Engineer Manager

Location:
Coppell, TX
Posted:
October 26, 2012

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Title:Senior Process Engineer

abpgkp@r.postjobfree.com

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NAME: JOSEPH NUNN

ADDRESS:

CITY: Coppell

STATE/PROVINCE: TX

ZIP/POSTAL CODE: 75019

COUNTRY: USA

EMAIL: abpgkp@r.postjobfree.com

PHONE: 972-***-****

CANDIDATE ID: N/A

CITIZENSHIP: US

Citizen

EDUCATION: Not Entered

EXPERIENCE: Not Entered

WILL RELOCATE: Not Entered

RELOCATION INFO: Not Entered

JOB WANTED: Not Entered

HOMEPAGE:

HOTSKILLS:

ESUME

PASSOIRT_RESUME

JOSEPH H. NUNN

205 Jeb Court

Coppell, TX 75019

972-***-****

abpgkp@r.postjobfree.com

SUMMARY

I am a process engineer with extensive experience in semiconductor

front

ends and pilot lines. My expertise in the areas of diffusion and LPCVD

enables me to establish high reliability processes through detailed

characterizations of equipment and environment.

I am well versed in wet chemistry, diffusion, silicon and reclaim

wafers, and wafer qualification as it impacts product performance.

Furthermore, I directed the external and internal recycling of monitor

wafers to reduce costs for my company.

As a problem solver, I possess the ability to study conditions,

establish root causes, test hypotheses, and subsequently coordinate

engineering activities and reports. My interpersonal skills allow me

to

successfully lead projects and implement plans, in addition to

promoting

professional relationships. Finally, I am results-orientated, willing

to

put forth whatever effort is necessary to achieve problem resolution.

EXPERIENCE

HITACHI SEMICONDUCTOR AMERICA INCORPORATED

Las Colinas,

Texas

Senior Process Engineer, 1989 to 1998

Directed diffusion and anneal process setup, using 22 vertical

furnaces,

for 6" wafer processing. I oversaw a product range including MICON,

Static and Dynamic RAMS, with device geometry ranging from 1.2 to 0.5

microns. Conducted hands-on management of diffusion furnaces (6" and

8"), wet benches, wafer transfer systems, wafer inspection,

measurement

systems and back grind. I held responsibility for chemical and silicon

wafer vendor qualifications. Also, I worked with SPC and EDC for

process

control.

Diffusion Furnaces: I set up processes for wet and steam oxidationsand

characterized the systems. I establisheda "short-loop" product monitor

for determination of gate oxide integrity. I tested wet chemistry

cleaning procedures and the impact on product performance.

Monitor Cost Reduction: Reduction in the high cost of monitor wafers

was

achieved by internal and external monitor recycle procedures that I

established and qualified. This reduced the product to monitor ratio

from 0.83 to 0.40; the cost saving was $87K/mth.

Chemical Cost Reduction: I directed the qualification of domestic

supply

of chemicals to eliminate shipping and storage costs for material

imported from Japan. The qualifications included vendor audits, split

lot processing and reliability testing. The cost saving to my company

was $47K/mth.

Daily Work Activity: Each day I reviewed the status and performance of

equipment for the Diffusion area. I established plans for correction

of

problems and disposition of any problem lots. I established

engineering

data collection by process, product and machine: the data is reviewed

on

a weekly basis. Real time SPC was established on critical process

parameters.

HAMPSHIRE

INSTRUMENTSMarlborough, Massachusetts

Senior Engineer, 1987 to 1989

Developed low-stress metal deposition processes on silicon membranes.

Produced a metal film used as an X-ray absorber in photolithography

systems forsub-half micron geometry's.Oversaw Department of Navy

-sponsored development projects in a small company clean room and at

the

Materials Research Laboratory at MIT. In addition, managed equipment

selection, installation, and characterization.

Additional

Experience

INMOS CORPORATION, Colorado Springs, Colorado.Senior Engineer/ Section

Manager, 1980 to 1986. NCR CORPORATION, Colorado Springs, Colorado.

Engineering Manager, 1977 to 1980. HARRIS SEMICONDUCTOR, Melbourne,

Florida

.

Technical Staff Member, 1975 to 1977.

MICROSYSTEMS INTERNATIONAL, Ottawa, Ontario, Canada. Engineering

Section

Manager, 1969 to 1975. TEXAS INSTRUMENTS, Bedford, England.

Engineer/Senior Engineer

1960 to 1969

.

EDUCATION

OXFORD COLLEGE OF SCIENCE AND TECHNOLOGY,

Oxford,

England.

H.N.C., 1959, Inorganic and Physical Chemistry (equivalent to B.S.

Chemistry

)

PERSONAL

Married

. Three ChildrenTechnical Knowledge

Diffusion Processes and Equipment

Wet Benches and Cleaning Processes.

Atmospheric and Low Pressure Deposition Systems

Sputter Systems

Computer Skills

Microsoft Works

Excel

Data Collection and Analysis Programs

SPC Programs



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