Electronics Manufacturing, Process, & Quality Systems Engineer
Resume:
WILLIAM POST
HUDSON, FLORIDA 34669
******@***.***
SUMMARY
Results oriented professional with experience in various capacities that support electronics product development, launch, manufacturing, and quality initiatives. Proven track record in key areas include: New Product Introduction, Process / Product Engineering, Project Management, and Quality Systems Engineering. Extensive hands on experience through the product life cycle phases of electronic and electromechanical products across a bandwidth of industries such as Military, Aerospace, Medical, and Telecommunications.
Experience / Key Areas of Focus
• New Product Introduction (NPI)
• Advanced Product Quality Planning (APQP)
• Circuit Card Assy. (CCA) - SMT/Thru Hole
• (PWB) Design & Inspection Standards
• Manufacturing Cost Reductions & Avoidance
• Industry Standards (J-STDs, IPC, MIL stds.)
• Design for Excellence / DF(x)
• Supplier Quality Improvements
• DMAIC / Six Sigma Methodologies
• Lean Initiatives / Value Stream Mapping
• Project Management
• RCCA (Root Cause / Corrective Actions)
• Change Control Management
• Process Improvements
• International Business Experience
• RoHS / WEEE Implementation Strategies
• QMS; ISO9001:2008, AS9100:2004,TL9000, ISO13485
PROFESSIONAL EXPERIENCE
SPARTON ELECTRONICS, Brooksville, Fl. 2005 – 2012
Staff Engineer - Quality Systems Engineering - Complex Systems Division,
Focus directed to new product launch in conjunction with process and quality improvement initiatives for the Electronic Manufacturing Services business. Project management and customer support base included aerospace, military, and medical systems (Raytheon, L3, Parker Aerospace, Honeywell, ATK, C4ATS, and Johnson & Johnson). Scope of organizational support responsibilities; Configuration Management reinforcement strategies, Receiving Inspection support and technical training, Six Sigma Quality Metrics management, MRB / RMA support operations, 8D Corrective Action processes for customer response and supplier quality improvements. Additional areas of expertise; PWB Design Requirements and Performance Specifications (IPC 2221 series, IPC 6010 / 6011 series, MIL-55110 & 31032) and PWB Inspection / CCA Inspection (IPC600 / J-STD-001& IPC610).
• Completed ISO9001 / AS9100 facility recertification audits (2006 & 2007)
• Completed initial facility certification for ISO13485 (2006)
• Implemented AS9102 First Article Inspection standard for all customers. (2006)
• Aligned existing MRP and PDM (AGILE) systems to support lean initiatives that drive front end quality SOW and PO flow-downs requirements for purchased parts. (2007)
• Reduced MRB backlog burden from $800K to $40K. (2008)
• Co-developed and implemented an EMS industry focused APQP (Advanced Product Quality Planning) framework for CCA product transfer as well as New Product Introduction. (2009)
• Completed the transfer of 120 CCA products from two other Sparton EMS facilities for strategic business consolidation in Florida using APQP process. ( 2009 – 2010)
• Organized / Facilitated New Product Introduction team to launch 74 new CCA products in 2012.
VALERE POWER, INC., Richardson, TX 2004 – 2005
(Acquired by ELTEK in 2007)
Senior Quality / Process Engineer
Staff Engineer responsible for implementation of Quality Standards and Electronics Assembly Processes verification to successfully transition a start-up power supply solutions developer to the next level of market share.
• Key areas of activity included implementing cross functional CCA design reviews, DF(x) initiatives and NPI First Article Inspections to support turnkey design solutions for Telecom equipment providers, and Enterprise equipment providers.
• Completed NPI launch at Contract Manufacturer in Shanghai, China to support distribution in Asia, EU, and U.S markets. (2004)
• Managed Pb Free / RoHS product conversion initiatives for selected EU products. Scope of conversion effort included electronic components, Circuit Card Assemblies, and electro-mechanical components.
• Supported quality / process audits at EMS provider, internal ISO 9000 / TL9000 certification efforts, metrics, and improvement initiatives for an expanding product portfolio of new generation power supply products.
MARCONI COMMUNICATIONS, Bedford, TX 2000 - 2003
Operations Engineering Manager - Access Products Division
Managed technical operations for the manufacturing divestiture and production transition of telecommunications infrastructure products from an internal Marconi operation to a comprehensive outsourced solution. Product portfolio transferred for outsourced assembly and test included: Circuit Card Assemblies, Photonics, CCA Racks, and Remote Cabinets.
• Managed Manufacturing Engineering initiatives to support manufacturing divestiture / transfer of all CCA products to Jabil Circuit. (2000-2001)
• Completed transfer of CCA products and supporting test platforms to Jabil Circuit and SCI/Sanmina, Mexico, for assembly cost reduction of 300K/month. (2002 –2003)
• Implemented design cost avoidance and reduction efforts for CCA products and back-planes resulting in annual fabrication and assembly savings of $650K.
• Developed / implemented internal Manufacturing Engineering organizational vision and lean technical resource structure to support critical DF(x), NPI, and Functional Test development processes for the outsourcing strategy.
ALCATEL USA – (Alcatel/Lucent) Plano, Texas 1999 - 2000
New Product Introduction Engineer - Access and Transmission Products Division
Managed New Product Introduction projects for Telecom Optical Transmission and Access CCA products and photonics assemblies through BOM review, CAD layout, assembly prototyping, and production release. Product development cycle responsibilities included DF(x) reviews, component evaluations, cost avoidance/cost reduction analysis, process development, prototype assembly, and post mortem evaluation.
• Introduced PWB fabrication and circuit card assembly cost reductions = $400K annual savings.
SIEMENS, Atlanta, GA / Dallas, TX 1996 – 1999
Project/Applications Engineering Manager – Siemens Energy and Automation Division
Based in Dallas to support South Central and NAFTA sales and project management. Applications management responsibilities included machine layout simulations to meet the customer’s assembly throughput / capacity targets and define the assembly configuration. Project Engineering responsibilities required logistics management from Siemens, Munich and full turn-key project management support of equipment installations in Texas and Mexico.
• Completed three-month equipment evaluation for Nokia Mobile Phones resulting in preferred vendor approval and SMT equipment sales/installations of $16M. (1997)
• Successfully completed Beta Site testing and customer acceptance for new HS50 SMT automated placement platform at Nokia Mobile Phones resulting in equipment sales of $60M. (1998-1999)
DSC COMMUNICATIONS CORPORATION, Plano, TX 1993 – 1996
Advanced Manufacturing Product Engineer - Access / Transmission Products Division
(Divested to ALCATEL 1998)
Managed NPI and assembly cost reduction efforts for CCA products, equipment racks, and back-planes that supported both Access and Transmission telecommunications platforms. Responsibilities in an aggressive product development cycle included; partnering with design/development teams to insure implementation of DF(x) solutions, design compliancy for Telcordia requirements, CCA cost reduction analysis and assembly cycle time modeling, new product assembly prototyping through production release, and factory planning for new product capacity and impact analysis.
• Completed transition of Access CCA designs from acquired development start-up company in Petaluma, California to production in Plano, Texas.
• Implemented NPI prototyping process to support local quick turn assembly capability for the design / qualification operation in California.
• Introduced CCA and component cost reductions for Access and Transmission Products yielding annual assembly and material savings of $2.5M.
TEXAS INSTRUMENTS, Dallas, TX 1991 – 1993
SMT Product Development Engineer - Microelectronics Packaging Systems
(Defense Systems Electronics Group)(Divested to Raytheon; 1997)
Managed turnkey CCA product development projects slated for key military avionics and man portable defense programs (ATF, F-16, Javelin CLU/Missile). Established close working relationship with design engineering to manage CCA design projects from schematic capture through CAD, documentation, fabrication, and assembly. Implemented design / BOM reviews to insure producibility, cost effective manufacturability, and customer compliance. Developed design rules and guidelines (DFx) for SMT PWB fabrication, layout, and Circuit Card Assembly to support high reliability applications. (Secret Clearance)
• Reduced CAD design cycle time 15% by improving front-end component and SMT footprint selection processes. Standardized SMT footprint data library for multi-functional applications between CAD, Manufacturing Assembly, X-Ray inspection, and ICT.
TEXAS INSTRUMENTS, Dallas, TX (CONTINUED) 1989 – 1991
SMT Producibility / Production Engineer - Microelectronics Packaging Systems,
(Defense Systems Electronics Group)
Managed SMT assembly line operations and served as the Engineering facilitator to train assembly personnel, program/ trouble shoot automated equipment, and support production. (Secret Clearance)
• Designed SMT footprints for CAD parts library to meet optimum solder joint reliability and MIL-Standard volume / inspection requirements.
• Coordinated production readiness effort to launch and harden a continuous flow automated SMT assembly line.
• Developed assembly defect indices using the six-sigma quality measurement system (DPMO) and successfully reduced assembly defects by 20%.
• Designed interconnect strategy and developed processes for prototype and production Focal Plane Array CCAs.
TEXAS INSTRUMENTS, Dallas, TX (CONTINUED) 1986 – 1989
Mechanical Systems Design Engineer - Antenna Development Group,
Defense Systems Electronics Group)(Divested to Raytheon; 1997)
Assigned to an Air Force program to design and qualify a Global Positioning System phased array antenna (GAIT). Engineering tasks to develop the required avionics assemblies included; assembly and subassembly design, materials selection, high tolerance machined and sheet metal part design, interconnect design for both RF and DC, EMI shielding, flex circuit design, and RF coaxial cable design. (Secret Clearance)
• Developed new assembly processes and tooling to support 5% cost reduction of flex circuit subassemblies and RF strip line assembly.
• Completed assembly and environmental testing for the first two pre-production GAIT Antenna systems.
• Completed engineering documentation changes and final release of drawing package for LRIP.
EDUCATION
Bachelors Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA
MILITARY
US Air Force, Fuel Systems Technology - Dyess AFB, Texas / Ramstein AFB, Germany
TRAINING / SKILLS
• Product Design For Manufacture
• Access data base management
• TQM / Six Sigma Methodologies
• Mentor &Valor –Design Review Tools
• PFMEA / SPC
• MS Office Suite
• AGILE (Oracle PLM System) / SAP
• Geometric Dim. & Tolerancing
• MS Project, Power Point, Visio
• Green Belt
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