Engineer C

Ming-Wei Lin

Email: abpb0u@r.postjobfree.com

Address: ***** ******* ***** ***.***

City: Madison Heights

State: MI

Zip: 48071

Country: USA

Phone: 313-***-****

Skill Level: Assistant

Salary Range: $75,000

Willing to Relocate

Primary Skills/Experience:

See Resume

Educational Background:

See Resume

Job History / Details:

MING-WEI LIN

CURRICULUM VITAE

Address: 32600 Concord Drive, Apt. 506, Madison Heights, MI 48071

Phone No: 313-***-****

E-mail: abpb0u@r.postjobfree.com or abpb0u@r.postjobfree.com

Objective: I would like to contribute my knowledge and experience to this prestigious

organization/company, dedicating to the research and development.

Education:

09/09~12/12 Wayne State University, Detroit, MI 48201, USA

Ph.D., Department of Physics and Astronomy (defense on Nov. 7th, 2012)

01/93~09/95 SUNY at Buffalo, Buffalo, NY 14260, USA

M.A., Department of Physics and Astronomy

09/82~06/87 National Kaohsiung Normal University, Kaohsiung, Taiwan

B.S., Department of Physics

Expertise:

Specializing in nanofabrication using e-beam/photo lithography and general clean room techniques such as metal deposition, etching, and PVD/CVD.

Extensive experience with characterization tools to measure nano-devices such as AFM, Raman spectrometer, PL, SEM/TEM, S-4200 analyzer and cryogenic techniques (low temperatures).

Being familiar with the fabrication of nano-structures with optical properties and TEM sample preparation by using DB-FIB techniques.

Discussion and execution for several nano projects like near field optics, scattering type SNOM, plasmonics, DNA self-assembly, and bio-sensors.

Being familiar with the function and practical operation of analytic tools like SEM, FIB, and SPM. In addition, the modification of SPM tips up to A/R 10:1 has been achieved for several purposes.

Being familiar with the semiconductor processes, especially BEOL Cu wiring process (PVD and electroplating). Having the practical experience for reliability testing such as EM, SM, and TDDB with Cu/low k.

Having experience of planning and execution for projects regarding diverse aspects of semiconductor, nano-technology, and CMT. In the meantime, the training for SPC/SQC courses had been completed.

Major in low temperature and semiconductor physics, especially in graphene, graphene nanoribbons and 2D materials. Also making superconductors for physical properties measurement.

Achievements:

Obtained the record high mobility in suspended graphene nanoribbons (GNRs) and intrinsic bandgap had been observed. Also achieved high on/off ratio in suspended GNRs and 3 papers had been published regarding this material.

Successfully fabricating nano-structures on metal film (Au/Ag) with plasmon effects. Having several papers (co-authors) regarding near field optics published in the prestigious journals. Besides, there is one paper (co-authors) concerning improved resolution of MFM tip published in the journal of Scripta Materialia.

Responsible for reliability testing of 0.13 um Cu process and successfully transferred to mass production. Several papers regarding PVD and electroplating processes with co-authors had been published in the prestigious conferences of semiconductor aspect.

Responsible for the BEOL process of CMT manufacturing, leading the getter project to mass production and life improvement project for CMT. Being the liaison for contact with the people from UK and Holland for materials supply to find out the root cause of life deterioration.

Experience:

09/09~12/12 Ph.D. program at Wayne State University, Detroit, MI 48201

Graduate Teaching Assistant, 2009~2010.

Graduate Research Assistant, 2010~2012.

Knoller Endowment scholarship, 2012

Oral presentation in APS March meeting, 2011 and 2012.

Best poster presentation awards in AVS meeting, May 2011.

Oak Ridge National Laboratory (CNMS, ORNL) for conducting the nano phase projects regarding graphene nanoribbons and 2-D materials, 2010~2012.

3 papers published in the field of graphene nanoribbons and 1 paper published regarding MoS2 with polymer electrolyte. Besides, 2 papers related to 2D materials such as TiS2 and MoSe2 single layer will be submitted.

To be familiar with making nano-devices using electron beam lithography, metal deposition, metal/oxide etching process and photo lithography.

To get familiar with characterization for nano-devices using AFM, S-4200 analyzer, probe station in vacuum, cryogenic measurement (~4K), SEM/TEM, Raman spectrometer and photo-luminescence measurement. Part of STM measurement was done in Oak Ridge National Laboratory (ORNL).

02/03~08/09 Industrial Technology Research Institute, Hsin-Chu, Taiwan

Associate Researcher

Mainly responsible for fabricating nano-structures of optical properties such as hole arrays, elliptical arrays, and other specially designed patterns in the project of surface plasmon with materials.

Responsible for the technical development and regular maintenance of dual beams of focused ion beam (DB-FIB).

By using DB-FIB for making TEM membrane below 100 nm thickness and advanced technology development. The service of diverse samples for analysis and characterization was executed as well.

Participating in discussion and fabrication for the projects of plasmonics, solar cell, DNA self-assembly, and scanning probe microscopy, etc.

07/00~02/03 Taiwan Semiconductor Manufacturing Company (TSMC), Hsin-Chu,

Taiwan

Principal Module Development Engineer

Being familiar with the process of BEOL for deep sub-micron Cu wiring of plating. To participate in the advanced technical projects such as 0.13 um and 90 nm technology generations.

Doing reliability related projects such as EM (electron migration) and SM (stress migration) with Cu/low k for deep sub-micron process and successfully transferred to production. Besides, one paper regarding SM for low-K materials was published on MRS (AMC, 2001).

Responsible for electro-plating process and familiar with PVD for Cu wiring. In addition, the tools such as XRD, AFM, SEM/FIB, stress gauge and SIMS have been used for measuring film properties.

10/99~07/00 World Semiconductor Manufacturing Company, Hsin-Chu, Taiwan

Senior Engineer

Mainly responsible for BEOL thin film processes in RD department, including physical processes of dielectrics and metal thin film.

WAT and reliability test methodologies.

09/98~10/99 Analog Technology Incorporation, Hsin-Chu, Taiwan

Senior Integration Engineer

Being an integration leader of bipolar technology. Doing bipolar related issues such as progress control of new products, test keys measurement, and WAT sustaining.

Being familiar with bipolar process. Cooperate with each module to trace and complete the processes of new products on time.

Writing the manual of design rules for customer reference. Finished several improved experiments in process like Epi thickness, beta variation reduction, and concentration adjustment of Plug.

Being devoted to the development of CMOS technology and assisting the improvement of CP yield.

09/95~09/98 Philips Electronics Industries, Hsin-Chu, Taiwan

R&D Engineer

Mainly responsible for the process development and improvement of CMT (color monitor tube) products.

Being the leader of several projects like G1 bracket, cathode, and getter improvement of CMT for planning and execution to fulfill what customers need.

In charge of the experiments of CMT life improvement and holding regular meeting with technical people from U.K., Holland, and Austria to solve CMT life deterioration issue.

Being familiar with SPC/SQC methodologies and having training for problem solving. Actually, a number of projects related to CMT products have been successfully implemented in factory.

08/90~07/92 National Sun Yat-Sen University, Kaohsiung, Taiwan

Research Assistant/Teaching Assistant

Assist to do the experiments regarding superconductivity of PrBaCuO and YBaCuO series.

Being familiar with how to operate X-ray diffractometer, thermal gravity analyzer (TGA), furnaces, and so on.

Assist students to do the experiments regarding modern physics, thermal physics and fundamental physics.

Helping to purchase and handle with teaching apparatus such as electron diffraction, photo-electric effect, Rutherford scattering, etc.

Relevant Courses:

Classical Dynamics, Quantum Mechanics, Statistical Mechanics, Electrodynamics, Mathematics for Physics, Solid State Physics, Characterization for Materials and Graduate Laboratory.

SPC/SQC, problem solving, design of experiment (DOE), and training courses for analytic tools.

Publications:

3 papers published in the field of graphene nanoribbons and 1 paper published regarding MoS2 with polymer electrolyte. Besides, 2 papers related to 2D materials such as TiS2, MoSe2 single layer will be submitted.

There are several papers (co-authors) regarding nano-structures and plasmon effects published in the prestigious journals.

There are several papers (co-authors) regarding Cu wiring process and reliability testing published in the prestigious conferences.

Several papers (co-authors) concerning superconductor manufacturing and physical properties are also published in the prestigious journals.

References:

Will be available to work starting January, 2013.

Personal and academic references available upon request.

MING-WEI LIN

Publications

Journal papers:

1. Lin, M. W.; Liu, L. Z.; Lan, Q.; Tan, X. B.; Dhindsa, K. S.; Zeng, P.; Naik, V. M.; Cheng, M. M. C.; Zhou, Z. X.; "Mobility enhancement and highly efficient gating of monolayer MoS2 transistors with polymer electrolyte", J. of Phys. D: Appl. Phys. 45, 345102, 2012.

2. Lin, M. W.; Ling, C.; Agapito, L. A.; Kioussis, N.; Zhang, Y.Y.; Cheng, M. M. C.; Wang, W. L.; Kaxiras, E. and Zhou, Z. X.; "Approaching the intrinsic bandgap in suspended high-mobility graphene nanoribbons", Phys. Rev. B 84, 125411, 2011.

3. Lin, M. W.; Ling, C.; Zhang, Y. Y.; Yoon, H. J.; Cheng, M. M. C.; Agapito, L. A.; Kioussis, N.; Widjaja, N. and Zhou, Z. X.; "Room-temperature high on/off ratio in suspended graphene nanoribbon field-effect transistors", Nanotechnology 22, 265201, 2011.

4. Ling, C.; Setzler, G.; Lin, M. W.; Dhindsa, K. S.; Jin, J.; Yoon, H. J.; Kim, S. S.; Cheng, M. M. C.; Widjaja, N. and Zhou, Z. X.; "Electrical transport properties of graphene nanoribbons produced from sonicating graphite in solution", Nanotechnology 22, 325201, 2011.

5. Y.C. Chang, J.Y. Chu, T.J. Wang, M.W. Lin, J.T. Yeh, and J-.K. Wang, "Fourier analysis of surface plasmon waves launched from single nanohole and nanohole arrays: upraveling tip-induced effects", Optics Express, Vol. 16, No.2 (2008), p740-747.

6. Jen-You Chu, Tien-Jen Wang, You-Chia Chang, Ming-Wei Lin, Jyi-Tyan Yeh, Juen-Kai Wang," Multi-wavelength heterodyne-detected scattering-type scanning near-field optical microscopy", Ultramicroscopy, Vol. 108 (2008), p314-319.

7. C. K. Chang, D. Z. Lin, Y. C. Chang, M. W. Lin, J. T. Yeh, J. M. Liu, C. S. Yeh, and C. K. Lee, "Enhancing intensity of emitted light from a ring by incorporating a circular groove", Optics Express, Vol. 15, No. 23 (2007), p15029-15034.

8. C.K. Chang, D.Z. Lin, C.S. Yeh, C.K. Lee, Y.C. Chang, M.W. Lin, J.T. Yeh, J.M. Liu, "Experimental Analysis of Surface Plasmon Behavior in Metallic Circular Slits", Applied Physics Letters Vol. 90, 061113 (2007).

9. H.S. Huang, M.W. Lin, Y.C. Sun, L.J. Lin, "Improving the spatial resolution of a magnetic force microscope tip via focused ion beam modification and magnetic film coating", Scripta Materialia Vol. 56, No.5 (2007), p365~368.

10. J.-Y. Chu, T.-J. Wang, J.-T. Yeh, M.-W. Lin, Y.-C. Chang, J.-K. Wang," Near-field observation of plasmon excitation and propagation on ordered elliptical hole arrays", Applied Physics A Vol. 89, No. 2 (2007), p387~390.

11. C.K. Chang, D.Z. Lin, C.S. Yeh, C.K. Lee, Y.C. Chang, M.W. Lin, J.T. Yeh, J.M. Liu, "Similarities and differences for light induced surface plasmons in one- and two-dimensional symmetrical metallic nanostructures", Optics Letters Vol. 31, No. 15 (2006), p2341~2343.

12. D.Z. Lin, C.K. Chang, Y.C. Chen, D.L. Yang, M.W. Lin, J.T. Yeh, J.M. Liu, C.H. Kuan, C.S. Yeh, C.K. Lee, " Beaming light from a subwavelength metal slit surrounded by dielectric surface gratings", Optics Express Vol. 14, No. 8 (2006), p3503~3511.

13. H.D. Yang, M.W. Lin, C.H. Luo, H.L. Tsay, and T.F. Young, "Effects of Ca substitution on the structural, electrical and magnetic properties of PrBa2Cu3O7-y", Physica C 203(1992).

14. T.H. Meen, Y.C. Chen, M.W. Lin, H.D. Yang, and M.F. Tai, "Suppression of Superconductivity in Y1-xPrxBa2Cu4O8 Prepared by Nitrite Pyrolysis Method", Jpn.J.Appl.Phys.31, 3825(1992).

15. H.D. Yang, M.W. Lin, C.K. Chiou, and W.H. Lee, "Magnetic ordering and chain transport of PrBa2Cu3O7-y", Phys. Rev. B.46, 1176 (1992).

16. H.D. Yang, M.W. Lin, "Effects of Zn and Ga substitution on the magnetic properties of PrBa2Cu3O7-y", Phys. Rev.B.44, 5384(1991).

Conference papers:

1. Lin, M. W.; Agapito, L. A.; Kioussis, N.; Dhindsa, S. K.; Liu, L. Z.; Lan, Q.; Cheng, M. M. C.; Wang, W. L.; Kaxiras, E. and Zhou, Z. X.; "The electrical transport study of suspended graphene nanoribbons", APS March Meeting, 2012.

2. Lin, M. W.; Ling, C.; Agapito, L. A.; Kioussis, N.; Zhang, Y.Y.; Cheng, M. M. C.; Wang, W. L.; Kaxiras, E. and Zhou, Z. X.; "Approaching the intrinsic bandgap in suspended high-mobility graphene nanoribbons", APS March Meeting, 2011.

3. S.C. Lo, M.W. Lin, S.R. Lee, S.J. Chen, and L.J. Lin, "In situ TEM Specimen Preparation for Micro-structural Analysis of SPM Tip", 8th Multinational Congress on Microscopy, (2007).

4. J.K. Wang, J.Y. Chu, T.R. Wang, M.W. Lin, Y.C. Chang, J.T. Yeh; Optics+Photonics; SPIE; (2007)

5. D.T. Shieh, M.H. Yang, Z.Z. Guo, P.S. Hsieh, S. Tsao, M.W. Lin, W.R. Liu, and N.L. Wu, "Structure Effect of Si-based Powder on Cycle Performance of Lithium Ion Battery", ECS-Lithium Ion Battery (2007).

6. Shen-Chuan Lo, Wei-Chih Hsu, Ming-Wei Lin, Chih-Jen Lin, Cheng-Cheng Chiang, and Song-Yeu Tsai, "Advanced DB-FIB/FETEM Techniques Studied the Recording Mechanism of Super-RENS Disk", Asia-Pacific Advanced Microscopy Symposium 2006.

7. B.J. Li, S.C. Kung, C.S. Tsai, M.W. Lin, S.C. Chou, "Plasmon resonances of Au nanowire array embedded in patterned AAO template" PacificChem symposium 2005.

8. M.W. Lin, S.C. Lo, C.C. Chiang, C.J. Lin, S.J. Chen, L.J. Lin, J.L. Horng, "The damage study for TEM sample preparation by using advanced DB-FIB techniques on nano-materials", Annual Conference of CSMS 2005, p392.

9. T. Ko, C.L. Chang, S.W. Chou, M.W. Lin, C.J. Lin, C.H. Shih, H.W. Su, M.H. Tsai, Winston S. Shue, and M.S. Liang, "High Performance/Reliability Cu Interconnect with Selective CoWP Cap", VLSI 2003, pp.109-110.

10. C.H. Peng, C.H. Hsieh, C.L. Huang, J.C. Lin, M.H. Tsai, M.W. Lin, C.L. Chang, Winston S. Shue, and M.S. Liang, "A 90 nm Generation Copper Dual Damascene Technology with ALD TaN Barrier", IEEE/ IEDM 2002, pp.603-606.

11. M.H. Tsai, S.W. Chou, C.L. Chang, C.H. Hsieh, M.W. Lin, C.M. Wu, Winston S. Shue, Douglas C. Yu, and M.S. Liang "CMP-Free and CMP-Less Approaches for Multilevel Cu/low-k BEOL Integration", IEEE/ IEDM 2001, pp.80-83.

12. M.W. Lin, C.H. Hsieh, C.W. Yang, M.H. Tsai, S.L. Shue, C.H. Yu, and M.S. Liang, "Stress Migration Study of Cu Interconnect with Various Low-k Dielectrics", AMC 2001, pp.457-463.

Patents:

1. Chou, Shih-Wei; Tsai, Ming-Hsing; Lin, Ming-Wei; "Method to Improve Planarity of Electroplated Copper", U.S. patent No. 7064068, 2006.

2. Lin, Ming-Wei; Tsai, Ming-Hsing; "Uniform Current Distribution for ECP Loading of Wafers", U.S. patent No. 7544281, 2009.

3. M.W. Lin, M.H. Tsai, R.O.C. patent No. 288441, 2007.

4. M.W. Lin, M.H. Tsai, R.O.C. patent No. 268293, 2006.

5. S.W. Chou, M.H. Tsai, M.W. Lin, R.O.C. patent No. 238461, 2005.

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