Design Engineering

BING SHI

Department of Electrical and Computer Engineering

University of Maryland, College Park, MD 20742.

E-mail: *********@*****.*** Tel: 404-***-****

Homepage: http://www.ece.umd.edu/~bingshi

EDUCATION

Ph.D student, Electrical & Computer Engineering, University of Maryland Aug.2008-Jul.2013

Advisor: Dr. Ankur Srivastava

Major: Computer Engineering, GPA: 4.00 (major) / 3.92 (overall)

Master program, Information Science & Electronic Engineering, Zhejiang University, China Sep.2005-Jun.2008

Major: Signal and Information Processing, GPA: 3.83

B.S., Information Science & Electronic Engineering, Zhejiang University, China Sep.2001-Jun.2005

Major: Information Engineering; Minor: Economics, GPA: 3.95 (major) / 3.82 (overall)

RESEARCH INTERESTS

Physical design (SSTA, gate sizing, etc); VLSI design of ASICs;

Thermal and power management for datacenters and microprocessors;

3D-IC cooling, reliability and timing analysis; Video and audio processing.

HONORS AND AWARDS

Best Paper Award, IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2012

Vice President of Women in Electrical and Computer Engineering (WECE), University of Maryland, 2011-2012

University of Maryland summer research fellowship, 2011 (only one selected department-wide)

Clark School of Engineering Distinguished Graduate Fellowship, University of Maryland, 2008-2010

Outstanding Graduate Student Scholarship, Zhejiang University, 2006

Graduate with Honor, Zhejiang University, 2005

Outstanding Undergraduate Scholarship, Zhejiang University, 2002, 2003, 2004

Excellent Student Leader Award, Zhejiang University, 2002, 2003, 2004

PROFESSIONAL SKILLS

Proficient in C, Verilog, MATLAB programming; EDA, ANSYS tools;

Familiar with DFM, STA, CUDA, parallel computing, data mining;

Plenty of experience in data structure & algorithms design, modeling & simulation techniques;

Experience in Unix/Linux programming: GDB, Make_le.

PROFESSIONAL EXPERIENCE

Research Assistant, Electrical and Computer Engineering, University of Maryland Sep.2008-Present

Statistical static timing analysis and gate sizing for 3D-ICs. Investigated the impact of through silicon via

(TSV)-induced thermal stress, and micro-channel cooling on transistor delay in 3D-ICs, and for the first time,

developed thermal, stress and cooling aware SSTA and gate sizing approaches for 3D-ICs.

Accelerating gate sizing optimization on GPU. Developed parallel algorithm based on randomized cutting

plane method to solve gate sizing optimization problem on GPU, and achieved up to 400x speedup. The project

is implemented using C and CUDA.

Thermal and power aware task scheduling in datacenters. Developed energy efficient task scheduling and

data placement policies for Hadoop based storage centric datacenters.

Dynamic thermal management for microprocessors. 1) Investigated dynamic thermal management schemes

under soft thermal constraint (overclocking), and achieved more than 30% performance improvement. 2)

Dynamic thermal management considering temperature-leakage interdependency.

Cooling of 3D-IC. Developed thermal model of 3D-IC with micro-channel heat sinks and TSVs, and

optimized the micro-channel cooling structure and TSV allocation. The proposed micro-channel design can

achieve 80% cooling power saving.

Research Assistant, ISEE, Zhejiang University Sep.2004-Jun.2008

VLSI design of H.264 video decoder. (1) Design, verification and synthesis of functional modulus such as

intra-frame prediction, DCT/IDCT transformation, quantization, etc. Emphasize on hardware-based algorithm

and parallel processing. As team leader, participated in system integration and test. (2) Fast algorithm for video

compression in H.264. Proposed optimization algorithm of intra frame prediction and a hardware-based double

hexagon search pattern to reduce the search points in motion estimation.

Teaching Assistant, Electrical and Computer Engineering, University of Maryland Sep.2008-Dec.2009

Worked as graduate teaching assistant: ENES 100 Introduction to engineering design; ENEE244 Digital logic

design; ENEE446 Digital computer design. Responsibilities include leading discussion classes, helping the

students with projects, grading homework and exams, and helping students with their specific problems.

Earned good evaluations each semester from both the students and the instructors.

SELECTED PUBLICATIONS

Book chapter

[1] Bing Shi and Ankur Srivastava, Thermal and Power-Aware Task Scheduling and Data Placement for Storage

Centric Datacenters, Handbook of Energy-Aware and Green Computing

Journal publications

[2] Bing Shi, Yufu Zhang, and Ankur Srivastava, Dynamic Thermal Management Under Soft Thermal

Constraints, to appear in IEEE Trans. on Very Large Scale Integration Systems (TVLSI)

[3] Bing Shi and Ankur Srivastava, Accelerating Gate Sizing Using Graphics Processing Units, IEEE Trans. on

Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2012

[4] Bing Shi and Ankur Srivastava, Unified Datacenter Power Management Considering On-Chip and Air

Temperature Constraints, Sustainable Computing: Informatics and Systems journal (SUSCOM),2011

[5] Bing Shi, Wei Zheng, Dongxiao Li and Ming Zhang, High Performance Multi-transform Coding Architecture

Design for H.264/AVC, Journal of Zhejiang University (Engineering Science), 2008

Conference publications

[6] Bing Shi, Ankur Srivastava, Avram Bar-Cohen, "Hybrid 3D-IC Cooling System Using Micro-Fluidic

Cooling and Thermal TSVs", IEEE Comput. Soc. Annu. Symp. on VLSI, 2012 [Best Paper Award]

[7] Bing Shi, Ankur Srivastava, "TSV-Constrained Micro-Channel Infrastructure Design for Cooling Stacked

3D-ICs", Int. Symp. on Physical Design (ISPD), 2012

[8] Bing Shi, Ankur Srivastava, "Cooling of 3D-IC Using Non-Uniform Micro-channels and Sensor Based

Dynamic Thermal Management", Annual Allerton Conf. on Commun., Control, and Computing, 2011

[9] Bing Shi, Ankur Srivastava, Peng Wang, "Non-Uniform Micro-Channel Design for Stacked 3D-ICs", Design

Automation Conf. (DAC), 2011

[10] Bing Shi, Ankur Srivastava, "Liquid cooling for 3D-ICs", Int. Green Computing Conf. (IGCC), 2011

[11] Bing Shi, Ankur Srivastava, "Thermal and Power-Aware Task Scheduling for Hadoop Based Storage Centric

Datacenters", Int. Green Computing Conf. (IGCC), 2010

[12] Bing Shi, Yufu Zhang, Ankur Srivastava, "Dynamic Thermal Management for Single and Multi-core

Processors under Soft Thermal Constraints", Int. Symp. on Low Power Electronics and Design (ISLPED), 2010

[13] Bing Shi, Wei Zheng, Hoangson Lee, Dongxiao Li and Ming Zhang, Pipelined Architecture Design of

H.264/AVC CABAC Real-time Decoding, Int. Conf. on Circuits and Systems for Commun. (ICCSC), 2008

[14] Bing Shi, Wei Zheng, Dongxiao Li and Ming Zhang, Fast Algorithm and Architecture Design for H.264/AVC

Multiple Transforms, Int. Conf. on Multimedia and Expo. (ICME), 2007

Patents

[15] Bing Shi, etc, Hierarchical Image Depth Extracting Method for Three-Dimensional Television (CN

101312539).

RELEVANT COURSEWORK

Introduction to Algorithms; Distributed Computer Systems; Computer Architecture;

VLSI Architecture; CMOS VLSI Design; Computer-Aided Design of Digital System;

Scientific Computing; Probability and Random Process; Data Mining & Machine Learning;

Game Theory; Digital Signal Processing

Contact this candidate