Manager Engineering

Location:

China

Posted:

December 10, 2012

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One Page ResumeDetailled ResumePublications and LecturesUS PatentsPress ReleaseU.S. PatentsUS Patent 5,043,933A 1-V programmable DSP for wireless communications [CMOS]

Director Engineering / Engineering Manager / Director R&D / Fellow

Technical Leadership / New Product Development / Strategic Planning /

Innovation & Technology Advocate / Design for Manufacturability and Quality

– High-Tech Products and Systems –

Engineering Manager: Through my assignments at global semiconductor corporations I gained extensive international experience in managing complex projects and developing successful SOC’s from concept to production. I had the opportunity to collaborate with and manage multicultural multi-site teams in Japan/France/USA, USA/Europe/China. I set-up and grew a robust and stable design team in Beijing. I fulfilled all senior design manager duties including creation and negotiation of the engineering content of legal contracts and policies, cost control and management of multi-million development budget, team and people development, IP protection, relationship with customers vendors and partners, product and technology roadmap.

New Product Development: Over the last 15 years, I used my expertise to deliver business driven contributions through technology and innovation. I am highly focused on work methods and processes that enable development and manufacturing of high quality products, meeting market requirements and achieving leadership position in hi-tech, high volume consumer space.

Technical Leader: By integrating the disciplines of system, algorithm and circuit design engineering, I led the development of scalable, reconfigurable dual core architectures and SOC that became the foundation of Analog Devices (ADI) wireless chip set business. While at Texas Instruments, I pioneered the development of low power fixed point DSP processor chips for wireless applications from the inception of GSM in Europe, enabling TI wireless handset business to get started with Ericson and then taking a leadership position with Nokia.

MSEE - Ecole Centrale de Lyon (France)

SelectedAchievements and SkillsDeveloped product that achieved highest volume (>40Munits/Year), highest revenue in ADI history.Developed large and recognized architecture and digital IC design work and IP in the low power/high performance MCU, DSP and wireless processing technical field.Improved gross margins through product cost reduction, yield improvement, reached profitability goals; accomplished multi foundry sourcing.Portfolio of 48 U.S. patents in the area of over-sampling data converters, CPU design, graphics and video processing, low- power DSP and SOC architecture. Elected Analog Devices Fellow in 2006.Skills: Strong technical leader, mentor and ambassador. Proficient in solving problems. Persistent and excellent achiever. Highly personable and capable of working across multi-disciplinary organizations. Extremely inventive and good at fostering innovation.

Career Overview / Professional Experience MediaTek Inc. (formerly Analog Devices B.U.) – Engineering Director, Fellow 2008-2010Analog Devices Inc. (Wireless Business Unit)– Engineering Director, Fellow 1996-2008Texas Instruments France (Wireless Business Unit)– Design Manager, SMTS 1992-1996Texas Instruments, Houston TX (DSP Division) – DSP Core Architect, MGTS 1989-1992

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