Jerzy P. Puchacz

**** ********* **

Pleasanton, CA 94588

tel: 925-***-****

fax: 925-***-****

cell:408-***-****

e-mail: abp6f1@r.postjobfree.com

SUMMARY:

More than 25 years of successful and progressive Engineering, Engineering Management and

Consulting Experience in Diversified Areas of Capital Equipment Development for Semiconductor,

Solar, Display, Thin Film, Power, Food, Pharmaceutical and Component Industries.

Extensive hands-on experience in Power RF applications for Plasma processing of wafers

and large surface areas, including PECVD, PVD, PEALD, Plasma Etch and surface modification.

Specializing in development and implementation of practical, cost effective, high reliability

equipment solutions for the leading edge Processing and Manufacturing Technologies.

Expertise in multiple aspects of Semiconductor Processing Equipment, Plasma Technology,

Industrial RF / Microwave Applications, Large Area Deposition, Vacuum Engineering, Thin Film

Technology and Control Systems.

Technical Management

Development of Advanced Processing Project and Program Management including

Equipment for Semiconductor, Photovoltaic, Multidisciplinary International Teams

Data Storage, Optical, Thin Film and

Development / Product Roadmaps

Nanotechnology Industries

Technology Management

Industrial Applications of RF and

Microwave Technology including:

Team Building and Skills Development

- Low Pressure Plasma Processing

- Inductive and Dielectric Heating Strategic and Tactical Planning

- Food Processing

Product Development, C&F to Market

- Barrier technology

Introduction

Atmospheric Plasma Technology

Organization and Technology Evaluation in

- ICP and Capacitive Plasma Torches

support of Mergers and Acquisitions

- Atmospheric Etch, Deposition and

Surface Modifications

Customer Relations and Technical Support

Vacuum / UHV Technology

Single Piece Flow Cellular Manufacturing

Process Development, Thermal and Plasma

Continuous Improvement and Quality Teams

Enhanced (ALD, CVD, PECVD, PVD, Etch,

Ash) Technical, Business and Organizational

Consulting

Control Systems, Software Development

Electronic Instrumentation, Diagnostic and

Data Acquisition

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EXPERIENCE:

JPP s Consulting, Inc., Pleasanton, California (web: www.jppsc.com)

President, CEO, September 2005 Present, (part time consultant in 1999, 2002)

Involved in wide scope of high-tech projects, from resolving technical issues and bringing new

technologies to setting up optimized organizational structures of the company.

Semiconductor / Thin Film / Solar Industries.

Multiple projects for the Solar Power Companies, leading Semiconductor Equipment

Manufacturers, Thin Film Companies and number of Start-ups pursuing leading edge RF Plasma

Processing Technologies. Main focus on hands-on implementation and optimization of the RF power

delivery, in-situ process diagnostics and cost effective implementation of the solutions. All projects

used system level approach to resolve customer issues and offer desirable alternatives.

Developed number of the large surface area plasma sources (ICP, CCP) as well as family of the

cost effective linear RF plasma sources for large surface area applications. Applications varied from

deposition to etching, pre-clean and surface conditioning.

Expanded company offering of the compact ICP atmospheric plasma torch sources for deposition

and etch applications. Designed and developed multi-mode ICP source for in-situ cleaning under

vacuum, atmospheric and sub-atmospheric conditions, using fluorinated and oxygenated chemistries.

Lead successful troubleshooting and redesign of Atmospheric Pressure Inductively Coupled

Plasma Sources for aggressive material removal applications. Project resulted in over 30% source

cost reduction, elimination/redesign of low reliability subassemblies and simpler, more desirable

system architecture.

Provided major PV panel manufacturer with novel, cost effective alternatives for HF RF power

distribution used in large surface, in-line PECVD tool. Design, prototyped and manufactured number

of RF diagnostic devices for use in system development and manufacturing.

Organized and provided ongoing support for service, repairs and upgrades of existing 300mm

deposition equipment for major Semiconductor Equipment manufacturer.

Conducted conceptual study, design and cost reduction of novel ion sources. Evaluated, re-

engineered and productized VHF Power Delivery systems for Plasma Processing applications.

Co-developed a new approach for RF delivery and process control for inductively coupled and

standard (parallel plate) plasma sources. Performed feasibility study of integrated, in-situ process

diagnostic tools for RF plasma processing.

Prepared methodology for evaluation of design and construction robustness for RF Power

Supplies and Matching Networks.

Resolved multiple RF Power delivery issues including optimization of the RF frequency, power,

selection, of the matching concept and control architecture. Overall benefits ranged from 10 to 40%

in cost reduction, estimated 50 to 200% reliability improvement, major reduction of system

complexity and significant enhancement of process repeatability.

Packaging /Food Industry

Designed and developed High Power, High Throughput RF food processing system

(sterilization, disinfection and disinfestations).

Designed and developed compact plasma source for barrier layer deposition in food containers.

Technology offers cost effective alternative to the metal or glass jars and bottles.

Devised and Developed cost effective system architecture alternatives for high throughput

Plasma Enhanced Deposition Systems for Decorative and Food & Drug Packaging Industries.

On average my projects resulted in 10 to 50% performance rate increase, and / or 15 to 60%

cost reduction. In all cases significant improvement in manufacturability, reliability and testability

of the systems was accomplished.

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- Jerzy P. Puchacz -

Genus Inc., Sunnyvale, California

Vice President, Systems Engineering, April 2002 August 2005

Responsible for development and commercialization of 300mm Atomic Layer Deposition

equipment for Semiconductor and Data Storage Industries. Lead New Product Development,

Continuous Improvement, Reliability and Cost Reduction efforts. In charge of Hardware, Software

and Process Technology Departments. Chartered with task of improving profitability of the existing

200/300mm product lines and introduction of cost effective designs for the next generation of the

ALD and CVD products.

Introduced advanced plasma approaches to extend and improve performance of the advanced

deposition equipment.

Lead multi-national team in development of the concept and advanced architecture of the high

throughput, high performance, expendable, Atomic Layer Deposition system.

Member of the Executive Mergers and Acquisitions team, responsible for equipment technology

assessment of potential partners.

Program Manager and/or member of the multiple, critical, Joined Development initiatives.

Jennings Technology, San Jose, California

Vice President of Engineering and Technology, July 1999 November 2001

In charge of Design Engineering, Manufacturing Engineering, Engineering Services, RF and

Development Labs. Responsible for identification, development and implementation of a new

strategic technologies.

Evaluated and implemented novel vacuum and plasma processing technologies resulting in

significant performance enhancement and cost reduction of Company s products. Applied company

core competencies to new products and development of a new market opportunities.

Responsible for solving technical and organizational issues regarding product reliability, on time

delivery, lean manufacturing, scrap and cost reduction.

Watkins - Johnson Company, Scotts Valley, California

Director of Plasma R&D, June 1997 - Feb. 1999

Directed Research and Development of new plasma technologies and new plasma processing

tools for Semiconductor Industry. Program Manager for 300mm High-Density Plasma Tools. Lead

multi-disciplinary project team which delivered finished high level product in 8 months comparing

to industry 18 month average.

Novellus Systems, Inc. San Jose, California

Director of Engineering - 300mm Program Manager, July 1995 - June 1997

Responsible for cost effective scale-up of Novellus PECVD and HDP equipment to the 300mm

wafer size and development of 300mm Dielectric product offering.

Developed competitive wafer handler architecture for next generation of the 200/300mm

processing tools.

ASM - America, Phoenix, Arizona

Director of Development Engineering, Sep. 1989 - June 95

Responsible for new product development, metal and dielectric CVD, PECVD, Epi and pre-

clean equipment. Project manager, leading international team developing modular, configurable

cluster tools and multiple, MESC compatible process modules. Project Manager for Cu CVD

system.

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BALZERS High Vacuum Systems and Components, Hudson, New Hampshire

Manager of Advanced Product Engineering, Feb. 1986 - Aug. 1989

Organized and managed Advanced Product Engineering Department consisting of mechanical,

vacuum, electrical / electronic and software groups. Project Leader of high throughput Compact

Disk Metalization system (CDI 700) for music CD's and CD ROM applications.

Manager of Electrical Engineering, May 1984 - Jan. 1986:

In charge of design and implementation of control systems for new products. Responsible for

upgrade, cost reduction and custom modification of existing ones.

NATIONAL MICRONETICS DISK, INC., San Diego, California

Manager of Electrical Engineering, Senior Project Engineer, Sept. 1982 - Apr. 1984

Responsible for all electronic, electrical and vacuum design. Designed and Developed control

system for continuous in-line, multi-chamber sputtering system with RF plasma etching capability.

EATON WAFER SYSTEMS, Santa Clara, California

Senior Project Engineer, Sept. 1981 - Sept. 1982

Responsible for design and implementation of analog and digital controls for semiconductor

capital equipment technology. Primary responsibility was to lead projects for design of sputtering

deposition and plasma etching RF and DC power supplies.

INSTITUTE of POWER SYSTEMS (Instytut Automatyki Systemow Energetycznych)

Gdansk, Poland

Research Scientist, Dec. 1971 - June 1981

Actively participated in advanced R&D work for Power Industry, Semiconductor Industry and

Research Institutions. Specialized in Power Electronics - power conversion, process control and

automation. Received twelve patents for control methods, system and circuits solutions.

EDUCATIONAL BACKGROUND:

1966 - 1972 Gdansk Institute of Technology, Gdansk, Poland - M.S.E.E. degree

1961 - 1966 Technical High School, Gdansk, Poland - Technical Degree in Electronics

Special Courses:

Solar Energy Technologies, Six Sigma Leadership, Danaher Business System (based on Toyota

Business System), Finance for Non-Financial Managers, Increasing Human Effectiveness, Total

Quality Control, Effective Negotiating, People Skills for Managers, Advanced Project, RF Plasma

Technology, Plasma Etching, Production & Diagnostic of Process Plasmas.

Patents:

Several patents in area of power electrical / electronic (Poland), and thin film processing systems

(US)

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