Process Design
Resume:
An information portal for the
MEMS and Nanotechnology community
What is MEMS?
Beginner's Guide
Kangfa Deng's Resume
File Attachments:CV_dengkangfa.pdf (18.1 KB, application/pdf) attached by dkf5201314 (Kangfa Deng) on 2012-10-25 03:06CV
Contact Micro-nano Electronic Building,
Peking University
Beijing, Beijing 100871
CN
**********@***.***.****** To be a researcher in MEMS field
Skills MEMS inertial sensor design and fabrication
Qualifications 1.B.E. Electronics Science and Technology(2010)
Huazhong University of Science and Technology
Wuhan,China
2.M.S. Microelectronics Engineering and Solid State Electronics (2013)
Peking University
Beijing,China
RESEARCH EXPERIENCE
1 Design an inertial micro-switch (Jan-Oct 2012 )
The switch was designed to prolong contact time
A physical model of the switch was established to optimize the device structure and simulated by ANSYS and Simulink.
The switch was fabricated by bulk micromachining process(@National Key Laboratory of Micro/Nano Fabrication Technology at Peking University)
2 Study on BCB bonding process (Oct-Dem 2011)
Individual test of BCB bonding was passed to get the best term of the process
Flow behavior of BCB in adhesive bonding was studied so as to reduce transverse deformation of BCB structure
3 Design a differential piezoresistive pressure sensor (Jun- Oct 2011)
The position of the piezoresistive resistance was optimized by ANSYS
The process of piezoresistive resistance was simulated by Silvaco to meet the design demand
The sensor was fabricated by bulk micromachining process
4 Tapeout a piezoresistive accelerometer (Jan- May 2011 )
The sensor was fabricated by bulk micromachining process(@National Key Laboratory of Micro/Nano Fabrication Technology at Peking University)
Updated: 2012-10-25
Contact this candidate