John Cawley
Email: *********@********.***
Address: ***** ****** ******* ****
City: Fremont
State: CA
Zip: 94539
Country: USA
Phone: 408-***-****
Skill Level: Director
Salary Range: $200,000
Primary Skills/Experience:
See Resume
Educational Background:
See Resume
Job History / Details:
John Cawley
47297 Rancho Higuera Rd
Fremont, CA 94539
(Cell) 408-***-****
*********@*****.***
OBJECTIVE Manufacturing or Component Engineering Leadership role.
PROFESSIONAL EXPERIENCE
Juniper Networks, Sunnyvale, CA 2010 present
Director, Front-end Test/ Mfg / Mech Engineering (re-org)
Manage WW Ops Engineering team (US, India and China) - 4 mgrs, 25 engineers
Technical disciplines: Front-end Test, Manufacturing and Mechanical Engineering
Responsible for all products companywide for both NPI and sustaining phases
Support product design centers in 3 different geographies (US, and India)
Planning and Qualification of New Factory Sites; 6 WW (US, China, Malaysia Mexico)
DFM, DFT, DFA, BOM structuring reviews
Own PCB layout and Mechanical design guidelines
Conduct semi-annual technology roadmap reviews with CM partners and PCB suppliers
Drive yield improvements and cost reductions across all products via value engineering
Reliability testing on L2 process for ASICs pkgs and other challenging component pkgs
Maintain technology roadmaps for PCB, Mechanical, and Thermal
Advise DE and Supply chain on PCB, Mech, and Therm sourcing selections
Qualified all mfg sites WW for Pb-free process, 6/6 RoHS
HDPUG and iNEMI consortiums members and participants
Implement best practices and processes across all regions
Planned and managed annual dept budget of ~$12M
Juniper Networks, Sunnyvale, CA 2004 2010
Director, Test/ Component / Manufacturing Engineering
Managed WW Ops Engineering team (US, India and China) - 4 mgrs, 35 engineers
Technical disciplines: Test, Mfg, Mechanical, Process and Component Engineering
End-to-end manufacturing, component and test for Enterprise products
Support all products from the Switch Security BUs in both NPI and sustaining phases
Support product design centers in 3 different geographies (US, India and China)
Planning and Qualification of New Factory Sites; 6 WW (US, China, Malaysia Mexico)
DFM, DFT, DFA, BOM structuring and Packaging reviews
Maintain all component technology roadmaps
Advise DE and Supply chain on primary and secondary component sourcing selections
Implement best practices and processes across all regions
Conduct quarterly score card and quality reviews with CMs and key comp suppliers
Quality and Reliability monitored through ORT and OOBA sampling on all products
Planned and managed annual dept budget of ~$15M
NetScreen Technologies, Sunnyvale, CA 1998 2004 (Acquired by Juniper in 2004)
Director, Tech Ops- Mfg Test, Quality and Component Engineering
Start-up opportunity. (IPO in Dec. 2001)
Assembled a team from scratch responsible for Test, QA, CE, Reliability and RMA repair
Calculated and published MTBF targets for all NetScreen products
Responsible for EMI and Safety compliance testing
Managed RMA FA and repairs in house for all products
Compiled pareto data from repairs and reviewed with design team weekly
Tested and recommend numerous design fixes, both HW and SW, to development team
Owned qualification and cost reductions on all 2nd source components
Conducted DFT reviews and developed mfg test programs for all products
Silicon Graphics (SGI), Mountain View, CA 1992 - 1998
Manager, Component Engineering
Managed component engineering company wide; 24 member team in 3 locations WW
Successfully consolidated all 3 divisional CE groups into one centralized organization.
(This served as the first working model for other functional groups within the company)
DVT for all CPU and Memory devices. Characterized key parameters and ranked
suppliers by margin to spec in our product environment
Built and tested large CPU, Memory and I/O configurations as part of qual process
Managed component AVL, 2nd source qualifications and cost reductions opportunities
MIPS Computer Systems, Sunnyvale, CA 1986 1992
Test engineer/ supervisor
Start-up opportunity. (IPO in Nov. 1989)
Developed test programs and test patterns to characterized MIPS RISC processors
Performed FIB repairs on CPU circuits as part of failure analysis process
Designed high speed DUT interface boards complete with TDR measurements
Developed new voltage vs. freq characterization algorithm that Teradyne later patented
Intel Corporation; Santa Clara, CA1982 1986
Product Test Engineer 1982 1986
Developed test programs and test patterns to characterize 80286 386 family of CPUs
Member of a 5 man task force team that brought next gen CPU products to production
Developed the first Hot Chuck at Intel used for testing wafers at high temperatures
EDUCATION B.S.E.E. - Cogswell College
Certified program languages: Basic, FORTRAN, Pascal, C, C++, Perl and Shell Script