Engineer Project

Michel A. Rosa

(U.S. Permanent Resident)

abnsu4@r.postjobfree.com

SUMMARY

Technology professional with over 15 years of product development and technology commercialization experience.

Cross functional experience with a PhD in Electronic Engineering and an MBA with dual majors in Business Strategy &

Marketing.

PROFESSIONAL EXPERIENCE

Technology & Strategic Business Development Consultant, (Jan 2009 – Present)

Self-Employed, California, USA.

Working with NICTA to develop product and business model strategies around existing IP in the areas of Computer

Vision and Facial Detection/Recognition. Includes assistance with raising seed capital for spin-out company and

technology partner discussions with prospect companies in the U.S.

Preparation of 2008 Annual Report and Board Reports for NICTA’s Queensland site.

Business Development & Operations Manager, (Jan 2008 - Oct 2008)

National ICT Australia (NICTA), Australia.

NICTA develops technologies in a number of high tech areas including, IT, Telecommunications and Semiconductors.

This role presided over technology development for Security and Surveillance Applications of Facial Recognition and

Computer Vision, Wireless Mesh Networks, Machine Learning, Human Computer Interaction (HCI) and Embedded

Systems.

Successfully negotiated and closed a 4-yr/$10M funding agreement.

Fast-tracked negotiation and closure of a technology development activity with a major rail infrastructure provider

based upon the application of computer vision technologies for object detection. Successful prototype demonstration

leading to $300K product order.

Coordinated project management and carried out business development activities in support of R&D staff to develop

a technology roadmap/evaluation for commercializing NICTA technologies through contract R&D, licensing and

spin-out opportunities.

Developed Strategic Plan and Business Plan based on commercialization of computer vision, mesh network, machine

learning (planning/simulation) and resource management technologies for the global security, surveillance and

emergency services industries.

Created strategic partnerships in the USA, Singapore and Middle-East enabling JV’s in technology development and

commercialization of NICTA’s computer vision technology, better positioning NICTA to tap the $100Bn Global

Security, Surveillance and Emergency Services market.

Grew operations team from 2 to 6 people, supporting the organizations’ growth from 50 to 100 personnel.

Held joint management responsibility for the $6M+ annual budget.

Created annual and quarterly reports for NICTA board members on technology and business development activities.

Centre & Industry Development Manager, (2005 - 2007)

Australian Microelectronics Centre (AMC), Australia.

The Australian Microelectronics Centre is chartered with fostering the development and growth of the electronics and

microelectronics industry sectors within Australia. The centre works with members of industry and academia to promote

and develop local technologies, resources, capabilities and development opportunities.

Developed strategic marketing and operational plans that helped positioned the centre, increase brand awareness and

deliver products/services to stimulate the local microelectronics industry sector.

Brokered domestic and international strategic partnerships enabling access to over $50M in resources and capabilities

that comprised IC and MEMS design/fabrication/test and inspection facilities for the centre and its member

companies.

Worked with member companies to secure ASIC design wins as well as microelectronics consultancy services.

Successfully lobbied a $250M government investment toward the construction of a 300mm Wafer Fab in the

attraction of a U.S. based multinational IC vendor.

Formed strategic partnership with Japanese consortium enabling subsidized access to VLSI IC fabrication for R&D

MPW runs at commercial foundries enabling access to 0.25um, 0.18um, 90nm and 65nm process technologies.

Created a ‘sister’ centre in China based on a strategic partnership with the Qingdao University of Science and

Technology, for the R&D of robotics and the delivery of education and training in robotics.

Negotiated purchase and contract renewals for Commercial, Education and R&D licenses of Cadence and Synopsys

IC design tools reducing operational costs by $100K on previous years.

Initiated educational program in microelectronics/electronics design and VLSI/MEMS fabrication involving partner

organizations from K-12, vocational and tertiary institutions.

Held management responsibility for $2M annual budget.

MEMS Product Development Engineer, (2000 - 2004)

PARC, Inc., USA.

The Palo Alto Research Centre (PARC),Inc is a wholly owned subsidiary of Xerox Corporation working in the

Information Technology, Semiconductor, Biotech and Renewable Energy sectors of technology R&D.

Lead MEMS project engineer at PARC developing MEMS based inkjet technologies for the >20ppm color office desk

top and high end printing products. Prototyped original and distinct inkjet devices based upon Polysilicon MEMS

actuation, Ni & PbSn electroplating and wafer scale alignment and packaging.

Presented novel technologies for transfer to commercial foundry partner during development phase of a new

integrated MEMS based solid ink jet actuator design and packaging solution.

Managed multidisciplinary project teams and scheduled deliverables amongst engineering and scientific staff. Teams

included semiconductor fabrication and test technicians, MEMS device and system modelers, MEMS design and

fabrication engineers.

Co-project lead developing a Vertical Cavity Surface Emitting Laser (VCSEL) / Micro-Lens integration process for

Fuji Xerox (Japan) and Xerox Corp. (USA). This included successful design and fabrication of a solid glass

microlens array and the development of an alignment, assembly and fix process with tolerances of 1µm in x-y-z

planes. Successful microlens integration at the chip level reduced final product costs by thousands of dollars in

eliminating the need for additional bulk optics in the optical path of laser based print systems.

Successfully developed a wafer scale packaging process for MEMS based ink jet devices utilizing Ni/Au/PbSn

electroplating in conjunction with thick resist processing ( >150um), XeF2 dry release etching and solder reflow

alignment processes.

Designed and prototyped a multiple 4” wafer electroplating tool allowing increased wafer throughput by

simultaneously electroplating up to 8 wafers per cycle.

Post-Doctoral Engineer - MEMS, (1999 - 2000)

Xerox Corporation, USA.

Xerox Corporation researches, designs and builds world-class laser based and direct marking printer and copier

products for the industrial, office and home markets.

Lead a group of engineers and technicians to develop proof of concept all-metal, MEMS based 1156 mirror optical

switching fabric in less than 6 months. This included design/fabrication of MEMS and device control aspects of the

project, device design/modeling, IP application(s), fabrication process definition, mask layout, qualification of

fabrication processes, prototype device testing and system level design consideration.

Actively participated in the strategic business development of optical switch technology including presentation to

Venture Capitalists, Angel Investors and potential licensee companies.

Designed and built custom XeF2 semi-automated dry etch tool improving wafer throughput and saving over $100K in

project costs.

Lead project engineer (PARC) in a $15M U.S. Government funded, consortium based project that successfully

developed and demonstrated a design and fabrication process for the commercial development and manufacture of a

combined SOI/3-Layer Polysilicon fabrication process for Micro-Opto-Electro-Mechanical Systems (MOEMS)

development.

Achieved world-first; flip-chip device packaging and assembly process utilizing PbSn solder bump technology for

the integration of III-V solid-state laser diodes (670nm and 400nm edge emitting laser devices) onto MEMS devices.

Successfully demonstrated a-Si Detector Array for optical position detection in a MEMS free-space switch designed

for use with 1.3um and 1.55um communication lasers.

Assisted in prototype development of MEMS based VCSEL beam scanning device using Micro-Lens resonator;

Assisted in prototype development of 1D MEMS Mirror Micro-ROS on SOI wafer for wobble compensation in

existing laser based ROS devices.

CONSULTING PROJECTS

Intellectual Property Analysis - Biotech Industry, (May 2005 - Feb 2006)

A.I. Scientific Pty. Ltd.

Investigated competitor products in Aus, U.S., Europe and Japanese biotechnology markets, determining which

infringed or were infringed upon by A.I Scientific products.

Successfully determined infringement by one competitor and worked with CTO on strategy for enforcement.

Reduced IP maintenance costs for company by $30K by advising of invalid or unenforceable patents; working

Closely with CEO and CTO on defining importance and relevance of existing granted patents and applications.

PROFESSIONAL ACHIEVEMENTS

Authored 25 Granted U.S. Patents.

Authored 16 Refereed International Journal & Conference Publications.

Recipient of Three PARC Golden Acorn Award(s): One of Top 5 Most Valuable Patents (2002 - 2004).

EDUCATION

MBA (Queensland University of Technology), 2006.

Major/Minor: Marketing / Strategy / Entrepreneurship (Minor).

Ph.D. Engineering (Griffith University), 1999.

Research Area: Microsystems Technology & Micro-Electro-Mechanical-Systems (MEMS).

B.Eng. Electronic Engineering (First Class Hons) (Griffith University), 1995.

Area of Concentration: Computer Systems & Information Technology.

CERTIFICATIONS & ASSOCIATIONS

Emergency Response Training (ERT) - (Haz Chem, First Aid/CPR, Personnel Rescue / Triage, Etc).

Active Member of SEMI - (Microsystems, Packaging and Lithography Groups).

Novell Certified Network Engineer (CNE) 4.11 / Microsoft Certified Professional (MCP).

IC/MEMS DEVELOPMENT AND COMPUTER SKILLS

Wet/Dry Etch, Electro/-less Plating, Thick Resist Processing (70um - 1mm), Contact/Projection Lithography.

E-Beam/Sputter/Thermal Deposition, LPCVD (Si3N4, Si, SiO2), CMP (SU-8/Ni/Si).

Wafer Scale Assembly/Packaging and Flip-Chip MEMS/Laser Die Packaging.

Si/GaAs/SOI/SiO2/SiC Wafer(s) 2”, 4” & 6”.

Cadence Virtuoso, L-Edit, MEMS Pro, ANSYS Multiphysics, Solid Works, LabView.

PMBOK / Six Sigma / MBA – Project Management;

Windows XP / MS Office Suite / Sun Microsystems Star Office Suite / Google Docs.

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