Engineer Manager

SHIVA MANDEPUDI

607-***-**** © *****.*********@*****.***

OBJECTIVE: Seeking a challenging career in the area of renewable energy. Pursuing a work environment

where my education/research skills and industry experience would be most utilized.

EDUCATION: PhD in Materials Engineering, State University of New York at Binghamton, NY, GPA:

3.83/4.00.

MS in Industrial Engineering with Specialization in Electronic Packaging, State University

of New York at Binghamton, NY, GPA: 3.83/4.00.

BS in Mechanical Engineering, Birla Institute of Technology and Science, Pilani, India.

SUMMARY: A talented professional with experience in process and product development, thin film

deposition (PVD, CVD), materials selection/characterization, microfabrication, MEMS,

mechanical behavior, reliability, failure/root cause analysis and electronic packaging.

Detail-oriented and an independent worker. Strong statistical background with exceptional

analytical and problem solving abilities. Excellent communication skills and a strong ability

to perform as part of a team.

SKILLS: Design For Six Sigma (DFSS), Design Of Experiments (DOE), Statistical Process Control

(SPC), Materials Characterization Techniques (XRD, SEM, WDS, EDX, Electron

Microprobe, Profilometry, Stress – Temperature, DSC, TGA, DMA), Industry Standard

Reliability Tests (Thermal Cycling, Shock, Vibration, Torsion, Shear, Pull, Drop), Failure

Analysis Techniques (Dye Penetration, Optical Microscopy, X Ray, Cross-sectioning, FIB,

SAM, Electrical Probing, Warpage), Statistical Data Analysis (Minitab, Weibull, Statistica,

Optimas, Arena, Excel, Matlab, Mathematica), Clean Room Procedures, Photolithography,

Vacuum Equipment Design/Setup/Maintenance.

EXPERIENCE: Product Development Engineer 03/08 - Present

Kennametal Inc.

Latrobe, PA

• Project leader and a team member on key projects for the development of new metal

cutting grades to serve several industries. Scale up products into manufacturing and

assist with commercial launch of product.

o Evaluate new CVD, PVD coatings and post coat treatments through internal

metal cutting tests and field tests.

o Interact with product specialists and application engineers to investigate field

failure mechanisms and customer requirements. Implement QFD techniques to

identify and validate Critical To Quality (CTQ) needs of various customers.

o Responsible for launch of new products through a comprehensive Stage-Gate

process. Work with global departments (product management, supply planning,

manufacturing etc.) to ensure project requirements are met at each Gate.

o Monitor field sales and resolve manufacturing issues involved with new

product introduction.

o Collaborate with key suppliers through joint development projects to develop

advanced machining grades.

Process and Product Development Engineer 07/07–11/07

SHIVA MANDEPUDI

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Momentive Performance Materials (formerly GE Advanced Materials)

Strongsville, OH

• Research engineer in a New Product Introduction (NPI) team involved in the

development of next generation components for semiconductor processing equipment.

o Developed processes for robust operation of a PVD system and identified steps

to transfer an R&D tool into manufacturing equipment.

o Conducted experiments, utilized modeling and performed characterization to

deposit coatings with thickness and resistance uniformity across large diameter

substrates.

o Implemented photolithography processes to develop test samples and actual

devices.

o Completed a DFSS project to reduce the risk of electrical resistance shift during

product development. Conducted GR&R studies and utilized statistical

techniques for data analysis.

Research Associate, Binghamton University, NY 05/03–06/07

Facilities User, Cornell Center for Materials Research (CCMR) and

Cornell Nano Fabrication (CNF), NY

• Processing and characterization of novel composite Shape Memory Alloy (SMA) thin

film structures for microactuators and vibration damping applications.

o Fabricated two-layer composite structures to engineer Shape Memory Effect

(SME) – TiNi+TiNiCu and TiNiHf+TiNi.

o Demonstrated a transformation temperature range greater than 100 C with

approximately linear rate of stress increase, high stress recovery and a lower

hysteresis width.

o Developed robust processes for the deposition of a three-layer composite thin

film structure.

o Obtained recovery stresses greater than 550 MPa with a transformation

temperature range of 130 C.

• Design and development of a vacuum system (magnetron sputter) for thin film

deposition.

o Achieved high vacuum (2X10-7 torr) using Helium leak detection and welding.

o Designed and developed a wafer rotation mechanism and a manual shutter unit

incorporating the principles of vacuum science.

o Aligned sputter guns to allow film alloying, multi layer fabrication,

cosputtering and control the composition of thin films.

• Extensive use of characterization techniques at CCMR and CNF.

o Obtained quantitative composition information from SMA thin films using

WDS analysis, performed qualitative analysis by X ray mapping and EDX

technique.

o Utilized XRD for phase identification and crystallinity evaluation of annealed

thin films.

o Measured change in wafer curvature with temperature to calculate film stress.

o Investigated cross-sectional morphology of SMA thin films using SEM.

SHIVA MANDEPUDI

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• Design and development of a Thermally Actuated Thermal Switch (TATS) utilizing

SMA thin film for actuation.

o Identified SMA (TiNiCu) and annealing parameters necessary for required

transformation characteristics.

o Incorporated a Copper film into the design to provide necessary heat transfer.

o Copper film buckling through SMA film actuation controlled the heat flow in

the device.

• Clean room manager for the Microfabrication lab at Binghamton University.

o Constructed a class 100 and a class 1000 clean room (first in the University).

o Assembled, developed operating procedures and maintained all equipment

utilized in photolithography (spinner, DI water system, chemical hoods, mask

aligner etc.).

o Trained masters and doctoral students as clean room users.

Research Associate, Area Array Consortium 01/01 – 05/03

Universal Instruments Corporation (Unovis Solutions), NY

• Developed processes and explored issues utilizing SPC in a lead-free mixed assembly

of surface mount and through hole components using Alternative Assembly and Reflow

Technology (AART).

• Investigated the robustness of through hole solder joints (tin-lead and lead free) formed

using AART and wave soldering by a pull test. Compared fillet types and peak forces.

• Developed processes (die placement, underfill dispense and cure, substrate reflow etc.)

for the fabrication of Flip Chip CSPs.

• Implemented a process through a DOE approach and evaluated the thermal reliability of

mirror imaged double-sided CSP and BGA assemblies.

• Examined Air to Air Thermal Cycling (AATC) reliability of double-sided BGA/QFP

and CSP/Passive components assemblies. Correlated assembly stiffness to reliability.

• Investigated rheological properties of electrically conductive adhesives for surface

mount assembly.

• Utilized statistical techniques and compared the thermal reliability of area array devices

with lead-free alloys to tin-lead solder assemblies. Compared failure locations and

mechanisms.

• Scrutinized the defects (solder balling, solder bridging, fillet lifting, solder oxides etc.)

in lead-free wave soldered component assemblies.

• Executed BGA ball shear testing as per JESD22-B117 to simulate forces experienced

during handling, manufacturing and assembly. Investigated the impact of aging and pad

metallurgy on the failure modes of several lead free solder alloys.

PUBLICATIONS:

• Mandepudi, S. and Ackler, H., “Processing and Characterization of Composite Shape

Memory Alloy Thin Films for Improved Device Control”, Abstract submitted to

Transducers, 2009.

• Primavera, A., Meilunas, M., Mandepudi, S., Pitarresi, J., and Parupalli, S.,

“Measurement and Prediction of Reliability for Double-Sided Area Array Assemblies”,

53rd Electronic Components and Technology Conference. Proceedings, May 2003,

New Orleans, LA.

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• Chaparala, S., Pitarresi, J., Parupalli, S., Mandepudi, S., Meilunas, M., “An

Experimental and Numerical Investigation of the Reliability of Double sided Area

Array Assemblies”, Journal of Electronic Packaging, Vol. 128, pp. 441-448, December,

2006.

• Mandepudi, S. and Srihari, K., “Reliability of Double-Sided BGA, CSP and QFP

Assemblies”, Technical Report, Area Array Consortium, Universal Instruments

Corporation, Binghamton, NY, 2002.

• Meliunas, M. and Mandepudi, S., “Air to Air Thermal Cycle Reliability Testing of

BGA/CSP Components Assembled to Test Board 6 and Test Board 7”, Technical

Report, Area Array Consortium, Universal Instruments Corporation, Binghamton, NY,

2001.

• Mandepudi, S. and Srihari, K., “Mechanical Reliability of Surface Mount and Through

Hole Assemblies”, Area Array Consortium, Universal Instruments Consortium,

Binghamton, NY, 2002.

COURSES: Physical Phenomena in Micro & Nano Technology, Microfabrication Processes, Processes

for Electronics Manufacturing, Advanced Issues in Electronic Packaging, Applied

Probability and Statistics, Modeling and Simulation, Quality Assurance for Engineers,

Electronic Properties of Materials, Mechanical Behavior of Engineering Materials,

Techniques for Studying Solids, Chemistry of Solids, Reactivity of Materials.

ADDITIONAL EXPERIENCE:

• Completed the ‘Fundamentals of Vacuum Technology’ course conducted by the

American Vacuum Society (AVS). Understood the physics of vacuum generation,

contamination sources and prevention.

• Trained undergraduate seniors for the Fundamentals of Engineering (FE) exam on

Thermodynamics, Spring 2005 and Spring 2006.

• Teaching Assistant for undergraduate courses – Thermodynamics and Engineering

Project Management, graduate course – Processes for Electronics Manufacturing.

• Advised undergraduate seniors on final projects: UV mask aligner (material selection)

and wafer rotation mechanism (fixture design and setup).

• Completed comprehensive DFSS, DMAIC training.

• Systems Engineer at Polaris Software Lab. Ltd. – Coded rules in C++ for a global

banking system and performed testing in an UNIX environment.

• Industrial Trainee at Tractors and Farm Equipment Ltd. – Developed a vendor quality

management system, database and a search engine for the certification and

identification of long term vendors.

• Completed the ‘Comprehensive Application Engineering’ course provided by the

Kennametal Knowledge Center. Received ‘Certified Metalcutting Professional (CMP)’

certification through Tooling University.

ACHIEVEMENTS:

• ‘Innovator of the year 2009 - Beyond’ award at Kennametal for the project team.

• Received complete scholarship towards graduate studies.

• Ranked top 5% in India for admission to undergraduate studies.

• Ping pong and volleyball champions at the International Student Festival sports meet,

Binghamton, NY, 2006.

REFERENCES:

Harold D. Ackler, Ph.D

Materials Scientist

SolFocus Inc.

SHIVA MANDEPUDI

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Mountain View, CA 94043

Phone: 408-***-****. Email: ******@****.***.***

David Rusinko

Engineered Coatings Technology (ECT) Manager

Momentive Performance Materials

Strongsville, OH 44149

Phone: 440-***-****. Email: *****.*******@*********.***

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