Customer Service Engineer
Resume:
VATSAL SHAH
** ***** ** ******.*.****@*****.***
Chestnut Hill, MA – 02467 Phone: 607-***-****
SKILL SETS
• More than 5 years of advanced working knowledge of process development, applications development, testing, designing and SQA
• Experienced in Design of Experiment (DOE), Statistical Process Control (SPC), Six Sigma Methodologies, Failure Mode and
Effect Analysis (FMEA). Root Cause Analysis, GAP Analysis, ISO standards and Lean Manufacturing
• Sound understanding of Deviation Management and CAPA quality measures
• Demonstrated success in developing, implementing and managing new processes to improve quality and productivity
• Strong test plan development, troubleshooting and support of new and existing applications
• Experienced in new business development by assisting customers applications development
• Good understanding of different IPC, ROHS and ISO standards
• Trained technical team as needed to build knowledge base
• Self-motivated; able to set effective priorities and implement decisions to meet operational deadlines
• Persistent self-starter with strong technical-writing skills
• Demonstrated strong Interdepartmental Coordination and Collaboration and Staff Supervision and Training
COMPUTER SKILLS
Statistical Packages: JMP, Minitab R15/R14/ R13, SAS, QC CALC, STATA.
Modeling and Analysis Softwares: Arena 7.0, CAD, CimLITE Quality Simulator, MAPICS system.
Desktop Applications: MS Word, Excel, PowerPoint, Access, Visio, Project.
Languages: C, C++, VC++, Linux, HTML, Matlab, Visual Basic and VB .Net.
Database Systems: SQL.
PROFESSIONAL EXPERIENCE
Applications Engineer Apr 09 - Present
IDS Imaging Development Systems Inc., Woburn, MA
• Responsible for construction of test units for feasibility studies based on customer requirements;
• Responsible for determining root cause of customer problems and providing corrective measures;
• Resolving technical questions from direct customers and distributors both from USA and rest of the world;
• Responsible for process validation by providing innovative solutions for IDS products;
• Assisting customers in their software development using C, C++, Java and Visual Basic;
Accomplishment:
• Increased company’s revenue by 25% by providing support to the new and existing customers globally.
• Implemented continuous improvement to customer’s applications increasing the process reliability.
• Worked with Marketing to edit technical documents and marketing materials.
• Strengthened the company’s knowledge base by preparing technical section.
Advanced Process Development Engineer March 06 – Feb 09
Speedline Technologies Inc., Franklin, MA
• Identified the process requirements and the critical parameters for several emerging technologies;
• Designed and executed formal experiments and perform data analysis before executing for new business opportunities;
• Used quality and reliability tools such as DOE, SPC, Six Sigma Methodologies, FMEA, Deviation Management and CAPA
methodologies for process validation;
• Responsible for control and management (GMP) of manufacturing and quality control of all new process;
• Responsible for beta software testing of new applications and identifying critical issues prior to the software release;
• Team leader in researching and developing reliable processes and to facilitate continuous improvement;
• Assisted internal and external customer to setup new applications and periodic updates;
• Team leader in providing pre and post sales support to gain business opportunities;
Accomplishment:
• Developed a Sales modeling tool that helped the sales/marketing initiatives to obtain new business opportunities by 20%.
• Improved productivity of the manufacturing plant by modifying the layout of the assembly line.
• Prepared change control and ready to ship documents for the manufacturing.
• Participated in inventory management program to optimize the inventory levels and reduced the inventory levels by 15%.
• Identified important cost saving opportunities in the current manufacturing process.
INTEGRATED ELECTRONICS ENGINEERING CENTER (IEEC), May 04 – Jan 06
Graduate Research Assistant Binghamton, NY
Project for Amphenol Aerospace Operations, Sidney, NY May 04 – Jan 06
• Reduced the set up time by implementing changes in the process;
• Studied the effect of different process parameters on the quality of the solder joints;
• Used Minitab and Excel to estimate the content of tin mixed in the solution and its effect on reliability and quality of the joint;
Accomplishment:
• Reduced the process cycle time by 25% streamlining the workflow.
Project for Analog Devices Inc., Boston, MA Feb 05 – Mar 05
• Determined the presence of solder on lid surface and in castellations after lid reflow process;
• Investigated and analyzed different conditions of reflow parameters and different combinations of die attach adhesives;
Accomplishment:
• Suggested the cause and effects of solder on lid surface and in castellations based on the testing.
Project for Endicott Coil Company Inc., Binghamton, NY July 04 – Aug 04
• Developed an experimental procedure for determining the maximum operating temperature of the components in the control unit
of a light fixture;
• Conducted time based analysis of the components at different temperatures and different atmospheric conditions.
Accomplishment:
• Developed an experimental procedure for determining the maximum operating temperature of the components in the control unit
of a light fixture.
BHARATI CELLULAR LTD., Sept 02 – May 03
Quality Assurance Engineer Mumbai, India
• Worked with Quality Control Department to evaluate the performance of the customer service representatives;
• Used control charts to monitor their performances and identify performance improvement activities;
• Used design of experiments (DOE) to identify the factors affecting their performance.
Accomplishment:
• Recommended methods of improvement to the customer service representatives;
• Improved the performance of the customer service representatives by 20%.
EDUCATION
BINGHAMTON UNIVERSITY 2003 – 2006
Master of Science in Industrial and Systems Engineering Binghamton, NY
MUMBAI UNIVERSITY, INDIA 1997 – 2002
Bachelors of Science in Electrical Engineering Mumbai, India
PUBLICATIONS
1. “Broadband Printing: The New SMT Challenge”, Rita Mohanty, Vatsal Shah, Gary Nicholls, Ron Tripp, To appear: Proceedings
of the APEX Conference, April 2009.
2. “Assembly Process Challenges For 01005 Components”, Rita Mohanty, Vatsal Shah, Proceedings of the SMTA International,
August 2008.
3. “Effect of Solder Paste Printing Defects on End of Line Defects”, Vatsal Shah, Proceedings of the SMTA International, August
2008.
4. “Investigating the 01005 – Component Assembly Process Requirements”, Rita Mohanty, Vatsal Shah, Arun Ram, Bill Coleman,
Ron Lasky, Proceedings of the APEX Conference, April 2008.
5. “Solder Paste Inspection Technologies: 2D-3D Correlation”, Rita Mohanty, Vatsal Shah, Paul Haugen, Laura Holte, Proceedings
of the APEX Conference, April 2008.
6. “Process Capability Indices for 01005 Stencil Printing Process”, Krishnan Vishwanathan, Sudeep Nambiar, Daryl Santos, Arun
Ramasubramanian, Rita Mohanty, Vatsal Shah, Proceedings of the IMAPS Conference, November 2007.
7. “Correlating Print Process Defects to End of Line Defects”, Vatsal Shah, Rita Mohanty, Arun Ramasubramanian, Proceedings of
the SMTA International, September 2007.
8. “Process Development for 01005 Lead – Free Passive Assembly: Stencil Printing”, Vatsal Shah, Dr. Rita Mohanty, Joe Belmonte,
Tim Jensen, Ron Lasky and Jeff Bishop, Proceedings of the APEX conference, February 2007.
9. “Determining Area Ratio Rule for Type 4 and Type 5 Solder Paste”, Joe Belmonte, Vatsal Shah, Rita Mohanty, Tim Jensen and
Ron Lasky, Proceedings of the APEX conference, February 2007.
10. “From Printing to Reflow: Process Development for 01005 Assembly”, Sudeep Nambiar, Daryl Santos, Vatsal Shah, Rita Mohanty
and Joe Belmonte, Proceedings of the SMTA PanPacific Microelectronics Symposium, January 2007.
11. “Investigating the Lead Free Manufacturing”, Vatsal Shah, Rita Mohanty and Joe Belmonte, Proceedings of the IMAPS
conference, October 2006.
12. “Process Development of 01005 Lead-Free Passive Assembly: Stencil Printing”, Joe Belmonte, Vatsal Shah, Dr. Rita Mohanty,
Tim Jensen, Ron Lasky and Jeff Bishop; Proceedings of the SMTA International, September 2006.
13. “Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study”, Daryl Santos, Amol Kane and
Vatsal Shah; Proceedings of the SMTA Pan Pacific Microelectronics Symposium, January 2006.
14. “Transition to Pb-Free Alloys in Filter Assemblies”, Vatsal Shah, Amol Kane, Daryl Santos, Mike DiPietro, Lawrence Lehman
and Leonard Krantz; Proceedings of the SMTA PanPacific Microelectronics Symposium, January 2006.
15. “Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder Performs”, Vatsal Shah,
Amol Kane, Ali Shakir, Daryl Santos, Mike DiPietro, Lawrence Lehman and Leonard Krantz; Proceedings of SMTA International,
September 2005.
PRESENTATIONS
• “Process Development for 01005 Lead-Free Passive Assembly: Printing and Inspection”, IMAPS NE Chapter, Boxborough, MA,
May 2007.
• “Process Development for 01005: Printing and Inspection”, Speedline Technologies, Franklin, MA, September 2006.
• “Pb-Free Process Development and Microstructural Analysis of Capacitor Filter Assemblies Using Solder Preforms”, Binghamton
University, Binghamton, NY, December 2005.
• “Pb-Free BGA Solder Ball Attach Assembly Research: A Retrospective of 5 Years of Study”, SMTA PanPacific Microelectronics
Symposium, Pittsburg, PA, January 2006.
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