JOSEPH P. COOK
*******@*****.***
**** ****** ****** **** 804-***-**** Home
Moseley, VA 23120 804-***-**** Mobile
QUALIFICATIONS and SKILLS
• Strong problem solving abilities
• Expertise in chemistry, both theory and practical experience
• Equipment installation, operation and repair
• Documented history of process improvements and cost savings
• Use of statistical analysis for process control
• Strong communication skills, from operator level to the president
• Computer skills including Microsoft Office (Word, Excel, Power Point), MS
Outlook and Lotus Notes
PROFESSIONAL EXPERIENCE
Technical Support Engineer 2008-present
Atotech USA, Rock Hill, SC
• Technical expert for Atotech chemistry at large customer.
• Installed pulse-plate copper plating bath used for electroplating high tech printed
circuit boards in automated line.
Senior Process Engineer 2008
Greystone of VA, Toano, VA
• Responsible for start-up and operation of a hard coat sulfuric acid anodizing line
generating $45K in monthly sales with committed sales of more than $120K per
month.
• Developed a hard chrome plating process for small firearms parts.
• Managed analytical laboratory.
Quality / Process Manager 2006-2008
Southern Graphic Systems, Richmond, VA
• Documented all current operating procedures and develop procedures for new
processes.
• Evaluated and installed new processes and new industry innovations including
acid copper pulse plating for gravure cylinders.
• Performed analysis and implemented SPC controls for the plating system.
• Operated new state of the art automatic high-speed copper and chrome plating
lines and provided technical support for their operation.
2
Technical Account Engineer 1987- 2005
Rohm and Haas, Circuit Board Technology, Marlborough, MA
(Formerly Shipley LLC, Formerly LeaRonal INC)
• Set-up acid copper pulse-plating system, adding filled via capability and
increasing small-hole process capability.
• Introduced new electroless copper process that reduced operating cost by 20%.
3
• Implemented new inner layer dry film that reduced overall cost by more than 10%
and improved yields from 98% to 99.5%.
• Was a trusted technical resource for the customers engineering staff for Rohm and
Haas products used in manufacturing operation as well as competitive products.
Account Manager / Technical Service 2001-2003
Shipley LLC
• Resolved difficult technical problem with regard to metalizing micro-vias that
increased the customer’s process capabilities.
• Created and installed a tracking system used to monitor chemical yield data
resulting in longer bath lives and improved cost.
• Managed three customers in the Mid-Atlantic region, providing each with product
engineering and logistical support.
Senior Technical Service Representitive 2000-2001
Shipley LLC
• Responsible for the operation of six separate chemical processes that involved the
used of more than 30 proprietary chemicals.
• Supported 15 mechanical operations, including equipment updates and repairs.
• Provided technical support for three image operations, including inner layer dry
film resist, outer layer dry film resist and liquid photoimagable solder mask.
Senior Engineer 1987 to 2000
LeaRonal INC, Freeport, NY (purchased by Shipley LLC in 2000)
• Installed and provided technical service for 6 horizontal electrostatic spray coaters
in North America and 2 horizontal electrostatic spray coaters in Europe.
• Created to two major design improvements to the horizontal electrostatic spray
equipment that improved spray efficiency by more than 20%
• Served as a member of a Quality Improvement Team at AT&T responsible for
improvement in final yields from 92% to greater than 99%.
• Onsite technical expert for LeaRonal chemical and imaging processes at the
largest corporate account, AT&T/Lucent Technologies
• Designed, built and operated a pilot facility for the development of processes used
in metal finishing and in the production of printed circuits.
EDUCATION
B.A. in Chemistry, Long Island University, CW Post Center
A.A.S. in Biology, State University of New York, Farmingdale
PATENT:
System for Selective Metallization of Electronic Interconnection Boards
US Patent Number 4,668,532