Engineer Project

DAVID L. CRAIG

** ******* *****, ********, ** ***96

(home) 207-***-**** (cell) 207-***-**** e-mail: ******@*****.**.***

EXCELLENT TECHNICAL AND LEADERSHIP SKILLS INNOVATIVE SOLUTIONS

PROVEN RECORD OF ENGINEERING SUCCESS

Summary of Qualifications

• Over 21 years of process engineering, manufacturing problem solving, and R&D experience in the

semiconductor and forest products industries.

• Passionate about troubleshooting and solving complex technical challenges especially when they

require innovative solutions.

• Strong leadership skills with extensive experience leading engineering project teams and coordinating

new technical programs for large groups of engineers and technicians.

• Always willing to take accountability, to share success, to teach and mentor in my areas of expertise,

and unafraid to ask questions when the expertise resides with somebody else.

• Quick learner of new technologies. Proven ability to shift into new roles and hit the ground running.

• Excellent communication skills as evidenced by my interactions with customers, vendors, colleagues,

auditors, and managers and by the quality of my technical documentation and project presentations.

• Hard working team player. Self directed, detail oriented, data driven, thorough, and efficient.

Work Experience

National Semiconductor, South Portland, Maine 1996-2009

STAFF PROCESS ENGINEER

• Semiconductor fab hands-on experience creating and using these quality systems elements: FMEA,

SPC, 8D, Process Cp/CPks, yield improvement, control plan change procedures, cost of quality.

• Defined customer needs for fab’s online SPC system. Assisted programmers with GUI, performed

beta testing, led the rollout and implementation phases of the project, trained end-users (managers,

engineers, and technicians), and provided ongoing support and improvements.

• Specified, installed, started-up, and integrated into production, National Semiconductor’s first

0.13 micron capable wet etch/clean deck. Successfully transferred all front-end cleans for all

advanced technologies from the legacy tools onto these new process tools, improving 0.18 micron

SRAM yield by 9%.

• Re-engineered CMP process equipment improving availability from 60% to 85% and reducing

equipment technician support required from 3/shift to less than 1/shift. Innovations included a

patented solution that saved ~ $100,000/yr of consumable cost and cut maintenance parts costs

by more than 30%. The resulting improvements sustained even as the installed tool base doubled.

• Led or was a prime contributing team member on several engineering project teams. Utilized

6-sigma and/or TPM methodologies that:

Increased sellable product volume (die/wafer) by 4% by changing layout methodology, reducing

number of photo alignment marks, and modifying metal deposition masking rings.

Increased hourly throughput of older sulfuric strip deck from 100 UPH to 160 UPH by optimizing

process flow and enhancing deck automation.

• Devised and conducted training program for all equipment engineers and equipment technicians

during implementation of a new interactive maintenance logistics system. Training documentation

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included context sensitive help screens, class materials, and post-training follow up newsletters to

encourage trainees to use the system by sharing examples of successful fab applications.

• Prepared the process engineering and preventive maintenance areas for successful transition from

ISO9001:2000 to TRS16949 certification.

Sappi Fine Papers Technology Center, Westbrook, Maine 1987-1996

SENIOR PROJECT ENGINEER

• Led R&D project team that developed Sappi’s first ink-jet printer paper, marketed under the label of

one of the most recognizable names in document copy/print technology. Utilized QFD methodology

to match Sappi’s technology and production capability to the unique demands of ink-jet substrates.

• Developed specialized diagnostic methods, instrumentation, and metrology for Sappi’s three paper

mills. Independently applied technologies such as vibration analysis, ultrasonic non-destructive

testing, laser velocimetry, acoustic emission, beta radiography, image analysis, and thermal imaging

to solve the most challenging manufacturing problems, including:

Optimized flocculation dynamics of a high speed paper machine by modeling the machine

vibration modal interaction with the dilute pulp fluid controls.

Validated the surface properties and the thermal and mechanical integrity of very expensive, multi-

ton, high velocity, cast iron machine rollers upon delivery from OEM and after manufacturing

incidents that potentially rendered the rollers unsafe or unsuitable for use.

Education

MS Physics, University of Maine, Orono, ME 1987

BS Engineering Physics, University of Maine, Orono, ME 1985

Additional education/training:

• Working toward Project Management Professional (PMP) certification at UNE, certificate expected

in Spring 2010

• Total Productivity Manufacturing training provided by the Japanese Institute of Plant Maintenance

(JIPM), 2008

• Two graduate level courses in semiconductor manufacturing and device physics,

University of Maine System, 2004/2005

Other:

• Recently wrote Energy Efficiency and Conservation Block Grant applications for efficiency

upgrades at a wastewater treatment facility and for the refurbishment of a hydroelectric facility and

for weatherization of the Sparhawk Mill. Both projects are in Yarmouth, Maine.

• Volunteered with Habitat for Humanity to help them achieve LEED certification on two homes in

Portland, Maine.

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