PAUL C VAN NOTE
Room ***
Shanghai, China 20031
Home: (86-138********
Email: ****.***.****@*****.***
PROFILE
Extensive experience in PRODUCT DEVELOPMENT and PROJECT MANAGEMENT.
Proficient at taking projects from concept to production using numerous
Product Life Cycle Management (PLC) skills. Accomplishments include:
. Led cross-functional teams defining new products, setting project
goals, schedules, and resource requirements with the goal of
accelerated delivery of platforms to customers.
. Development of system technical collateral, processes, and tools for
customer system development, enable customer designs, and drive form
factor changes into product offerings.
. Provided direct system level support to key OEM/ODM during system
development to remove technical roadblocks and enable a trouble free
product launch and ramp into High Volume Manufacturing (HVM).
EXPERIENCE
MTI Micro Fuel Cells, Shanghai PRC, July 2009 to Present
Sr. Program Manager at MTI Micro Fuel Cells leading the Shanghai office to
bring-to-market Mobion off-the grid portable power solutions; a
proprietary direct methanol micro fuel cell power system. My team bridges
the strategies and communications between our R&D and OEM/ODM's to ensure
our designs are the optimum solutions and then drive and facilitate the
convergence of product development, manufacturing, and product planning to
meet program goals.
INTEL CORPORATION APAC R&D, Shanghai PRC, February 2005 to July 2009
Sr. Program Manager at Intel China leading the development and execution of
Form Factor Notebook Systems for customer initiatives validation. The
notebook systems enable chassis specific test
(Wireless/Thermal/Technologies) and validation of roadmap mobile Silicon
platforms.
Sr. Engineer at Intel China bringing to production concept notebook designs
for emerging markets. Leading the Shanghai notebook design team from
concept mock-up to production ramp. Responsibilities have included: stack
up and thermal analysis, main board layout placement studies, industrial
design management, materials selection, ODM management, system level
testing, and analyzing customer change requests.
Sr. Engineer at Intel China leading a team for the architecture and thermal
spec generation of the Hitachi Prius project. Managed the interface to the
customer and Intel field team through weekly meetings and by documenting
and presenting thermal/mechanical concepts. Negotiated with and influenced
the customer to define the Form Factor of the system to meet
thermal/acoustic targets. Successfully met the customer requirements for
supporting mainstream Smithfield with low acoustics in a thin (<60mm thick)
form factor design. Led Intel team remotely through proof of concept mock-
up testing and report out to the customer. Primary interface to the
customer and ODM for the project consulting. Author of technical content of
the SOW.
INTEL CORPORATION, Hillsboro Oregon USA, June 1996 to February 2005
Sr. System Technical Marketing Engineer for Intel's Desktop Product Group
driving account and internal stakeholders to new form factor adoption.
Regularly interface with senior engineers/managers to describe complex form
factor interactions, impacts, and tradeoffs. Provide creative solutions to
complex problems. Technical voice of the customer providing direct regular
support to key OEM/ODM for system level development.
Sr. Project Manager leading a Desktop Systems Development team which
develops Technology Vehicles and Reference Platforms. Provide
thermal/mechanical technical guidance to internal and external development
teams. Manage the activity of ODM co-developers. Provide program
management functions for project execution. Function as the primary
contact for Intel on assigned projects. Interact with senior internal and
external personnel on project issues across organizational lines.
Technical Engineering lead for the Intel startup Television Platform
Operation (TPO) in the development of a reference chassis for Set Top
Boxes. Drove the system architecture to meet thermal and acoustic
targets. Managed the interface and design direction to the APAC ODM to
provide the reference chassis. Developed test plans and schedules.
Negotiated with TPO management on product features and requirements through
this extremely vague and shifting program development. Represented TPO as
the prime contact with external customers and suppliers.
Sr. Lead Mechanical Engineer and Chassis Program Manager for Intel's
InfiniBand Chassis. Managed the mechanical project tooling and capital
costs. Maintained the program schedule and associated documentation.
Directed team to develop a chassis which meets Intel standards for thermal,
EMI, and manufacturing. Performed engineering design duties using
ProEngineer as required to support project schedules.
Sr. Lead Mechanical Engineer for Intel Connected Products Division.
Managed the mechanical development of Intel's PC Peripheral products from
concept to manufacturing. Teamed with Marketing Managers to define
product features and requirements. Managed part and tooling design
reviews. Directed Far East design and manufacturing suppliers to deliver
high quality low cost products to meet Intel branded standards.
Sr. Lead Mechanical Engineer for Intel OEM Products and Services Division.
Led teams to develop PC chassis designs to enable new form factor
motherboard platforms. Represented Intel for industry wide initiatives on
concepts involving new PC platforms. Teamed with OEMs to develop new PC
platform connectors, new PC platforms, and new concepts for thermal and EMI
requirements supporting new PC platforms.
INTERNATIONAL BUSINESS MACHINES, Austin Texas USA, May 1979 to May 1996
Worked on a variety of IBM products from mainframes to printers to RS6000
workstations. Involved in all aspects of the product development.
Experienced with plastic, sheet metal, and casting design. All products
designed to meet IBM environmental and manufacturability criteria.
Experienced as a Technical Marketing Engineer supporting IBM Printer
Products. Investigated, designed, and presented to customer's requests for
custom printer features.
EDUCATION
Bachelor of Science, Mechanical Engineering, Binghamton University
Associate of Applied Science, Mechanical Technology, State University of
New York at Canton
SKILLS
ProE, Catia, Cadam, Flotherm CAD tools. MS Office and Project. People,
Program, and Supplier Management.
OTHER
Six United States Patents.