Engineer Mechanical

PAUL C VAN NOTE

Room ***

** ******* ****

Shanghai, China 20031

Home: (86-138********

Email: ****.***.****@*****.***

PROFILE

Extensive experience in PRODUCT DEVELOPMENT and PROJECT MANAGEMENT.

Proficient at taking projects from concept to production using numerous

Product Life Cycle Management (PLC) skills. Accomplishments include:

. Led cross-functional teams defining new products, setting project

goals, schedules, and resource requirements with the goal of

accelerated delivery of platforms to customers.

. Development of system technical collateral, processes, and tools for

customer system development, enable customer designs, and drive form

factor changes into product offerings.

. Provided direct system level support to key OEM/ODM during system

development to remove technical roadblocks and enable a trouble free

product launch and ramp into High Volume Manufacturing (HVM).

EXPERIENCE

MTI Micro Fuel Cells, Shanghai PRC, July 2009 to Present

Sr. Program Manager at MTI Micro Fuel Cells leading the Shanghai office to

bring-to-market Mobion off-the grid portable power solutions; a

proprietary direct methanol micro fuel cell power system. My team bridges

the strategies and communications between our R&D and OEM/ODM's to ensure

our designs are the optimum solutions and then drive and facilitate the

convergence of product development, manufacturing, and product planning to

meet program goals.

INTEL CORPORATION APAC R&D, Shanghai PRC, February 2005 to July 2009

Sr. Program Manager at Intel China leading the development and execution of

Form Factor Notebook Systems for customer initiatives validation. The

notebook systems enable chassis specific test

(Wireless/Thermal/Technologies) and validation of roadmap mobile Silicon

platforms.

Sr. Engineer at Intel China bringing to production concept notebook designs

for emerging markets. Leading the Shanghai notebook design team from

concept mock-up to production ramp. Responsibilities have included: stack

up and thermal analysis, main board layout placement studies, industrial

design management, materials selection, ODM management, system level

testing, and analyzing customer change requests.

Sr. Engineer at Intel China leading a team for the architecture and thermal

spec generation of the Hitachi Prius project. Managed the interface to the

customer and Intel field team through weekly meetings and by documenting

and presenting thermal/mechanical concepts. Negotiated with and influenced

the customer to define the Form Factor of the system to meet

thermal/acoustic targets. Successfully met the customer requirements for

supporting mainstream Smithfield with low acoustics in a thin (<60mm thick)

form factor design. Led Intel team remotely through proof of concept mock-

up testing and report out to the customer. Primary interface to the

customer and ODM for the project consulting. Author of technical content of

the SOW.

INTEL CORPORATION, Hillsboro Oregon USA, June 1996 to February 2005

Sr. System Technical Marketing Engineer for Intel's Desktop Product Group

driving account and internal stakeholders to new form factor adoption.

Regularly interface with senior engineers/managers to describe complex form

factor interactions, impacts, and tradeoffs. Provide creative solutions to

complex problems. Technical voice of the customer providing direct regular

support to key OEM/ODM for system level development.

Sr. Project Manager leading a Desktop Systems Development team which

develops Technology Vehicles and Reference Platforms. Provide

thermal/mechanical technical guidance to internal and external development

teams. Manage the activity of ODM co-developers. Provide program

management functions for project execution. Function as the primary

contact for Intel on assigned projects. Interact with senior internal and

external personnel on project issues across organizational lines.

Technical Engineering lead for the Intel startup Television Platform

Operation (TPO) in the development of a reference chassis for Set Top

Boxes. Drove the system architecture to meet thermal and acoustic

targets. Managed the interface and design direction to the APAC ODM to

provide the reference chassis. Developed test plans and schedules.

Negotiated with TPO management on product features and requirements through

this extremely vague and shifting program development. Represented TPO as

the prime contact with external customers and suppliers.

Sr. Lead Mechanical Engineer and Chassis Program Manager for Intel's

InfiniBand Chassis. Managed the mechanical project tooling and capital

costs. Maintained the program schedule and associated documentation.

Directed team to develop a chassis which meets Intel standards for thermal,

EMI, and manufacturing. Performed engineering design duties using

ProEngineer as required to support project schedules.

Sr. Lead Mechanical Engineer for Intel Connected Products Division.

Managed the mechanical development of Intel's PC Peripheral products from

concept to manufacturing. Teamed with Marketing Managers to define

product features and requirements. Managed part and tooling design

reviews. Directed Far East design and manufacturing suppliers to deliver

high quality low cost products to meet Intel branded standards.

Sr. Lead Mechanical Engineer for Intel OEM Products and Services Division.

Led teams to develop PC chassis designs to enable new form factor

motherboard platforms. Represented Intel for industry wide initiatives on

concepts involving new PC platforms. Teamed with OEMs to develop new PC

platform connectors, new PC platforms, and new concepts for thermal and EMI

requirements supporting new PC platforms.

INTERNATIONAL BUSINESS MACHINES, Austin Texas USA, May 1979 to May 1996

Worked on a variety of IBM products from mainframes to printers to RS6000

workstations. Involved in all aspects of the product development.

Experienced with plastic, sheet metal, and casting design. All products

designed to meet IBM environmental and manufacturability criteria.

Experienced as a Technical Marketing Engineer supporting IBM Printer

Products. Investigated, designed, and presented to customer's requests for

custom printer features.

EDUCATION

Bachelor of Science, Mechanical Engineering, Binghamton University

Associate of Applied Science, Mechanical Technology, State University of

New York at Canton

SKILLS

ProE, Catia, Cadam, Flotherm CAD tools. MS Office and Project. People,

Program, and Supplier Management.

OTHER

Six United States Patents.

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