Engineer Process
Resume:
Mr. Nohmar Acosta
Jupiter Terrace, 18 Jupiter St
North Point, HongKong
Telephone No. +852-****-****
E-mail: *************@*****.***
OBJECTIVE: To seek employment as Manufacturing Engineer, and
thereby put to good use my 20 years work experience
in the field of IC packaging assembly.
WORK EXPERIENCES:
Jan 2008 - Mar 2010 Program Manager
StatsChippac - Shanghai (China)
Responsibilities:
- Responsible for driving customer Flip Chip package
development programs - AMD customer.
- Manages the Device package project from Initial Concept to
Qualification stage, to NPI
(New Product Introduction),
and to Full Production mode.
- Implements directives from management.
- Updates project reports (technology status and milestones)
for Management reviews.
- Coordinates with various internal cross-functional teams for
resources, timing, and
strategies for execution of
activities to meet project timelines.
- Direct interface with customer to align roadmaps with respect
to SCC resources.
- Generates, plans, and updates Development Project schedule
based on customer timetable.
- Presides the weekly conference calls with the customer for the
week's highlights,
issues, assembly yields, new
packages for qual, etc.
- Updates Customer Baseline specs, APQP, etc
- Plans and recommends for machine capacity based on ramp-up volume
forecast.
Accomplishments:
- Qualified 6 major devices family now all on-going full
production mode.
- Meet customer Assembly Yield target of 99.95% and 2.0 day Cycle
Time.
- Based on customer QBR, SCC remains in Top 2 spot among 4 major
subcons.
Jun 2006 - Dec 2007 Flip Chip - Process Engineering - Section Manager
ASAT, Inc (China)
Dec 2003 - Jul 2006 Senior Process Engineer
ASAT, Inc. (HongKong)
Responsibilities:
- Responsible for the start-up and initial production run of Flip
Chip package.
- Generates appropriate and process specifications.
- Updates and simplifies work instruction procedures and process
flows.
- Develops new programs geared to improve yield and productivity.
- Qualifies new customers for the Flip Chip package.
Accomplishments:
- Successful start-up of China plant for Flip Chip package
within 8 months.
May 2003- Dec 2003 Senior Process Engineer
Advanced Interconnect
Technologies (Batam, Indonesia)
Responsibilities:
- Set-up/Start up of BGA (Ball Grid Array) Production line
in Batam, Indonesia.
- Same responsibilities performed in Hong Kong Office.
Oct 1996 - Apr 2003 Senior Process Engineer
Advanced Interconnect Technologies (HongKong)
Responsibilities:
- Sustains Front-of Line process operations (Backgrind,
Saw, 2/Opt Inspection, and Die Attach) for different
packages such as QFP, TQFP, MQUAD, FBGA, PBGA, EPBGA,
TBGA, and Flip Chip.
- Responsible for improving product's quality,
yield, cost, and productivity.
- Generates, reviews and initiates revision of process
specifications/procedures so as to improve and simplify the
process flow.
- Provides engineering support to manufacturing on production
line thru the disposition of materials, products, processes
and equipment.
- Audits and monitors process controls and other
records/documents to identify potential improvements.
Accomplishments:
- Reduced Saw dpm from 300 to 50 for the period Q198 and
onward.
- Improved Die Attach yield from 99.80 to 99.99% for the
period Q197 and onward.
- Introduced and qualified Fast-Cure epoxy pastes which
slashed down the Die
Attach Cure cycle time from 1 hour to only 15 minutes.
Feb 1995 - Oct 1996 Die Attach Process Engineer
ASAT, Ltd. (Hong Kong)
Responsibilities:
- Sustains Die Attach Process.
- Develops, formulates and evaluates process
procedures/flows, materials and equipment to upgrade yield,
quality, cost and productivity.
- Reviews and qualifies new materials to further enhance
product reliability.
Accomplishments:
-Improved Die Attach yield from 99.60% to 99.95% for the
period Q495 to Q396.
-Totally eradicated Die Crack dpm thru the introduction of
rounded ejector pins.
-Reduced Epoxy on Die and Epoxy on Lead dpm from >800 to only
50.
Dec 1993 - Feb 1995 Product Development Engineer
Amkor/Anam Philippines, Inc.
Responsibilities:
- Reviews, develops, and qualifies the Full In-Line Snap-Cure
System Program, wherein the Die Attach Cure cycle time down
to from one hour to only one minute.
- Evaluates numerous technical experiments to optimize Snap-
Cure machine parameters.
- Provides support to qualification of new devices/packages
undergoing the Snap-Cure process.
- Generates comprehensive engineering reports and specs
revisions.
Accomplishments:
- Introduced the Snap-Cure process system from developmental
stage to full production mode.
- Improved assembly yield at the Die Attach from 99.20% to
99.99%.
Jun 1991 - Nov 1993 Product Engineer
Amkor/Anam, Philippines, Inc
Responsibilities:
- Provides technical support to production, maintenance
and Q.C. by recommending process flow/specs, materials and
toolings to build qualification lots for new
packages/devices.
- Reviews requirements of new devices, Customer Quals and new
packages based on customer documents.
- Coordinates with other departments to ensure smooth
processing of Customer Qual lots.
- Generates comprehensive Qual Report after the lot is
shipped.
Accomplishments:
- Achieved an Assembly Yield of 99.75% on Qual lots from Q492
to Q493.
- Successfully qualified "tough" Japanese customers like NEC,
FUJI, SEIKO, TOKO, etc. to production mode.
Jun 1990 - May 1991 Production Supervisor
Amkor/Anam Philippines, Inc.
Responsibilities:
- Supervises the production of Integrated Circuits (PDIP,
SOIC, SSOP) at Chemical Deflash, Top/Bottom Mark and DTFS.
- Generates production reports.
- Implements company goals thru high and quality yield.
Accomplishments:
- Increased Shift quantity output at DTFS by 35%.
- Totally eliminated misprocessing at Chemical Deflash and
Top/Bottom Mark.
- Initiated a successful program project "How to Make Bent
Leads Obsolete in 1991".
Mar 1988 - Apr 1990 Production Engineer
Mitsumi Philippines, Inc.
Responsibilities:
- Supervises production of electronic coils (type M, K, and
S).
- Generates and implement programs to improve and sustain
output yield.
Feb 1984 - Feb 1985 Product Design Engineer
Padiscor Inc., Philippines
Responsibilities:
- Designs and supervises the installation of 3 modern turn-
key Agro-Industrial Projects (Grain Drying and Bulk Storage
Processing Plants) for the cleaning, drying and storing of
agricultural seeds/grains.
EDUCATIONAL ATTAINMENT:
1984 Graduated - Bachelor of Science in Mechanical Engineering
Araneta University, Philippines
1982 Graduated - Bachelor of Science in Agricultural Engineering
Araneta University, Philippines
PERSONAL:
Civil Status : Married
Nationality : Filipino
H.K. I.D. # : P465523(4) - Permanent Hong Kong Resident
Home Tel. No. + 8852 - 2664-8113 (HongKong Home)
Mobile No. +86 - 1-376-***-**** (Shanghai, China)
Email Address *************@*****.*** (Optional)
REFERENCES: Available upon request.
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