Engineer Project Manager
Resume:
David W. Kompara
Fort Wayne, Indiana 46835
*********@*******.***
Multi-Disciplined Engineer
Design/ Manufacturing/ Process/ Project/ Quality/ Teambuilding
"Proactively responsive to Internal and External Customer needs"
Career Summary:
Solutions-driven manufacturing professional with over 15 years of qualified
experience in the disciplines of engineering, production management, and
team facilitating. Proven understanding of design for manufacturability
while incorporating cost sensitive material sets without negating quality.
Improved process optimization using pull systems and lean manufacturing to
reduce line cycle times. Multi-tasked facility changes while introducing
new processes and technologies to the production floor without scope creep.
Extensive experience in Total Quality Management including training,
developing, and leading teams. Strong communication and interpersonal
skills with the proven ability to interact effectively with people at all
levels of an organization, its suppliers, and its customers.
Major Accomplishments:
. Leader of a Quality Circle team that defined and solved manufacturing
problems. This team was chosen out of twenty (20) teams to receive
accompany wide award for improving quality in its respective
manufacturing departments.
. Coordinated four (4) cross-functional teams defining value added and non-
value added process steps in manufacturing reducing cycle time from
thirty to eighteen percent.
. Attained management positions in Hybrid Microelectronic Assembly, Test,
and Inspection departments.
. Experienced in the fabrication and design of thickfilm circuitry using
cermet, polymer, and U.V. ink chemistries. Developed two polymer
thickfilm conductive compositions that reduced raw material costs by four
hundred percent and have been in use throughout the world for more than
fifteen years.
. Joint ownership of a U.S. patent, another pending.
. Responsible for the interior construction of an electronic manufacturing
facility, layout of its lines, purchasing of its equipment, training
associates, and qualification of its processes.
. Resolved an Automotive quality problem that increase yield from low
seventy percent ranges to high ninety percent ranges.
. Lead person for an ISO 9001-2008 Certification. Company did not receive
any nonconformances when audited.
Work Experience:
Caliente, L.L.C. (downsized 2009)
A provider of heating and cooling solutions to the telecom, appliance,
medical, and military markets.
(08/08 - 11/09) Process and Quality Engineer
Responsibilities:
. Created all process documentation for thickfilm and wire harness
assembly manufacturing.
. Incorporated a Preventive Maintenance Plan for plant machinery,
factory wide.
. Responsible Quality Engineer for an ISO 9001-2008 certification.
Qualified without any nonconformances.
. Developed a sensors' material set for military and civilian use.
. Improved wire harnessing integrity at crimp connections for medical
and telecommunication customers.
Driver Solutions Worldwide, Inc. (ceased operations 2009)
An ISO/ TS16949 manufacturer of Pedal Systems for the domestic and foreign
Auto Industry.
(01/06 - 08/08) Manufacturing/ Sensor Engineer
Responsibilities:
. Implemented and improved the testing, printing, curing, firing, and laser
tuning processes for thickfilm E.T.C. (electronic throttle control)
sensor elements. Inclusive to this was the designing of fixturing and
gages, and knowledge of all process equipment to assist or do repair or
modifications.
. Increased production yields thirty percent on a palletized line that
assembled an Electronic Throttle Control for Pedal Systems. Major
processes on this line included laser trimming, inspection points, heat
staking, ultrasonic welding, solder paste dispensing, reflow solder,
contact assembly, and end of line testing. This responsibility has
greatly increased my electro-mechanical experience.
. Performed hands on sensor fabrication, assembly, and testing of all new
designs.
. Led and maintained P.F.M.E.A.'s, Control Plans, and Work Instructions.
. Worked with Customer and Supplier to bring solutions to manufacturing
problems.
. Dotted line in this organization as the Quality Engineer for thickfilm
printing and E.T.C. assembly using control charts, gaging, inspection,
and sampling to monitor key process steps.
. Supported other engineers with mechanical and welding projects common the
pedal assembly process.
Dekko Technologies, Inc., North Webster, IN
A manufacturer of custom heating elements and assemblies including
thickfilm, alloy wire, coil, and in-molded products for medium to high
volume markets.
(05/94 - 01/06) Project Manager, Design Engineer, Process Engineer
Interfaced well with new customers at the design level as with established
customers from the appliance, automotive, consumer electronics, medical,
and business machines industries.
Responsibilities:
. Experienced with project management techniques by managing projects such
as new product launches, product line relocation, and facility set-up.
. Design and processing of thickfilm circuitry using different types of
thickfilm technologies. Integrating custom wire harnessing and molded
assemblies for the use in heating applications. Ensuring the highest
quality but least costly material sets designed for manufacturability.
. Confident and experience in prototype testing, developing process flow
charts, forms, illustrated process work instructions, calculating labor
and material costs, time studies, negotiating material costs with
suppliers, pre-production runs, S.O.P., and ongoing to process
improvements throughout the product life.
. Selection, purchase, and qualification of manufacturing equipment.
. Qualifying new products by leading or participating in Design and Process
F.M.E.A.'s, Control Plans, and other required project launch disciplines.
Thompson Consumer Electronics Company, Marion, IN (ceased operations 1995)
A manufacturer of color picture tubes for national and international
companies.
(12/93 - 05/94) Test Foreman
Responsible for the high volume just-in-time production (800/ shift) and
quality of 31 inch and 35 inch diagonal screen television picture tubes at
a world class facility. Responsible for forty-five operators within a
union environment including line changeovers, convergence alignment, final
electrical testing, antiglare application on glass, and shipping.
Summit Circuits, Fort Wayne, IN (part time)
A manufacturer of printed circuit boards.
(07/93 - 12/93) Market Development
Marketed a printed circuit board scoring service. Created brochures,
contacted businesses, and set pricing. Service was operating in the black
when this assignment ended.
Magnavox Company, Fort Wayne, IN
A manufacture of sophisticated electronic equipment for government defense
and industrial uses.
(05/89 - 06/93) Process Engineer and J.I.T. Facilitator
Responsibilities:
Supported thickfilm fabrication and hybrid assembly areas. Facilitated
and led JIT/QC teams.
. Purchasing experience of precious metal inks, alumina substrates, and
components. Managed these material inventories for hybrid circuit
printing. Created test procedures for incoming inks, alumina substrate,
packaging, and microelectronic components.
. Supported a laser trimming system by writing programs, probe card design,
and troubleshooting for thin/ thickfilm resistor, high power, active,
passive, and capacitor networks.
. Redesigned hybrid circuitry resulting in sixteen percent higher yields in
printing operations.
. Improved production rates of diebonder and wirebonder processes by
evaluating epoxy geometry, gold and aluminum wire types, capillaries, and
wedge tools increasing production eleven percent.
. Supported all inspection plus improved ergonomics (operator fatigue) at
the microscope.
Purchased new equipment, designed process tooling, conducted prototype
and qualification runs for new products.
. Very involved in printing development by increasing array size of
thickfilm printed circuits. Labor savings of thirty-seven percent was
obtained.
. Responsible for setting up and reporting particulate testing, employing
military specification requirements for cleanroom manufacturing in the
printing, assembly, and test departments. Reduced voids in wet thickfilm
runs by twenty-two percent by introducing cleanroom disciplines.
Facilitated teams defining value added and non-value added tasks that
fostered continuous process improvements.
. Designed fixtures as needed for prototyping and production. Maintained
equipment as necessary.
. Processed S.M.T. and hand solder processing for hybrid circuit modules.
(04/79 - 05/89) Technical Foreman and Quality Circle Leader
. Supervised the printing, firing, and assembly of thickfilm circuits with
up to seven (7) resistive blends, four (4) conductive layers, and nine
(9) dielectric layers. Managed full time production of ten different
products within the microelectronics assembly departments with processes
including diebonding, wirebonding, hermetic package seal, component burn-
in, final testing and inspection.
. Maintained accurate inventory of government and company property.
. Facilitated a Quality Circle team in the selection, analysis, and
solution of more than twenty-five problems concerning process cost
reductions, chemical safety, ergonomics, and personal development.
. Managed up to thirty-five personnel in a union environment.
. Interfaced with D.C.A.S. (on site customer) on a daily basis.
(06/77 - 04/79) Thickfilm Technician
Responsibilities included printing thickfilm prototypes and qualification
testing of conductive, resistive, and dielectric printing compositions.
Also, qualified process equipment, printed hybrid prototypes, created work
instructions for technicians.
(06/75 - 06/77) Precision Photo Lab Technician
Responsible for the exposure, development, and inspection of film artwork
used in the manufacturer of printed circuits, microelectronic thickfilm
circuitry, and Large Scale Integrated circuitry (L.S.I.). Insured that the
process equipment was maintained.
(04/73 - 06/75) Printed Circuit Board Supervisor and Technician
Supported the manufacture of single, double, and multilayer printed circuit
boards up to sixteen layers. Responsible for expose and develop, layer
lamination, etching, drilling, plating, and routing processes. Interfaced
with D.C.A.S. (on-site customer) on a daily basis.
Education:
Associates in Electrical and Electronics Technology from I.T.T. Technical
Institute, Fort Wayne, IN. (1972)
Certificate in Supervision from Indiana Univ./ Purdue Univ., Fort Wayne,
IN. (1980)
Certificate in Quality for the Workplace from Ivy Technical College, Fort
Wayne, IN. (1982)
Ergonomics training, Magnavox, Fort Wayne, IN. (1988)
Certificate in Chicago Laser Systems and Operation, C.L.S., Inc., Chicago,
IL. (1990)
Certificate in Design of Experiments from T.Q.M., Fort Wayne, IN. (1996)
Certificate in Project Management Series from Wisconsin University Madison,
Madison, WI. (1997)
S.P.C. training from Dekko Heating Technologies- North Webster, IN. (1997)
AutoCAD LT 2004 Fundamentals from Ivy Tech State College- Fort Wayne, IN.
(2005)
Internal Auditor Training- Mishawaka, IN. (2009)
Six-Sigma Black Belt Certification- pursuing
Computer Experience:
Word, Excel, Minitab, Flow Charting, etc.
Special Equipment:
Welders, Orbital spin weld, Bushing insert, Automated lines, Work cells,
Conveyorized Reflow Solder Ovens, Laser Trimming Systems, Thickness
Measuring Systems, Thickfilm Printers, High Temperature Furnaces, IR
Dryers, Temperature Profiling Instruments, Expose and Develop Equipment,
Screenmaking Equipment, Diebonders, Die Removers, Automatic Test Equipment,
Hermetic Sealers, Vacuum Leak Detection Systems and Centrifuges, Slit and
Sheet Machines, Ink Compounding Equipment, Wire Termination Equipment,
Solder Dispense Equipment, Ultrasonic Welders, Heat Staking, Palletized
lines, Depanelizer, Dispensing equipment used for solder paste, U.V.
adhesives, and silicone encapsulants.
Closing:
I believe that success in an organization depends upon the integration of
ideas that individuals contribute to its whole. Engineering should be a
partner with Marketing designing those products that the marketplace will
need now and in the future. Manufacturing and Engineering jointly needs to
declare process ownership. All employees should know their internal and
external customers and suppliers. Implementation of these ideals will
allow the leadership to successfully engage its vision. That vision will
be the organization's success. Exampling this is what motivates me to
succeed in my profession.
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