Jakisa Radja
**** ***** ****** ****: 972-***-****
Irving, Texas 75063 abmrfk@r.postjobfree.com Cell: 972-***-****
Summary
TECHNICAL MANAGER WITH PROCESS ENGINEERING AND QA EXPERIENCE IN
MULTICULTURAL ENVIRONMENT IN USA, SINGAPORE AND EUROPE. STRONG FOCUS ON
QUALITY, COST, YIELD AND PROCESS MANUFACTURABILITY. HANDS ON LEADER AND
MANAGER WITH ABILITY TO BUILD AND MOTIVATE THE TEAM THROUGH EXAMPLE, TRUST
WITH ACCOUNTABILITY, COACHING AND POSITIVE RE-ENFORCEMENT TO ACHIEVE
RESULTS. STRONG INTERNAL AND EXTERNAL CUSTOMER ORIENTATION, THRIVING IN
FAST-PACED, CHANGING ENVIRONMENTS. SIX SIGMA GREEN BELT.
Key Skills
TECHNICAL MANAGEMENT SEMICONDUCTOR PROCESS MANAGEMENT
SEMICONDUCTOR R&D PROJECT MANAGEMENT
RISK ASSESSMENT CHANGE/RISK MANAGEMENT
PROBLEM SOLVING SIX SIGMA GREEN BELT
PROCESS CONTROL CUSTOMER MANAGEMENT
QMS TOOLS SELECTION AND PROCUREMENT
EXPERIENCE
STMICROELECTRONICS, CARROLLTON, TEXAS AND AMK SINGAPORE 1991- JUNE, 2009
WORLD'S 6TH LARGEST SEMICONDUCTOR MANUFACTURER; $10 BILLION REVENUES.
Process Engineering Manager BEOL-STM, Carrollton (2006-June 2009)
. Lead and develop 14 process engineers and 8 technicians, support
manufacturing, coordinate cross group activities. Manage yield
improvement, cost reduction, throughput improvement and MEMS development
and production. Reporting directly to Process Engineering Director.
. Reduced defectivity 50% by improving process, PM, updating procedures,
leading projects that used FMEA, DOE and other problem solving tools.
. Improved cycle time 20% on CVD process by optimizing process flow using
DOE.
. Reduced machine downtime 5% by introducing automated PM and intervention
qualification BQS.
. Improved Electrical Yield 0.5% by optimization thick Metal deposition
process .
Process Engineering Manager PHOTO-STM, Carrollton (2000-2006)
. Led group of 12 engineers and 8 technicians in supporting manufacturing,
yield improvement, cost reduction and throughput improvement. Reporting
directly to Process Engineering Director.
. Led conversion from C-MOS to BiCMOS manufacturing and successfully
started new technologies and products.
. Changed alignment schemes for several technologies to reduce reject rate
from ~0.5% to ~0.1%.
. Improved throughput 10% and EWS Yield 2% by optimizing wafer layout.
. Achieved cost reduction of $2.4 per wafer by reduction of Photo resist
and developer usage.
Staff Process Engineer PHOTO-STM, Carrollton (1997-2000)
. Build a strong team of 5 engineers and 11 technicians as a hands on
leader.
. Specified new mask aligners: created purchase specification, acceptance
procedures layout of Photo bay and process development. On these tools
80% Photo processing has been done on site after install.
Jakisa Radja
PAGE TWO
STMicroelectronics (Continued)
. SUCCESSFULLY ACCOMPLISHED ASML-CANON MATCHING TO ASSURE SMOOTH TRANSFER
OF TECHNOLOGIES DONE ON CANNON STEPPERS IN OTHER STM SITES. THESE
PRODUCTS COVER 80% OF CURRENT PRODUCTION.
. Directed mix and match among aligners with different field sizes to be
able to utilize older tools for less critical photo steps what increased
effective capacity by 20%.
Process Engineering Manager PHOTO-STM, Singapore (1994-1997)
. Managed Photo process engineering group of 26 engineers in two Fabs.
. Transferred entire Photo module from one FAB to another.
. Improved Photo related WFY losses by 5% by introducing new PM scheme.
. Increased Photo alignment tool throughput 7% by establishing new Photo
mask management.
. Required implementation of problem solving methods like FMEA, DOE, etc.
across Photo module.
Senior Process Engineer PHOTO-STM, Singapore (1993-1994)
. Coached and developed 11 engineers, manufacturing support, cost reduction
and yield improvement.
. Introduced new products and technologies .
. Improved Photo related WFY losses for 5% by optimizing process,
procedures and layout.
. Created tool and process FMEA among the first in ST.
Senior QA Engineer STM, Singapore (1991-1993)
. Supervised 4 QA engineers and 11 technicians. Established In-line
Control, Process Changes System, Metrology Tools Calibrations and
Analysis.
. Resolved several internal customer issues to prevent significant scrap of
3 K wafers.
. Led Introduction of ESD protection system into Fab what improved EWS
yield by 4%.
. Managed project which resulted in reduction of wafer breakage from 3% to
less than 1% yield impact.
RIZ -Zagreb Semiconductors, Croatia 1981-1991
BIPOLAR WAFER FAB AND ASSEMBLY WITH METAL, PLASTIC AND CERAMIC
ENCAPSULATION.
. As a QA Manager successfully led project to qualify line of military
components for Rockwell Collins. At that time RIZ and Motorola were the
only qualified suppliers.
. As a Wafer Test Module Manager led projects to improve yield by ~12%.
Reduced dice sawing process yield loss by optimizing blade cooling, blade
shape and size usage for different wafer types and establishing tester PM
system.
. As a process engineer played vital role in introduction of Ion
Implantation into the Fab. Specified tool, established acceptance and
qualification procedures and led process setup.
Education and Professional Development
MS IN PHYSICS (SOLID STATE PHYSICS), UNIVERSITY OF ZAGREB, CROATIA
DOE, Global 8D, SPC, DMAIC, 6 Sigma, Project Management, Minitab
statistical analysis software
Certifications
CANON ASML ADVANCED APPLICATION COURSES 6 SIGMA GREEN BELT
Citizenship
UNITED STATES