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Engineer Manager

Nazareth, Pennsylvania, 18064, United States
May 28, 2010

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Dear HR Professional:

Perhaps one of your clients is seeking to add a Fortune 500-experienced and

results-proven IC, Module, Board & Systems Product, Test & ATE Engineer

& Manager to its technical team. If so, my enclosed resume will be of


My engineering career has been chronicled by awarded recognition, rapid

promotions, and exemplary-rated performance in roles that include

engineering manager, engineering/operations manager, staff engineer, and

senior product/design/test engineer for industry leaders such as Lockheed

Martin (my current employer), Lucent Technologies, and AT&T. As a result, I

offer your clients the following key strengths:

* A comprehensive background providing "cradle-to-grave" product

development leadership (from concept through design, development,

prototyping, characterization, systems integration & test, QA, and

manufacture) on industry-leading and award-winning technical and electronic

products, systems, hardware, and software. Examples include:

- Many custom automated testing equipment (ATE) solutions;

- Product & Test Engineer of hundreds of integrated circuits (ICs) and

application-specific integrated circuits (ASICs);

- System-on-chip (SOC), Fixed Pattern Gate Arrays (FPGA), multi-chip module

(MCM), and known good die (KGD) product developments; and

- Years of TE experience from IC through systems. Engineering,

Manufacturing, Management as well as ATE design & support.

* A long-standing track record of exceeding the quality, reliability, and

yield expectations of both employers and customers, with innovative product

solutions repeatedly praised by such high-profile clients as:

- U.S. Army/Navy/Coast Guard

- Japanese Navy

- Apple

- Hewlett-Packard

- Philips

- Siemens

- Sun

- Cisco

- Telefonica

- Telettra

- Nokia

- Ampere

* Consistent commendations for my leadership of cross-functional teams

(with up to 35 direct-reports) and multimillion-dollar projects/programs

(budgets of up to $15M per project).

* Strong credentials, including an MBA and a bachelor's degree in

electrical engineering/bio-engineering.

* Expert technical skills in an array of software, programming languages,

testing/QA technologies and methodologies, and operating systems.

I am available, my salary requirements are negotiable, and I would welcome

the chance to explore a possible career match with you. I can be reached at


I thank you for your time.


David M. Seese



Nazareth, PA

Phone: 610-***-****


Results-Proven Engineer Targeting Positions within the Electronics Sector




* Fortune 500-experienced engineering and management professional whose

career within Lockheed Martin, Lucent Technologies, AT&T, and other

organizations has been distinguished by accelerated advancement and

recognized achievements.

* Developer of award-winning, industry-leading, and customer-focused

technical and microelectronic products, with extensive experience leading

cross-discipline engineering teams in all phases of the product and project


* Backed by solid credentials (MBA, bachelor's in electrical

engineering/bio-engineering); advanced command of software, programming

languages, testing platforms, and QA/ATE technologies; and a passion for

and strong foundation in assistive technology and medical

rehabilitative/adaptive equipment.

Key Skills

- Product Research & Development

- Software & Hardware Engineering Design

- System Specifications Development

- Design for Manufacturability (Input & Output)

- Testing, Documentation & Quality Assurance

- Project & Product Lifecycle Management

- Pricing/Margin/Competitive Analysis

- Regulatory Compliance

- Variance & ECR Management

- Requirements Gathering & Analysis

- Design Plans/Controls/Reviews

- Risk Analysis

- Controlled Drawings

- Cross-Functional Supervision

Professional Experience - Technical


Staff Engineer, 2005 to May 2010

Hold concurrent responsibilities as ATE (Automated Test Equipment) lead,

IPT (Integrated Product Team) program planner and lead, and technical/QA

lead for both in-house-built and purchased electronic test equipment as

well as homeland security communications solutions. Guide cross-discipline

engineering teams (system, hardware, electrical, mechanical, software,

integration, and test engineers) in all phases of product/solutions

development, supervising up to 35 professionals per project in building

hardware/software simulators and in carrying out systems analysis,

debugging, design, integration, FQT (functional qualification testing), and

solutions verification. ATE built for electro / optic / RF - module / board

/ systems with "common core" functionality.

** Key Results:

* Led teams to design, build, test, and deliver custom ATE solutions on

time (or ahead of schedule) for multiple customers, including the U.S. Army

($15M project), U.S. Coast Guard ($13Mproject), U.S. Navy ($10M project),

and Japanese Navy ($7M project).

* Developed next-generation test equipment ensuring the highest level of

product quality available with limited infant mortality.

* Created, delivered, installed, and supported solution for fail-safe

product functioning "out of the box," and devised ATE solutions allowing

for the depot testing of used equipment to determine rework potential.

* Leveraged resourcefulness, problem-solving agility, and negotiation

strengths to overcome numerous product development challenges, including

complex changes in technical specs, customer-driven redesign issues, and

compressed timelines.

* Completed QA evaluation over the entire product lifecycle for several

external test products supported/administered by Lockheed Martin for its

customers. Identified problems and recommended fixes that fully resolved

various issues.

* Proposed communications suite for the U.S. Coast Guard's Homeland

Security application after leading failure analysis that identified the

root cause of numerous quality issues inherent in existing systems.

Provided solutions proposal estimated to accelerate current communications

100-fold, leading to in-progress negotiations for a $150M application

development contract.


Distinguished Member of Technical Staff, 1997 to 2004

Served as product champion (e.g., overall product and test engineer and

primary product technical contact) for numerous external integrated circuit

(IC) customers. Ensured customer satisfaction from prototype through end-of-

life on equipment/devices including motherboards and

Northbridge/Southbridge glue logic ASICs & SOC's with standalones and

chiplets (e.g., clock drivers, USBs, Fire Wire, Ethernet, custom ASICs,

RAM, DAC's, and ROM). Analyzed customer returns, reported results, and

maximized margins on products through yield enhancements, cost

avoidance/reduction, and redesign efforts.

** Key Results:

* Commended by customers and employer for "cradle-to-grave" product

development leadership of numerous application-specific integrated circuit

(ASIC) projects. Partnered with major accounts, consistently exceeding the

expectations of clients including:

- Apple

- Hewlett-Packard

- Philips

- Siemens

- Sun

- Cisco

- Telefonica

- Telettra

- Nokia

- Ampere

* Served as a primary mentor of newly hired technical staff. Coached best

practices in product development, solutions engineering, customer

interactions, engineering change requests (ECRs), and other areas.

* Cemented enduring client loyalty as a result of characterizing,

identifying, and solving numerous customer application IC problems,

including infant mortality, cross-talk, and solderability issues;

application incompatibilities; logic errors; process defects;

physical/electrical mishandling; and ESD (electro-static discharge) and EOS

(electrical over-stress) issues.

* Provided full-phase management of complex multi-chip module (MCM) and

known good die (KGD) product developments, from concept through design,

development, testing, QA, and manufacture. Credited with lead role in

delivering best-in-class results that led the industry in quality,

reliability, and yield enhancement.

* Became a company subject matter expert (SME) in system-on-chip (SOC) and

IC packaging integration. Innovated new package types tailored to customer


* Earned the highest possible marks on performance reviews throughout

tenure. Praised for out-of-the-box problem solving; change-agent

leadership; and fast, efficient solutions.

Professional Experience - Management


Engineering Manager, AT&T Microelectronics, 1995 to 1996

Engineering & Operations Manager, AT&T Bell Laboratories, 1992 to 1994

Engineering Manager, AT&T Bell Laboratories, 1988 to 1992

Product/Design/Test Senior Engineer, AT&T Microelectronics, 1984 to 1988

Advanced through accelerated promotions during 12-year tenure with AT&T,

culminating in charge to manage prototyping, development, characterization,

transfer to manufacturing, and reliability/current engineering for modem,

ASIC, and SOC products. Supervised product, test, packaging, board, and IC

engineers as well as union and non-union labor (up to 35 employees) at

board stuffing and test facilities. Advised multi-departmental product

development team on ways to best sell product innovations to targeted

company accounts.

** Key Results:

* Prototyped some of the first KGD, MCP, and MCM modules using technologies

that were cutting-edge at the time.

* Led team to design, develop, prototype, and manufacture the world's first

PDA in 1993, a revolutionary development in the industry.

* Awarded "Product of the Year Honorable Mention" by BYTE Magazine for EO

Personal Communicator 880 440.

* Achieved ISO certification for organization and its product lines (a

first) on initial attempt.

* Established and managed AT&T's first external customer prototyping and

manufacturing support of IC devices for newly established, worldwide design

centers. Led multinational negotiations with global systems customers on

all aspects of IC realization (including definition, device specs,

applications, costing, prototyping, and manufacturing).

* Opened three new design centers (DCs), including the hiring and training

of all management and technical employees for each location.

* Supervisor of 24/7 IC Test Centers with Union Operators.

* Matrixed Management of Maintenance Organization for IC Test Center.

Early Career


Product & Test Engineer, 1980 to 1984

Introduced new package designs, performed reliability and quality studies

at IC and system levels, and developed hardware and software to test and

support the manufacture of ICs in wafer, package and module format. Ensured

yields exceeded projected range, resulting in record-high profitability of

product manufacture.

* FPGA's, RAM, ROM, ASIC's in Wafer, Package and Module Format.

* Outpaced company's typical career progression, earning the fastest

promotion to engineering management in AT&T Allentown location's history.

IBM - Endicott, NY

Metallized Ceramic Substrate Operator, 1979

Hired for summer position during college by IBM's systems Product Division,

working in the inserted and on-serted Metallized Ceramic Substrate multi-IC

packaging department.

Education & Credentials


MBA, Major in Management, Minor in Ethics, 1995


Bachelors in Electrical Engineering, Minor in Bio-Engineering, 1980

Clearance: Active Secret Security Clearance

Affiliation: Past Member, IEEE

Technology Summary


MS Office (Excel, Word, PowerPoint, Outlook, Access, Project, Visio)


C, C++, V-Basic, Ksh, AWK, Perl, Java, HTML, Fortran, Assembly


Teradyne - A500 Series; Catalyst; Tiger

Agilent - 83000, 93000;

Credence - SC212, SC312;

Legacy: Fairchild, Gen-Rad

custom ATEs built for systems verification

Test Platforms:

Image, Most, Agile, NI Test Stand & LabView


Windows (all), UNIX, Linux, Solaris CDE


* AT&T President's Award (for saving a life), 1990

* Product of the Year Honorable Mention, BYTE Magazine, 1993

* Two-time Supplier/Product of the Year, Siemens IC Device Delivery, 1988,


Reply To


Phone: 610-***-****


Contact this candidate