KEVIN A. TOWLE, PE
** *********** **** 360-***-****
Touchet, Washington 99360
abmqg1@r.postjobfree.com
Summary
Senior management professional with diverse experience encompassing
technology development, product development and manufacturing. Results
oriented leader with a solid technical foundation, a global business
perspective and proven organizational and management skills. Possesses the
ability to effectively balance today's tactical needs with tomorrow's
strategic needs.
Professional Experience
R&D Mechanical Engineering Manager Jul 2008
to Dec 2009
Key Technology, Inc., Symetix, Walla Walla, Washington
Manage the development of next generation automated optical inspection
systems targeted at the global pharmaceutical and nutraceutical industries.
Reporting to Senior Vice President.
. Transition production development strategy from point solution to a
portfolio of products based on a configurable platform strategy, enabling
multiple price points with wider market potential.
. Accelerated product development process, first alpha unit completed
within seven months of accepting position, followed by a portfolio of 11
products within 16 months. Historical single product development cycle
averages 18 months.
. Successfully managed remote design teams (mechanical and controls), new
mechanical design and controls structure along with design for
manufacturing, resulted in a material and labor cost reduction of
approximately 20% across the product portfolio.
Senior Manufacturing Engineering Manager 2005 to 2008
Biotronik, Micro Systems Engineering, Inc., Lake Oswego,
Oregon
Manage a technical staff responsible for developing and sustaining the
manufacturing infrastructure (information and physical processes) required
to produce Class III electromechanical implantable medical devices.
Reporting to Vice President of Operations.
. Improved operational effectiveness by 70%, driving manufacturing defects
below "Best in Class Standard" of 50 defects per million opportunities.
. Extended portfolio of manufacturing processes with the introduction of
double sided surface mount assembly on both rigid and flex circuits,
enabling the introduction of five new products with market leadership
performance and feature set.
. Implemented concurrent engineering with strong focus on design for
manufacturability (process simplification, centered six sigma processes,
margin testing and extended life testing), resulting in new products that
are approaching 99% automated assembly with up to 50% fewer process
steps.
. Extended design for manufacturability focus to include assembly
operations in Germany.
. Implemented fully automated component and process traceability on core
production line with real-time SPC for critical process parameters.
. Principal system architect for Manufacturing Execution System. Led the
development of all automated machine interfaces, providing closed-loop,
real-time process control and traceability.
Vice President, Technology 2003 to 2005
SilverOak Technologies, Inc., Irvine, California
Key stakeholder in a startup company focusing on the commercialization of
water management systems. Responsibilities included technology and customer
needs assessment, project proposal and system design.
KEVIN A. TOWLE, PE
Senior Microelectronics Program Manager 2000 to 2003
Tektronix, Central Engineering, Microelectronics, Beaverton,
Oregon
Managed a portfolio of microelectronic projects that provided the core
technology required to ensure market leadership in the global test and
measurement market.
. Successfully managed a portfolio of 21 core IC projects with an annual
budget in excess of $20 million. Moved IC development programs from
critical path to a position of enabled technology for product
development.
. Led the concurrent development of technologies, processes, design
infrastructures and component designs for next generation products,
resulting in six prototype components with performance levels that more
than tripled current banner specifications.
. Accelerated time to market by strengthening collaboration with product
development and manufacturing community and by being the driving force
for early involvement by all stakeholders, cross-functional teams and
concurrent engineering.
. Transitioned the organization from ad hoc program management to a more
structured approach, achieving a 70% improvement in scheduling accuracy,
a 45% improvement in budget forecasting and a 60% improvement in resource
utilization.
. Established stronger relationships with strategic partners, resulting in
open exchange of technology roadmaps and a 35% improvement in prototype
lead-time and delivery performance.
Senior Manufacturing Engineering Manager 1995 to 2000
Tektronix, Board Assembly Operation, Beaverton, Oregon
Managed a group of engineers and technicians chartered with introducing and
supporting all manufacturing processes and equipment involved in the
assembly of electronic circuit boards.
. Developed a high performance organization that grew from a team of 3
engineers into a group of 30 engineers and technicians responsible for
supporting a $1 billion revenue stream.
. Implemented five-year manufacturing strategy that supported a 35% annual
growth rate, while achieving a 74% reduction in throughput time and an
83% reduction in defects.
. Successfully managed a $3 million operational budget and a $5 million
capital budget.
. Developed an organization capable of supporting a 24-hour a day operation
with a sustainable uptime of 98%.
. Key advocate for development of CIM tools to optimize machine setup and
changeover, resulting in throughput improvement exceeding 40%.
Equipment and Automation, Program Manager 1990 to 1995
Tektronix, Board Assembly Operation, Beaverton, Oregon
Program manager for circuit board assembly processes.
. Proposed, justified and implemented three surface mount assembly lines,
resulting in a 68% improvement in throughput, a 32% reduction in labor
and a 76% reduction in process defects.
. Reconfigured existing assembly equipment to achieve a 67% improvement in
throughput.
. Implemented robust processes to support the rapid introduction of new
products, utilizing leading edge surface mount technology.
. Developed robotic placement system to place ultra fine pitch surface
mount components, resulting in a 98% reduction in defects and a 300%
improvement in throughput.
. Designed flexible solder paste tooling plate system, enabling the
development of a high quality (less than 100 ppm) ultra fine pitch
printing process.
KEVIN A. TOWLE, PE
Senior Mechanical-Electromechanical Engineer, Project 1987 to 1990
Manager
Tektronix, Personal Test Instrument Division, Vancouver,
Washington
Managed major capital projects focused on circuit board assembly and final
assembly.
. First successful implementation of robotic component insertion, resulting
in a 69% reduction in cost and a 72% reduction in defects, supporting
over 120 non-standard components on 34 circuit boards.
. Transitioned final assembly operation from discrete assembly operation to
one semi-automated line supporting 24 products, resulting in a 63%
reduction in throughput time, a 38% reduction in labor and the
elimination of all ergonomic issues. System featured in Tektronix'
Annual Report and showcased by power tool vendor for its ergonomic
design.
Education
Master of Science in Management of Science and Technology 2000
Oregon Graduate Institute of Science and Technology, Beaverton, Oregon
Master of Science in Mechanical Engineering 1985
University of Portland, Portland, Oregon
Bachelor of Science in Mechanical Engineering 1983
University of Portland, Portland, Oregon
Recognition
Recipient of Tektronix' 1998 Manufacturing Technology Leadership Award
Recipient of Tektronix' Key Contributor Award
2003, 2002, 2001, 2000, 1998, 1997, 1993 and 1989
Registered Professional Mechanical Engineer (PE) Oregon
Publications
Impact of Automated Optical Inspection
SMTA International 2000 (presented and published)
Trends in Electronic Products and Placement Equipment
SMTA International 1999 (presented and published)
Line Configuration for Today's Highly Complex Manufacturing
SMT Magazine, November 1998
Low-Volume, High-Mix Manufacturing
Circuit Assembly, January 1998
Placement Equipment Strategies for Low-Volume, High-Mix Manufacturing
SMI 1997 (presented and published)