Engineer Supply Chain

Arther I. Bhatti

*** ****** ***, **** *******, CO 80526

Cell 970-***-****, Home 970-***-****

************@*****.***

www.linkedin.com/in/artherbhatti

SUMMARY

Professional Engineering Manager with extensive experience in Supply Chain,

Procurement, Manufacturing and Project Management in the Electronic

Industry; Strengths include:

. NPI manufacturing implementation at Local and Overseas

Facilities

. Strategic Sourcing PCBA, Chassis, Microelectronics and EMS

Service

. NPI Chip Manufacturing/test and Computer Server/Workstation/PCA

assembly/test

. Low Cost Region Manufacturing transfer management and Cost

Reductions

. Development/ Management of Subcontractor Relationships and

Supplier Quality

. Manufacturing leadership in Cross-functional and complex global

supply chain

. Strong initiatives, timely solutions and Result oriented

leadership

. Failure Analysis, Testing, Quality and Reliability

PROFESSIONAL EXPERIENCE

HEWLETT-PACKARD, Ft. Collins, CO

1989-2009

NPI Procurement Engineer (2004-2009)

< Developed NPI Manufacturing Plan in Q2 2008, reducing development cost

by $12M for Major HP Computer Sever Program. Led successful transition

of New Servers to Low Cost region.

< Led sourcing effort of lower cost components and use of Low Cost

region to reduce standard cost by 70% per year for Security Product

Program, and achieved $7.4M cost avoidance.

< Led cross-functional team to develop semiconductor Chip Harvesting

Process which captured $34M Revenue in Q1 FY09 that was otherwise in

Jeopardy. Published paper specifying process for future, reviewed

reliability and warranty impact, and made recommendations.

< Project managed transfer of high end HP Enterprise Server, Superdome,

and Manufacturing to Lower Cost region to achieve $6M/year Cost

Reduction. Led team of Mechanical Engineers, Commodity Managers, R&D

and Planners to set process, and worked with Order Fulfillment Centers

in Houston, Germany and Singapore to manage inventory and carry out

smooth transition to prevent any negative customer impact. Received

stock options and salary increase for this accomplishment.

< Selected suppliers, implemented/managed processes, negotiated assembly

cost, established supply

Chain links, established quality metrics, led corrective actions and

directed manufacturing

Operations for HP on new products, and set up DFx Process

< Linked HP geographically dispersed teams that enabled Labs to complete

thorough DFx Review and PCA Assembly Process Qualification before

design release and proto build.

< Negotiated best turn-around time (TAT). Developed Statement of Work

(SOW) and managed RFQ processes, and analyzed quotes. Communicated

forecasts and analyzed capacity.

< Led multidiscipline program reviews with internal teams and suppliers,

covering test development,

Design, verification, capacity, human resource and training concerns,

and manufacturing

Readiness and reviewed status and initiatives with upper management

for approval.

Manufacturing Program Management of Microelectronics (1997-2004)

< Managed and placed Test and Assembly Processes at IBM/Intel/ISE Lab

for HP PA RISC 8800, 8600, 8700 and Custom Memory Controller.

< Wafer Probing and Package test tool development and tester procurement

and responsible for testing of Wafers and Chip Packages and

reliability. Technical reviews and Milestone Reviews.

Arther I. Bhatti (Page 2) Cell 970-***-****

************@*****.***

< Responsible for major turn-around of poor performing vendors to

excellent and Management of Risk. Established this supplier for viable

test source for life cycle of many microprocessor programs. HP gave

supplier "Most Valued Partner" Plaque after six months.

< Wrote detailed Interface Agreement between internal cross-functional

teams to ensure compliance with goals and quality metrics.

< Wrote criteria for Release to Production Test (RTPT) and drove SOW.

< Led awareness campaign for EU lead-free directive and compliance

requirement.

< Led Manufacturing Readiness reviews with cross-functional teams and

contract manufacturers. Responsible for status review with upper

management.

Component Engineering (1995-1997)

< Responsible for material change qualification and approvals.

( Qualified changes and characterized microprocessors in

Servers/Workstations with schmoo.

< Wrote Qualification Criteria a Sampling Plan and Regression Analysis

< Microcontroller, Memory and standard chip materials Engineering

< Root Cause Failure Analysis of Memory and Microprocessors

Design Engineer for Storage Systems Division (1994-1995)

< Integrated new disk drives into storage systems.

< Designed and procured cable assemblies.

< Performed reliability, quality and regulation tests.

Quality Engineer (1992-1994)

< Environmental/Safety/FCC Qualifications and Quality Improvements of

all new products. Managed FCC and regulation testing.

< Conducted industry study of environmental specifications and re-wrote

specifications for new products.

Production/Procurement Engineer (1989-1992)

< Analyzed ASIC Reliability and impact of Burn-in process and proposed

elimination of Burn-in for no value-add, decreasing cycle time.

< Sourced custom cable assembly, connector and PCB.

< Provided engineering support on manufacturing line of disk drives;

failure analysis and process

Control.

TECHNOLOGY

. Disk Drives, Storage Systems, Computer Hardware, PCI Cards, Encryption

PCI cards

. Cable Assembly, Connectors, Sheet Metal Chassis, PCB Assembly

. ICT Test, Functional Test, Wafer Probing, Package Testing, Chip

Validation

EDUCATION

( BSEE from University of Texas at El Paso, 1988

( MSEE from National Technology University, 1994

TRAINING

( Project/Program Management, Quality/Reliability/Lean Manufacturing

( Familiar with TQM, Six Sigma, ISO 9001/ISO 14001 and SPC

( Supply Chain Management

( Excel, MS Word, Power-Point, Outlook, MS Project

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