Project Manager Design

Kenneth J. Silvestri

** ********* ***** ********, ** 01469

Home: 978-***-**** Cell: 508-***-****

***********@*******.***

Career Profile:

. A Designer who possesses superior knowledge and skills relating to

Advanced Microelectronic Packaging and Printed Circuits.

. Successful track record for meeting technical, budgetary and time

constraints.

Qualifications:

Microelectronic/Printed Circuit Design

. High Density Printed

Circuit Boards

. Thick and Thin Film Hybrid circuits

. Multi Chip Modules

. Ball Grid Arrays

. Flip Chip Packaging

. Stacked Die Packaging

Electro Mechanical Design

. Packaging, Panels,

Enclosures

. Wiring Harnesses

Design Tools

. Mentor/PADS: Layout and Router

. Cadence APD

. Sigrity UPD

. Synopsys Encore IC Packager

. AutoCAD 2010

. ORCAD Schematic

. SPECCTRA

. CAM350

Office, Data Management and Communications

. Microsoft Office 2007 Professional

. Windchill PDM

. WebEx

. Net Meeting

Engineering and Manufacturing

. Experienced in electronic research, development and manufacturing

environments.

. Fundamental understanding of electronic circuits.

. Hands-on experience with

electronic laboratory and

test equipment.

Professional Experience:

Independent Design Consultant (dba R.K. Associates) 1/2009 -

Present

. Provided microelectronic and printed circuit board design services to

several customers.

. Created design layouts, plus all of the data and documentation necessary

for fabrication, assembly and testing.

. Partnered with customers and suppliers to deliver accurate, lower cost

high reliability products.

STATS ChipPAC Inc., Southborough, MA 2002 ( 2009

Member of Technical Staff

The sole eastern US advanced packaging designer for customers such as:

. IBM

. Analog Devices

. SMSC

. ATI

. In-house design representative to Analog Devices from 2003 to 2006.

. Maintained a keen technical edge by working closely with corporate design

centers in Singapore, South Korea and the US.

Kenneth J. Silvestri

41 Maplewood Drive Townsend, MA 01469

Home: 978-***-**** Cell: 508-***-****

***********@*******.***

Professional Experience (cont.):

Honeywell InterChip Inc., N. Andover, MA 1997 - 2001

Project Manager

. Lead a project team to create high density PCB and microelectronic

devices from schematic through production.

. Rendered these services to customers such as:

. U.S. Army

. Lockheed Martin Corp.

. L3 Communications Inc.

. Alliant Techsystems Inc.

. Honeywell

. Osram Sylvania

Senior Microelectronic Packaging Designer

. Working for a design service bureau, I created highly complex layout

designs for HDI PCBs, Hybrids, MCMs and BGAs for multiple customers.

Acoustic Technology Inc., East Boston, MA 1994 - 1997

CAD/Documentation Manager

. Created and managed the Design/Drafting department.

. Performed PCB and electro-mechanical designs.

. Developed a procedure to graphically render acoustical field data. This

accomplishment resulted in a 30% reduction of analysis costs as well as

adding a powerful tool for the company's sales arsenal.

Independent Design Consultant (dba R.K. Associates) 1990 ( 1994

. Working under contracts, I designed PCB, Hybrid circuit and Electro-

mechanical designs for the following companies:

. Optical Micro Systems

. Analog Devices

. Systemonics

M/A-COM

. Micro Precision Technologies

. Millpack

Academic Background:

AS in Electronic Engineering Technology - Central N.E. College,

Worcester, MA

. Training certificates:

. Cadence - Advanced Packaging Designer (ver. 15.7)

. Sigrity/Xynetix - Unified Packaging Designer and Encore BGA

. Mentor/PADS - Layout and Router (Update training 2009)

. IPC: Selecting, Qualifying and Managing a PCB Supplier

Current and former memberships:

. IMAPS (International Microelectronics and Packaging Society)

. SMTA (Surface Mount Technology Association)

. IPC (Institute for Interconnecting and Packaging Electronic

Circuits)

. LinkedIn profile: http://www.linkedin.com/in/kensilvestri

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