Sales Manager

**** *** ***** ***** *****: 512-***-**** (Austin)

Austin, TX 78731 E-mail: abmfqq@r.postjobfree.com

Peter F. MacCormack

Summary 1983 - Present Austin, TX

Over 25 years of high technology network, system, silicon and software experience. During this

period I have had various executive and management positions in architecture, development,

marketing, sales, and operations at market leading companies including IDT, CableLabs, Broadcom,

Navicent, Intel and Texas Instruments. Key highlights of my background include:

Director of Advanced Technologies for N. A. cable companies. Work areas include strategic

assessments of all wireline and wireless technologies utilized in next gen. cable networks. The

work is specifically developed for the CEOs, CTOs and VPs of the leading N.A. cable companies.

Product Line General Manager for all aspects of $200M Cable Modem chipset business.

Defining, developing and delivering mixed signal CMOS, RF CMOS and HV (150V)

interface/power silicon. Along with complete Data, Voice and Gateway SW stack.

Conceived, initiated and closed multiple joint development deals with companies such as IBM,

Hewlett Packard, Hitachi & Intel leading to over $50M in revenue each

Managed Multi-Site/Multi-National development teams up to 50 engineers

Raised nearly $30M venture capital funding over 5 years & three startups

CEO, Founder of Navicent Technologies and author of 120 patent application claims that appear

to be the basis for the Next Generation Cable Networks (DOCSIS3.0) and Services. Several

including 100mbs per subscriber, Everything on Demand and low latency converged networks

Opened and acted as VP/GM for two facilities. Negotiation and set up facilities, all hiring, benefit

plans (401k, insurance, etc.), equipment environments/purchases, etc.

Set up direct, distribution and representative marketing & sales channels for three companies

Key contributor driving sales from $50 m to well over $200 in a 4 year period (1984 to 1988)

Education 1979 – 1983 University of Vermont BSEE Burlington, VT.

Experience February 2009 – present Integrated Device Technologies Austin, TX

Director of Systems Engineering and Strategy: In the role I was in charge of the strategic

planning, market requirements, product definition and resource management for a series of mixed

signal system on a chip (SOC) aimed toward the digital TV, digital set-top box, Blu-ray, PC monitors

as well as other consumer multi-media devices. In particular I provided 1 to 5 year planning for all of

the SOC products. Key areas of planning include audio/video (AV) decode (MPEG2, 4, AVC, etc.), AV

post processing (noise reduction, detail enhancement), Digital Video Recording, wireless

networking/AV delivery, LCD Timing control, power management, service front end (cable, satellite,

terrestrial, etc.), IO/Networking (Ethernet, SATA, PCI, USB, etc.) and CPU/DSP (ARM, ARC, CEVA,

MIPs, etc.)

Included in the planning were market requirements, architectural/ feature recommendations,

Intellectual Property (CPU, DSP, IO) due diligence/selection, financial projects, SWOT/competitive

analysis, etc. I was also responsible for recommending potential M&A opportunities as well as

provided due diligence on various technologies/companies under M&A review.

May 2005 – October 2008 CableLabs Louisville, CO

Director of Advanced Technologies: As Director of Advanced Technologies I was responsible for

future technology initiatives for cable operators. In particular I provide strategic assessments and

recommendations for cable CEOs, CTOs and VPs to help drive next generation wireless and wireline

technologies. These assessments were comprised of several key work areas including service

definition, capacity models, technology evaluation, deployment cost estimates and financial

projections. Several of the key programs include:

Fixed mobile converged (FMC) services network: This entailed the definition of the architectures

and technologies required to provide seamless voice, video and data operation over various 3G/4G

cellular, WiMAX mobile broadband wireless access (MBWA), Metro Wi-Fi and Wireless LAN

networks. Key assessments have included optimizations specifically for cable networks, ongoing

unlicensed/licensed spectrum and regulatory analyses, detailed technology reviews (3G (EVDO,

HSPA), 4G (LTE), WiMAX, 802.11n+, etc.), Public Safety/Homeland security strategies, IMS core

integration, Mobile TV plans, application/service integration, etc.

Advanced Home Networking and Converged Service Gateway: Developed strategy for next

generation home network integration into fixed mobile convergence (FMC) and future service plans.

Defined all the features for eventual release to manufacturers. Main products include the

specification for converged services gateway which includes next generation broadband access,

home network (MoCA, HPNA, etc), wireless network, voice over IP, femtocell, etc.

HFC Service & Network Extension: Provided analysis of network breaking points and guidance on

how to compete against FTTX, xDSL, PON, etc. and how to extend plant life to beyond 2018. The

analysis included modeling all aspects of a cable services/network including the trends and

corresponding effects that broadcast digital TV, broadband data and voice, VOD, advertisement

insertion, cellular traffic, etc. will have on the core, edge and broadband access networks. The HFC

extension plan then includes technology analysis utilizing combinations of switched broadcast,

MPEG2 to MPEG4 transitions, analog reclamation, 1GHz network operation, hybrid home and

network based DVR for traffic absorption, advanced core and edge routing (MPLS, VPLS, etc.),

centralized/distributed program and add insertion as well also includes CPE, core and field

equipment replacement cycles.

Key Accomplishments

• During my more than three years at CableLabs I acted as the Chairman of the Wireless

steering group. This organization was comprised of nearly 30 CTOs and VP from each of the

cable companies whose task was to analyze and make projections in all aspects of wireless.

Eventually the team’s recommendations led to the purchase of nearly $2.5B of spectrum and

to the cable’s industry’s entry into the wireless market.

May 2003 – May 2005 Broadcom Corporation Atlanta, GA

Product Line GM: In this position I was responsible for all aspects of the business including

Architecture, Development, Marketing (Product Strategy & Definition, Pricing, Competitive Analysis,

Product Positioning, Customer Sales Interaction, etc.), Operations & Manufacturing (Demand

Assessment, Production Planning, Cost Structure Analysis, etc.) and Finance (full financial

contribution analysis) for the Cable Modem (CM) and Gateway Customer Premise Equipment (CPE)

Group at Broadcom. My product lines consisting of the following:

Data CMs: Data products include several generations of DOCSIS & EuroDOCSIS CM silicon, RF

Tuner silicon, Software and CPE reference designs aimed toward the residential (cable modems,

gateways), SMB (routers), embedded (transponders) and equipment Markets.

VoIP enabled CMs/Gateways: Voice product lines include the industry’s first single chip Voice over

Broadband mixed signal silicon consisting of integrated DSP and dual channel Analog Telephone

Line Interface capable of running Company developed industry standard Voice CODECs and VoIP

technologies such as G.7xx, Echo Cancellation, Voice Activity Detection, Comfort Noise Generation,

and Packet Loss Concealment. Included in the designs are High Voltage 110 to 150V SLIC and high

efficiency power supply designs. When coupled with the previously mentioned data CM technologies

and its full suite of PacketCable/SIP compliant Call Management & Gateway (MGCP, GR-303, etc.)

software the Company provides the world’s leading primary/secondary line (Battery Backed or Line

Powered) VoIP CM reference designs.

Residential and SMB Gateways: The Gateway product line provides both server/web and local

CableHome/Residential Gateway (RG) compliant software and hardware including features such as

NAT/PAT, Firewall, Anti-Virus, Parental Control, WAP, VPN, etc. Various reference kit design

combinations developed wholly from internal silicon and software include 802.11 Wireless, Wireless

& Voice, Cellular (femtocell), HPNA, Bluetooth, etc

Other: I have also have conceived and defined new product for other organizations including hi

voltage SLICs, high efficiency power supplies for CPE devices and Power over Ethernet.

Several key achievements including:

Defined all the products for the cable group during a 24 month period

Brought to market and certified with OEM partners such as Motorola, Thomson, Scientific Atlanta,

Cisco/Linksys, Netgear and Ambit over new 50 products in 2004

Managed production on more than 100 M devices and tripled revenue from $80m to $200m

Grew Voice & Gateway penetration by 1000%

Improved market penetration to 80% and margins up by 5% to roughly 55%

Defined products reducing BOM costs by 15%-20% per year

1998 – April 2003 Navicent Technologies Austin, TX

CEO, President and Founder: Navicent Technologies Inc developed Broadband Equipment,

Semiconductors and Intellectual Property for the HFC Cable marketplace. The Company developed

its closely coupled Cable Modem Termination System (CMTS), Customer Premise Systems (Cable

Modem, residential gateway, digital set-top box) and Super Node (RF aggregation) products.

Navicent delivered to the market a 400 Mbps cable network nearly 10 years ahead of the market. As

CEO, President my responsibilities included:

Corporate: As president I created and drove the vision and focus of the Company. I was solely

responsible for the completion of business plans, negotiated rounds of financing & proper legal

corporate paperwork. Also I opened the facility, defined/established benefits plans, hiring plans,

facilities, payroll and accounting plans.

Technical: As co-founder I lead product definition (MRD), external/internal architecture and

intellectual property generation. I wrote and filed approximately 120 patent claims in the areas

broadband access Networks, network switching, switched digital video, digital video recording,

advertisement insertion and high bandwidth interactive networks. Eventually, several of the

technologies were adopted by the cable industry, most notably DOCSIS3.0.

My most important task was to qualify and hire the engineering management teams and set up the

appropriate benefits plans for retention. The teams consisted of ASIC, PCB, Software, OS, System

and RF engineering. Secondarily, from a design perspective I defined the corporate development flow

and procedures including logic capture and simulation via Verilog simulation, synthesis, layout,

verification and test generation for both FPGA and ASICs. The company also developed its own

board development and layout capabilities. In particular I participated and lead the architecture and

development of a Carrier Class DOCSIS CMTS, DOCSIS MAC/Security (DES) software/hardware

acceleration, multi-channel QAM modulator & demodulator, RF Up-converter, Gigabit to multi-

channel QAM network switch, RG (CM based on MIPs Core, Router, VoIP, Video over IP, Linux OS

and firewall), IP & MPEG2 transport mixing, MPEG2 decoder/encoder, VOD server software,

Personal VCR software, DNS, MPLS, Storage/Delivery and Multi-stream DVD quality VOD and video

teleconferencing (H.3XX, H.2XX, MPEG4, DES, Security, etc.) algorithms. Each of the designs was

set up for high volume manufacturing utilizing both local and Asian custom manufacturing.

Sales & Marketing: In this role I established and implemented an integrated marketing, sales,

product development and manufacturing strategy. This included the development and implementation

of a multi-year plan that identified key products by segment, target customers, sources of supply,

hiring of skilled professionals, organization structures, optimum sales channels, market positioning,

pricing strategies, investments, budgets and resources to enable the following business processes:

Order acquisition, product development, product realization, and order fulfillment. Eventually, the

process defined led to the setting up of a WW Sales operation. The team presented and met with

nearly 15 cable company executives including several of the top c-executives from Time Warner, ATT,

Cox, Comcast, etc. In addition the team and myself developed direct relationships to sell the

company to several technology F1000 OEMs including Nortel, Tellabs, Cisco, S. A. and Motorola

Successes:

Raised $4M Series A Venture Capital

Won $1M contract to develop MPEG2 decoder for fortune 1000 company.

Letters of Intent received by F500 OEM for CMTS delivery and eventual purchase of Company

Preliminary commitments from Cable Companies to provide field trials.

Won contract, defined and developed a multi-stream DVD (1 to 40mbs) quality VOD and Video

teleconference demonstrations for cable over-builder.

Produced the industry’s first working 400 Mbps cable network in 2000

1996 – 1998 Accelerix Incorporated Austin, TX

VP Engineering, Marketing & Sales, and GM: Accelerix developed graphics devices with embedded

DRAM technology. While at Accelerix I was in charge of all Marketing, Sales and Development for

its1st and 2nd generation 3D graphics device, software drivers and reference kits. The devices

uniquely included custom DRAM with processing cells at the sense amps allowing for several

thousands of bits per clock of data or processing. In particular the 1 st generation hardware consisted

of a 750K gate 2D/VGA with 2.5 Mbytes of embedded DRAM. The 2 nd Generation Hardware

extended the capabilities to a 2.5 M gate 2D/3D 1G pixel engine, all hardware MPEG2 Decoder,

VGA, NTSC controllers, an ATSC controller and 5 Mbytes of DRAM. The software for both supported

industry standard Microsoft Direct X 8.0, Direct 3D and Industry standard OpenGL.

The engineering team was roughly 50 hardware and software engineers (25 direct engineers on the

second generation in Austin, TX and 20 engineers on the first generation in Ottawa, CA). I was

responsible for defining the corporate development flow including Verilog, synthesis, procedures,

verification/test generation, test board development, software algorithms, drivers and all other

aspects required to complete graphics devices destined for the mobile and desktop space.

I was also responsible for completing the majority of the Company’s Business Plans and

presentations to VCs that allowed the company to raise a 2nd round of $12.5M (1st round of roughly

$6.5M).

I also was responsible for the Marketing and Sales of the Product and set up both direct and indirect

marketing and sale channels for domestic and international markets via representative channels.

Channels were set up in Korea, Italy, Taiwan and Japan. Customers included the leading notebook

manufacturers including Toshiba, NEC and leader Taiwanese Companies North America was direct

with OEMs such as HP, Compaq, Dell, and IBM. I also opened, developed employee benefits plans,

hired the entire staff and was the G. M. for the Austin facility.

1994 - 1996 ICHIPS Vancouver, WA

VP Development, Marketing & Sales, and Architecture: ICHIPs developed embedded SRAM with

logic devices. While at ICHIPS I was in charge of market requirements, product definition and

development of its X86 Chipset with embedded SRAM. In particular the Company developed an X86

Northbridge with CPU, PCI Bus, memory controller and integrated 512K bytes of 4-way set

associative cache in a single chip. This design was roughly 4 times the transistor count of and Intel

Pentium chip.

In addition to the chipsets I defined and led the development of the algorithms resulting in the

industry’s fastest MPEG2 software decoder. The SW was roughly twice as fast as nearest competitor

and was introduced at Fall Comdex as Intel’s corporate demo in 1995. Won contract to deliver

MPEG2 for Intel.

During this period I also set up direct and indirect sales channels and met with various WW OEMs

and partners including HP, Compaq, IBM, NEC, Hitachi, NEC, Dell, AST, Compal, FIC, etc.

1993 - 1994 Texas Instruments Dallas/Santa Clara

Senior Manager Strategy and Planning: During this period I was responsible for technical direction

and business development for the Major Accounts Sales organization. In particular I initiated,

negotiated and worked on Joint Development Programs with IBM, Compaq and HP. The main focus

of the work revolved around the joint development and definition of components required for PC

development including in house x86 CPUs and chipsets, P1394, USB, modems, Graphics, Hard

Drives, Networking, Advanced Bus Interface including LVDS product etc.

1991 - 1993 Intel Folsom

Manager of X86 Chipset Architecture, Product Planning Chairman: In this position I directed several

architects who were responsible for the product definition for Intel’s X86 chipset development. During

the chipset development I was responsible to deliver next gen. memory/CPU/Cache and

IO/Peripheral controllers. Each architect delivered specifications for roughly 30 engineers. I also

worked on an integrated CPU/Chipset project. During this period chipset sales increased from $50M

to $2B. I also acted as Product Planning Chairman for a series of IO devices and was also involved

in Ethernet network chip development.

1983 - 1991 Texas Instruments Various

Product Line/General Manager X86-Chipset (1989-91): I initiated and was responsible for several

joint development programs and sales for both IBM and HP. In particular I initiated, negotiated terms,

wrote contracts, drove internal funding, architected and managed the chipset development between a

joint HP and TI that entailed managing teams in Sunnyvale, Dallas, and Japan totaled roughly 50

engineers. This program entailed the successful development of a x86/Memory

Controller/EISA/Cache Controller Bridge chip, Custom Memory Data Path chips, EISA Interface and

IO peripheral Controller. I also was responsible for setting up Marketing and Sales channels with US

and Japanese OEMs. The product reached 55% market share with sales hitting $45M per year.

Network Engineering and Lab Manager (1988-91): During this period I was in charge of network chip

development where I was responsible for the architecture team, microcode development, OSI/IP

Network Stacks, compliance/verification lab, interface ASIC development, customer support and

board/system development teams (15 to 20 engineers).

Technical Sales Manager (1984-1988): In this position I provided the technical direction for 17

technical sales engineers focusing on WW HP accounts. Technologies included advanced bipolar,

analog, ASICs, network devices, CPUs, DSPs, Memory, Modems and other custom designs. I was

also involved in defining and starting JIT shipment programs, sales tracking systems, ROI and BET

analysis, and Contract/Legal negotiations on multimillion $ projects. Sales grew from $15M to $200M.

Design Engineer/Joint Development Manager (1983-1984): Participated in the design of the

Company’s Token Ring Chipset. Also designed the first Token Ring Network Board. I also acted as

the resident architect and manager between IBM and TI management on Token Ring development. I

worked daily at the CEO and VP level providing status reports and analysis.

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