Prasit Sricharoenchaikit, Ph.D.

* ***** ****** ****, ***********, MA 01581

Home:508-***-**** ; Cell Phone:508-***-**** - abmdcb@r.postjobfree.com

Summary

A skilled Principal Engineer with more than 20 years of R & D, Process

Development and Manufacturing experience in the Integrated Circuit &

Semiconductor, Specialty Chemical, Active Matrix Liquid Crystal Display

[AMLCD] and Medical Device Industries. Multiple published articles, 6 US

and 5 foreign patents, one pending.

Management - Experienced in leading, directing and motivating teams.

Demonstrated success in altering culture and increasing responsiveness

towards both internal and external customers.

Business Development - Skilled in developing and maintaining Customer

relationships and cost estimates.

Technical - Demonstrated skills in the leadership in the technical role.

Successfully reduced production costs and developed standards based

documentation.

Photolithography Plating Medical Device

Process Chemistry Wet Etch Solar Cell

Semiconductor Electroplating Project Management

Professional Experience

Beaver-Visitec International, Waltham, MA 2010-

2012

(Medical Device Company, formerly a division of BD)

Principal Engineer

. Responsible for all chemical processes of making medical devices

(surgical blades).

. Process development & Medical device manufacturing.

. Failure analysis.

. Introduced new processing method that resulted in reduction of rejects

($150,000 per year).

1366 Technologies, Lexington, MA

Senior Photovoltaic Engineer 2009 - 2010

. Developed & Optimized Si etching process for texturing both mono and

multi-crystal.

. Developed resist processes for solar cell manufacturing.

. Developed metal-assisted Si <100> etching process.

. Developed silica slip casting process.

M/A-COM Technology Solutions, Lowell, MA

1997 - 2009

Principal Engineer

. Developed a process for solder bump (got a patent) for Wafer-Level Chip

Scale Packaging and Bumping for High Density Flip Chip (HD FC) for Si

and GaAs devices. This process built solder bumps on M/A-COM's products

which bring in revenues of $ 7-10 million.

. Developed copper gold & silver plating processes for microwave integrated

circuit.

. Optimized Orientation Dependent Etching (ODE) process of Si <100> wafers.

. Optimized Buffer Oxide Etch (BOE) processes for etching oxide wafers.

. Optimized Plasma Etching Process (Down Stream Oxygen Plasma).

. Optimized Resist Removal Process using chemical stripper.

. Developed several etching processes for different metals using wet

chemistry.

. Troubleshoot problems (e.g., photolithography, wet chemistry and

processing issues) of integrated circuit (IC) production in the fab.

. Other responsibilities include photolithography, wet chemical processing

and integrated circuit fabrication processes.

Kopin Corporation, Westborough, MA

1995 - 1997

Senior LCD Process Engineer

Directed manufacturing of high resolution Active Matrix Liquid Crystal

Display [AMLCD]. Responsibilities also include R&D, Process Development,

Failure Analysis and Trouble Shooting of AMLCD manufacturing process.

Specific achievements are as follows:

. Improved AMLCD productivity through new design of spacer dispensing

equipment.

. Identifying the course of defects through thorough failure analysis.

. AMLCD process optimization & Production of AMLCD.

Other Previous Employments

Aspen System, Inc., Marlborough, MA

1994 - 1995

Senior R&D Scientist

. Process Development of Thin Metal Film Deposition

Shipley Company, Marlborough, MA

1984 - 1994

R & D Engineer

. Photolithography

. Electro-Plating & Electroless-Plating.

R.E. Dietz Company, Syracuse, NY

1984

Senior Process Engineer

. Responsible for plating plant.

Education

. B.Eng. (Chemical Engineering), Chulalongkorn University, Bangkok,

Thailand.

. M.S. (Chemistry), Virginia State University, Petersburg, Virginia

. Ph.D. (Civil/Environmental Engineering), Syracuse University,

Syracuse, New York

Member: American Chemical Society

American Electroplating Society and Finishing Society

Former member of publication board: Plating and Surface

Finishing

Served as Peer Reviewer in Following Professional Journals:

. Journal of Environmental Science and Technology.

. Journal of Electrochemical Society

. IEEE Transactions on Components, Hybrids & Manufacturing Technology

(IEEE Trans. CHMT).

. Canadian Journal of Chemical Engineering (CJChE)

Honors:

. Studied as an Exchange Student in the USA Under the Auspices of

American Field Service International Scholarships (AFS).

. Served as an Honorary Guest Lecturer at Department of Environmental

Engineering, Khon Kaen University, Khon Kaen, Thailand, July 26, 2006.

. Received DFT Award for Best Poster at M/A-COM's 2007 Engineering

Conference.

Publications

1) Letterman, R.D., Vanderbrook, F.C., and Sricharoenchaikit, P.,

"Significant of Electrophoretic Mobility Measurements in Coagulation with

Aluminum Salt", J. American Water Work Association, 74:1:44 (Jan. 1982).

2) Letterman, R.D., and Sricharoenchaikit, P., "Interaction of Hydrolyzable

Metal and Cationic Polyelectrolyte Coagulants", Proc. Annual Conference of

American Water Works Association, St. Louise, June 1982, also in J.

Environmental Engineering Division, ASCE, 108:EE5:883 (Oct. 1982).

3) Sricharoenchaikit, P., and Letterman, R.D., "Effect of Al (III) and

Sulfate Ion on Flocculation Kinetics", J. The Environmental Engineering

Division, ASCE, 113:5:1120 (Oct. 1987).

4) Sricharoenchaikit, P., "Ion Exchange Treatment for Electroless Copper-

EDTA Rinse Waste", Plating and Surface Finishing, 76, (12), 68 (Dec. 1989).

5) Calabrese, G.S. Abali, L.N. and Sricharoenchaikit, P., "Micrometallized

Photoresist for Semiconductor Lithography", Shipley Poster Session, SPIE.

San Jose, CA, March 4-9, 1990.

6) Abali, L.N., Bobbio, S.M., Bohland, J.F., Calabrese, G.S., Gulla, M.,

Pavelchek, E.K., and Sricharoenchaikit, P., "Metallized Photoresist, A New

Approach to Surface Imaging", Proc. Microcircuit Engineering, International

Conference on Microlithography, Leuven, Belgium, Sept. 18-20, 1990, also in

Microelectronic Engineering, vol. 13, 93 (1991).

7) Calabrese, G.S. Abali, L.N., Bohland, J.F.,Pavelchek, E.K.,

Sricharoenchaikit, P.,Vizary, G.,Bobbio, S.M., and Smith, P., "Novel

Surface Imaging Masking Technique for High Aspect Ratio Dry Etching

Application", Proc. SPIE, vol. 1466, 528, Advanced in Resist Technology and

Processing VIII, San Jose, CA, March 4-5, 1991.

8) Calvert, J.M., Dulcey, C.S. Peckerar, M.C., Schnur, J.M., Georger, J.H.,

Calabrese, G.S., and Sricharoenchaikit, P., "New Surface Imaging Techniques

for Sub-0.5 Micrometer Optical Lithography", Solid State Technology, 34

(10), 77 (Oct. 1991).

9) Sricharoenchaikit, P., "The Effect of Pre-etch Solvent Treatment on

Electroless Plating of Polycarbonate", Plating and Surface Finishing, 78

(11), 66 (Nov. 1991)

10) Sricharoenchaikit, P., "Waste Treatment for Electroplating Operation",

Proceeding of the 2nd. International Workshop on Advanced Science and

Technology Transfer to Thailand, 459-485, ISBN 974-7055-03-1, August 21-23,

1992.

11) Sricharoenchaikit, P., "Thin Metal Film Formation Using Electroless

Plating", J. Electrochemical Society, 140 (7), 1917 (July 1993).

12) Sricharoenchaikit, P., Dixon, T., Williams, A., and Chinoy, P.,

"Optimization of Gold Electro-Plating Process Using Design of Experiments",

M/A-COM's Eleventh Annual Engineering Conference, Oct 14-17, 1997, Hyannis,

Massachusetts.

13) Sricharoenchaikit, P., "Coagulation & Flocculation Processes",

Proceeding of the Workshop on Treatment of Color and COD Treatment in

Wastewater, Environmental Research Institute, Chulalongkorn University,

Thailand, May 24-28, 1999.

14) Sricharoenchaikit, P., "Effect of Current Density on Profile of Narrow

Metal Line Width Using Pulse Gold Electroplating", Plating and Surface

Finishing, 86, (10), 66 (Oct. 1999).

15) Sricharoenchaikit, P., and Stevens, R., "Effect of alcohol type and KOH

concentration on Orientation Dependent Etching", M/A-COM's 14th Annual

Engineering Conference, Oct 10-13, 2000, Mt. Snow, Vermont.

16) Sricharoenchaikit, P., "M/A-COM is Getting Ready for Advanced Packaging

Arena", M/A-COM's 16th Annual Engineering Conference, Oct 20-23, 2002,

Springfield, Massachusetts.

17) Sricharoenchaikit, P., "Building Solder Bumps on GaAs Flip Chip

Schottky Devices", International Conference on Compound Semiconductor

Manufacturing Technology, 2003 GaAsMANTECH Conference, May 19-22, 2003,

Scottsdale, Arizona.

18) Sricharoenchaikit, P., "Modeling of Electroless Plating Mechanism",

2003 M/A-COM's Annual Engineering Conference, Oct 20-23, 2003, Portland,

Maine.

19) Sricharoenchaikit, P., "Cost Saving for Resist Removal Using Chemical &

Dry Etch", 2005 M/A-COM's Annual Engineering Conference, April 10-13, 2005,

Taunton, Massachusetts.

20) Sricharoenchaikit, P., "Electronics Materials and Waste Management",

International Conference on Hazardous Waste Management for a Sustainable

Future, January 10-12, 2006, Bangkok, Thailand.

21) Sricharoenchaikit, P., "Simple and Inexpensive Solder Bump Process for

AlGaAs PIN Diodes", 2006 M/A-COM's Annual Engineering Conference, April 9-

12, 2006, Taunton, Massachusetts.

22) Sricharoenchaikit, P., "Situation, Direction and Management of

Electronic Wastes", Electronic Waste Conference, July 24-25, 2006, King

Mongkut's Institute of Technology Ladkrabang, Bangkok, Thailand.

23) Sricharoenchaikit, P., "WEEE, RoHS, REACH and M/A-COM", 2007 M/A-COM's

Annual Engineering Conference, April 29-May 2, 2007, Mount Washington

Resort, New Hampshire. Note: I received The DFT's Award for Best Poster

Session.

24) Sricharoenchaikit, P., "Elimination of Pyramid Formation in Orientation

Dependent Etching (ODE)", 2008 M/A-COM's Annual Engineering Conference,

April 27-30, 2008, Mount Washington Resort at Bretton Woods, New

Hampshire.

Patents

Gulla, M., and Sricharoenchaikit, P., "Plasma Processing with Metal Mask

Integration",

a) European Patent Application, Publication No. 0397 988 A2 (Nov.

22,

1990)

b) U.S. Patent No. 5,053,318 (Oct. 1, 1991)

c) Taiwan Patent Office, Patent No. 051187 (Jan. 14, 1992)

Gulla, M., and Sricharoenchaikit, P., "Novel Metal Accelerator",

a) European Patent Application No. 0 456 982 A1 (Nov. 21, 1991)

b) U.S. Patent No. 5,213,841 (May 25, 1993)

Gulla, M., and Sricharoenchaikit, P., "Selective Metallization Process",

a) European Patent Application, Publication No. 91114755.1 (Sept.

2, 1991)

b) U.S. Patent No. 5.158,860 (Oct. 27, 1992)

Sricharoenchaikit, P., Calabrese, G.S., and Gulla, M., "Controlled

Electroless Plating",

a) European Patent Application, Publication No. 0 525282 A2 (Feb.

18,

1992)

b) U.S. Patent No. 5,203,911 (Apr. 20, 1993)

Gulla, M., and Sricharoenchaikit, P., "Plasma Processing with Metal Mask

Integration",

a) U.S. Patent No. 5,213,917 (May 25, 1993)

Sricharoenchaikit, P., "System and Method for Solder Bump Plating", U.S.

Patent Application Publication: Publication No. US2008/0116077 A1 (May 22,

2008).

Sricharoenchaikit, P., "Procedure for a Reduction of Number of Voids in

Solder Bumps" submitted for approval at M/A-COM Technology Solutions,

Lowell, MA, March 2009, for a patent application.

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