Manager Maintenance

David J. Olson

Email: abm1mf@r.postjobfree.com

Phone: 817-***-****

Arlington, TX

Summary of Skills

Thirty years experience in Semiconductor Fabrication, twenty two of which

were spent managing process engineering, fab equipment maintenance and

facilities maintenance employees. Vast experience in leading Total

Productive Manufacturing, systematic problem solving, continuous

improvement and waste (loss) elimination.

Work Experience

National Semiconductor, Arlington TX April 2007-Present

Sr. Facilities Support Manager

. Manage ten facilities maintenance technicians/operators and nine

hazardous production materials (HPM) technicians who specialize in

mechanical and control systems, DI (deionized) water production and

gas/chemical delivery systems to support wafer fab manufacturing.

. Set priorities daily for repairs and preventative maintenance and develop

and track individual and group goals to drive performance improvement.

. Led the implementation of new computerized maintenance management system

(CMMS) in facilities maintenance and HPM, resulting in increased

preventative maintenance completion rates, faster repair times and

improved tracking and documentation of equipment performance.

. Expanded and renewed 5S (workplace organization methodology) in

facilities and HPM areas to improve organization, safety and problem

identification.

. Coach and mentor employees and resolve employee issues when needed.

Write and deliver employee performance reviews and development plans

twice a year.

. Successfully led hiring and training efforts of four entry level

facilities technicians after a 60% voluntary head count reduction, with

no facility interruptions to manufacturing.

National Semiconductor, Arlington TX May 1998-March

2007

Sr. Manufacturing Engineering Manager (Six Sigma Black Belt)

. Led Site Total Productive Manufacturing (TPM) implementation. This

included facilitating Site TPM Steering Group (eight pillar owners and

plant manager), Autonomous Maintenance teams and implementation of the

Planned Maintenance Pillar and Environmental, Health and Safety (EHS)

Pillar.

. Led SCANDOS (5S + Safety) implementation to improved workplace

organization and elimination unsafe conditions, resulting in 66%

improvement in safety scorecard.

. Led Reliability Centered Maintenance (RCM) II Analysis implementation to

improve equipment operating performance and maintenance cost-

effectiveness.

. Led implementation teams to achieve ISO14001 and OHSAS18001

(Environmental, Health and Safety Management Systems) site

certifications.

. Led several Six Sigma project teams focusing on reducing equipment cost,

reducing quality incidents and improving maintenance technician

productivity.

David J. Olson, Page 2

Email: abm1mf@r.postjobfree.com

Phone: 817-***-****

Arlington, TX

National Semiconductor, Arlington TX August 1995-

January 1998

Sr. Equipment Support Manager

. Managed fab equipment maintenance group consisting of five maintenance

section managers and one hundred forty equipment technicians.

. Set department goals, reviewed and drove performance improvement.

. Initiated and led Quick Change Over/Single Minutes Exchange of Die

(SMED) projects, reducing consumable change times by 60%.

. Participated in Semitech TPM Steering Group and development of the

Planned Maintenance Pillar training materials.

. Developed and delivered TPM training with National Semiconductor UK

TPM promotions team. Assisted with pilots teams for Autonomous and

Planned Maintenance.

National Semiconductor, Arlington TX July 1988-August

1995

Process Engineering Section Manager

. Managed process engineers and technicians supporting production on

various processes, process improvements, Statistical Process Control

(SPC) control and yield improvement activities in Etch, Photo and

Interconnect.

. Improved Photo rework rate and SPC of clean inspect critical dimensions.

. Led major Photo chemical conversion project resulting with no impact to

production based on yield and rework.

. Facilitated systematic problem solving involving process engineering,

equipment engineering and maintenance to implement permanent solutions.

National Semiconductor, Arlington TX October 1985-July

1988

Sr. Process Engineer

. Etch area process engineer for wet and plasma oxide etch.

. Implemented wet/dry contact and via etch processes.

. Re-characterized all plasma oxide etches after conversion to graphite

cathodes.

. Implemented planar oxide etch process.

. Used design of experiments (DOE) to optimist various plasma oxide etches.

. Established SPC on plasma oxide etches.

Mostek, Carrolton TX November 1980-October

1985

Process Engineer

. Etch area process engineer supporting production and solving problems.

. Resolved plasma and wet etch processes problems.

. Ran split lots for process optimization and disposition of product

problems.

Education and Certifications

University of Minnesota, Minneapolis MN

1978

Bachelor of Science in Biology

Japan Institute of Plant Maintenance

1997

Certified Total Productive Maintenance Instructor

Aladon 2000

Certified Reliability Centered Maintenance II Facilitator

Thomas A. Little Consulting/National Semiconductor

2004

Certified Six Sigma Black Belt

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