Brian Bank, Certified Electroplater-Finisher (CEF)
Moorpark, CA 93021
PLATING EMPLOYMENT HISTORY:
*/** - *******: Hudson Plating Works' Lead Plating Technician
Moorpark, CA - Optimized pulse-pulse reverse plating for matte silver
microwave applications. Eliminated adhesion issues on solder joints.
Working with soft gold, hard gold, mid-phos electroless nickel and aluminum
substrates which do not have a nickel barrier.
7/08 - 12/09: MRC Optics' Plating Manager
Sarasota, FL - Supervising three Plating Technicians while optimizing
electroless nickel plating onto aluminum, beryllium, Albemet and stainless
steel. Re-work was reduced from 20% to 5%. Reduced rinse water waste by
five and eliminated deionized water use and its rental cost.
Comfortably worked 55 hours per week.
2/07 - 4/08: Siegel-Robert Automotive's Lab Manager
Farmington, MO - Supervised four Lab Technicians while helping to optimize
the plating on plastic processes to reduce scrap by 50% - a $3,000,000 per
year savings. Improved the newer processes of Satin Nickel and Smoke
Trivalent Chrome.
9/06 - 2/07: Dixline Corporation's Plating Manager
Galva, IL - Supervised and directly involved in plating and waste
treatment. Reduced plating scrap five-fold. Made progress developing three
new processes. Followed waste rules and regulations, including the required
year 2006 report. Class K licensed. Conventional waste treatment utilized.
6/93 - 9/06: Federal-Mogul Corporation
Burlington, IA (Champion Spark Plugs' Plating Manager) - As the only
Plating Chemist for millions of parts per year, I supervised and led three
shifts of union Platers and Suppliers. Every part was plated but with only
one nickel line and one zinc line to succeed. The fume scrubbers and waste
treatment were tied to the plating lines. Therefore, if any part of the
process failed, production would also, so some active involvement by myself
was needed to improve. After my arrival, problems were controlled, reduced
or eliminated in all areas, with causation determined. Micro-filtration
waste treatment utilized.
Ann Arbor, MI - As the only Process Technologist, my responsibilities
evolved to many departments, as needed:
! Initially, R & D of functional, lead-free deposits on lead-free
substrates. Then...
! Atomizing experimental, lead-free powder to specification. Fixed porosity
issue.
! Trouble-shooting and auditing the plating lines in our national and
international plants.
! Metallurgical analyzing via SEM-EDS, XRF, corrosion testing,
compatibility testing, and cross-sectioning.
! Providing ideas for management approval.
! Writing reports detailing my work.
! Three patents awarded:
http://www.patentgenius.com/inventedby/BankBrianLHartlandMI.html
6/89 - 6/93: Witco Corp., Allied-Kelite Division (now MacDermid Corp.)
New Hudson, MI - As a Customer Service Plating Lab Chemist, I was required
to:
! Have an extensive knowledge of all of the company's products and
recommended process cycles.
! Work directly with the customer in answering questions, analyzing
their solutions, and trouble-shooting problem baths.
! Provide computerized reports detailing my work and recommendations.
10/88 - 5/89: Howard Plating Industries
Madison Heights, MI - As a Pilot Plating Lab Technician, I helped to
develop small-scale plating process cycles, which were effectively used
throughout the manufacturing plant. One system that I helped to test was a
Japanese zinc-nickel bath, a forerunner of technology.
12/86- 8/87: S.K. Williams Company
Wauwautosa, WI - As a Plating Lab Technician, my responsibilities included
ensuring that bath chemistries throughout the plant were kept at their
recommended levels. The plant's diversity and large size gave me an
opportunity to work with essentially all solution types. Left for another
year of college.
ADDITIONAL EDUCATION:
B.A. Chemistry Michigan State University
East Lansing, Michigan, 1991, 3.5 G.P.A.
Certified Electroplater-Finisher (CEF)
Class K Wastewater Treatment License, 99% score
REFERENCES:
Furnished upon request.