Engineer Engineering

Daniel N. Donahoe

**** **** ******* **.

North Salt Lake, UT 84054

801-***-**** (cell)

801-***-**** (home)

**********@***.***

SUMMARY:

I offer a uniquely defined career with skills built on experience in the

electronics industry featuring broad functional experience in analysis,

design and management; employment history includes firms involved in

different aspects of electronics. My unifying career threads are

integration (tolerance analysis, thermal-fluid analysis, shock and

vibration analysis, system and product design, component selection,

specifications, configuration management), intellectual property review

and reliability engineering (such as accelerated testing, HALT testing,

FMEA, block diagrams, fishbone diagrams, root cause analysis, failure

analysis, spectroscopy, MTBF calculations, quality control charts, and

supplier factory audits).

PROFESSIONAL EXPERIENCE:

1000 kilometers , North Salt Lake, UT 4/09- present

Engineering and scientific consulting

Owner (CEO) - A general engineering practice with specific focus on the

western region defined by a radius of 1000 kilometers from Salt Lake City.

This region includes cites including Denver, Las Vegas, Phoenix, Portland,

San Francisco, San Jose (and Silicon Valley).

Exponent Failure Analysis Associates, Menlo Park, CA 5/05-

3/09

Exponent is a leading engineering and scientific consulting firm.

Managing Engineer- Working to build a practice supporting the broad

electronics industry through personal promotion, leadership, technical work

and communications. This work begins by finding and establishing new

clients or supporting existing clients. Failure analysis techniques include

standard laboratory methods such as optical microscopy, lab bench-top

testing and accelerated testing but also include acoustic microscopy,

SEM/EDS, XPS, FTIR. The work includes communication through numerical

analysis and written and verbal means including formal reports,

teleconferences, presentations and one-on-one discussions.

University of Maryland, College Park, MD 8/02-

1/05

CALCE, Electronic Products and Systems Center

Assistant Research Scientist- Serving technical needs of industrial member

companies in a university research setting. The main projects involved

ceramics, aspects of electronics industry economics, scanning electron

microscopy and other failure analysis techniques. Served as an instructor

for a graduate course on sensors.

Iomega Corporation, Roy, UT 8/00-1/02

Iomega is the leading producer of removable storage.

Chief Technologist- Leading new technologies, providing interface between

Management in Iomega and key new suppliers. Position focuses on work with

Marketing on new product development and innovative applications of

existing products.

Compaq Computer Corporation, Houston, TX 9/90-

6/00

Compaq is the leading manufacturer of Personal Computers.

Principal Member of the Technical Staff- Promoted to Senior Member 12/96

and to

Principal Member 10/99 from manager of reliability. This technical

leadership position provides design and

reliability support across the entire Compaq product line to remedy

potential or actual failures of products by determining the true root cause

(the Physics of Failure Approach). Review of design often leads to the

personal contribution of innovative design concepts.

. Achieved Compaq's "Customer Advocate Award" in March of 2000 for work on

improving engineering processes across all Divisions.

. Lead a team to change the PCMCIA Card Standard for thermal rating and

worked to change UL1950

Teledyne, CME, Santa Clara, CA 5/89-9/90

Teledyne, CME built military electronic countermeasures equipment.

Mechanical Engineering Section Manager - Responsible for Mechanical Design

and

Analysis of CME's electronic products. Project Management of the design

process

included proposal activity, analysis, documentation and troubleshooting.

Ford Aerospace Corporation, San Jose, CA 2/88-

5/89

Ford Aerospace built a wide variety of military and commercial

communications electronics.

Engineering Specialist - Design Engineer for electronic Ground Equipment

Systems.

. Performed worldwide facilities tour for thermal, structural, facilities

and electrical upgrades and served as cognitive engineer on thermal

design for building scale and rack scale design.

Motorola, GEG, Scottsdale, AZ 7/83-2/88

Motorola, GEG built a wide of military electronics with emphasis on leading

edge

high technology applications.

Sr. Staff Engineer - Served as Design Engineer, Assistant Project Leader

and Systems Engineer on a wide variety of rugged electronics systems.

. Worked on challenging very "high g" packaging in artillery fuzes.

Lockheed, Missiles and Space Corporation, Sunnyvale, CA 3/79-

7/83

LMSC built a variety of military and commercial products including the

Polaris Missile and the Hubble Space Telescope.

Sr. Engineer - Thermal Analyst for Life Support Systems and spacecraft

thermal control.

University of Illinois, Urbana, IL 6/77-

3/79

Graduate Assistant - Researcher on campus energy conservation project and

Teaching Assistant.

. Experience with computer operating systems, source code, system

simulation applications, thermal modeling and statistical analysis

PART TIME EXPERIENCE:

Instructor, Scottsdale and Glendale Community Colleges in Statistics and

Electronics. 9/85-12/87

. My "Toastmasters experience"

EDUCATION:

B.S., 1977, General Engineering, University of Illinois at Urbana.

M.S., 1979, Mechanical Engineering, University of Illinois at Urbana.

M.B.A., 1983, Business Administration, Santa Clara University.

Ph.D., 2005, Mechanical Engineering, University of Maryland, College Park.

PROFESSIONAL STATUS:

Registered Professional Engineer (P.E.) in Arizona, California and Utah

Certified Reliability Engineer (CRE) by the American Society for Quality

(ASQ)

PERSONAL INFORMATION:

Member, American Mensa

PROFESSIONAL MEMBERSHIPS and ACTIVITIES:

. Senior Member, Institute for Electrical and Electronics Engineers;

. Chairman, Santa Clara Valley CPMT Chapter 2007-2008, Granted "2008

CPMT Chapter of the Year" award, Vice Chair 2009, Secretary, Santa

Clara Valley CPMT Chapter 2006;

. Associate Editor, IEEE Transactions on Components, Packaging, and

Manufacturing Technology (CPMT) since February 1998,

. Member-at-Large, IEEE CPMT Board of Governors, 2010-2012.

. Member of the IEEE Nanotechnology Council Executive Committee 2008-

2009,

. Member of Consultants Network of Silicon Valley 2009

. Director of the Silicon Valley Engineering Council (SVEC) 2008-2009,

. 2008 and 2009 Engineers Banquet Committee;

. Chief Editor SVEC 2009 Journal, http://www.svec.org, Feb. 2009

. Member, Materials Research Society (MRS)

. Member, American Society of Mechanical Engineers (ASME),

. Session Chair 2007 Interpack

. Member, American Society of Heating, Refrigerating and Air

Conditioning Engineers (ASHRAE)

. Member, International Microelectronics and Packaging Society (IMAPS)

. Senior Member, American Society for Quality (ASQ)

. Member, Utah Technology Council (UTC) 2009-2010

PUBLICATIONS:

"Dynamics for Electronics Reliability", Chapter 4 in Suhir, E. [Ed],

"Basics of Electronics Reliability", Springer, 2010 (in press).

"Ceramics in Modern Electronics" (with Poliskie, G.), Advancing

Microelectronics, Vol. 37, No. 2, March/April 2010, pp. 6-8.

"Plastics in Electronics" (with Poliskie, G.), Silicon Valley Engineering

Council Journal, Vol. 2, http://www.svec.org, February 2010, pp. 22-31.

"Thermal Aspects of LED Automotive Headlamps", IEEE Vehicle Power and

Propulsion Conference, 7-11 Sept 2009, Dearborn, MI, pp. 1193-1199.

"The Chemistry of Halogen Free Electronics" (with Poliskie, G.), Advancing

Microelectronics, Vol. 36, No. 4, July/August, 2009, pp. 22-24.

"Silicon Valley Engineering Council Journal", Volume 1,

http://www.svec.org, February 2009 (Editor).

"Contributions of the University of Illinois to Silicon Valley",

Engineering at Illinois, http://engineering.illinois.edu, January 2009.

"Electronics Reliability, More than Temperature". Continuity, Newsletter

of the Electronics and Communication Division, ASQ, Winter 2008, January

2009, pp.5-7.

"Accelerated Life Testing" (with Zhao, K., Murray, S., Ray, R.), Wiley

Encyclopedia of Quantitative Risk Assessment, 2008.

"Engineers Week: How Things Have Changed Since 1952." Utah Engineers

Council Journal, pp. 30-35, February 2007.

"Moisture Induced Degradation of Multilayer Ceramic Capacitors," Journal of

Microelectronics Reliability, Vol. 46, Issues 2-4, pp. 400-408, February-

April 2006 (with M. Pecht, I. Lloyd and S. Ganesan).

"New Aging Mechanism in Multilayer Ceramic Capacitors," Advanced Packaging

Magazine, June 2005 (with M. Pecht).

"Moisture in Multilayer Ceramic Capacitors," Ph.D. Thesis, University of

Maryland at College Park, January 2005. (Note: Dissertation has been

downloaded from the university library over 2500 times.)

"The Transition of Electronics to China," Chapter 13 in China's Electronic

Industry, M. Pecht, and Y. Chan (eds.), CALCE Press, pp. 261-275, College

Park, MD, 2004.

"Determination of the Life Cycle Environment," Chapter 12 in Parts

Selection and Management, M. Pecht (ed.), Wiley-Interscience, pp. 145-170,

Hoboken, NJ, 2004 (with N. Vijayaragavan and M. Pecht).

"Are U.S. Jobs Moving to China?" IEEE CPT, pp. 682-686, September 2003

(with M. Pecht).

"Failures in Base Metal Electrode (BME) Capacitors," 23rd Annual CARTS

Proceedings, pp. 129-133, April 2, 2003 (with C. Hillman and M. Pecht).

"China's Electronic Manufacturing Services," Chapter 6 in China's

Electronic Industry, M. Pecht and Y. Chan (eds.), CALCE Press, College

Park, MD, pp. 261-275, 2003 (with J. Wu, Q. Haiyu, and D. Donahoe).

"Reliability and Assessment of Electronic Systems and Equipment," IEEE CPT,

pp. 127-128, March 1999 (with J. Cartwright and M. Jackson).

"Bedrock of Electronics," Mechanical Engineer, pp. 62-63, November. 1986.

"CERDIPS as Gun Rugged Artillery Fuze Components," ASME Winter Annual

Meeting, December 1984 (with A. Meyer and K. Hanson).

"A Computer Model of a Campus Building," M.S. Thesis, University of

Illinois at Urbana-Champaign, May 1979.

"Energy Survey-Reduction of Energy Consumption," B.S. Thesis, University of

Illinois at Urbana-Champaign, May 1977 (with G. Bloomberg, S. Mair, and D.

Nelson).

PRESENTATIONS:

"Technology Showdown", Utah ASHRAE Annual Sustainability Conference, Salt

Lake, UT, 7 May 2010.

"Economics of Technology and the Engineering Career," Joint Meeting of IEEE

GOLD and the University of Utah IEEE Student Branch, Salt Lake, UT, 29

October 2009.

"Thermal Aspects of LED Automotive Headlamps", IEEE Vehicle Power and

Propulsion Conference, Dearborn, MI, 11 Sept 2009.

"LED Automotive Headlights", IEEE Utah Section, Salt Lake, 12 August, 2009.

"Halogen Free Electronics (with G. Poliskie)," IEEE CPMT and PSES Santa

Clara Valley Chapters, Sunnyvale, CA, 14 December 2008.

"Contributions of the University of Illinois to Silicon Valley," Technology

Entrepreneur Center, Champaign, IL, 14 November 2008.

"Heat Transfer Applied to Electronics Design," Refrigeration and Air

Conditioning Center, Champaign, IL, 14 November 2008.

"The rocky marriage of technology and quality, how technological maturity

drives quality both up and down," ASQ Golden Gate Section, Jack London

Square, February 19, 2008 and San Jose State University 21 April 2008.

"CPMT Santa Clara Valley 2007 Report," IEEE/Santa Clara Valley Section

Executive Committee, 5 September 2007.

"Running a Successful Chapter," IEEE/Santa Clara Valley Section 2007

Officer Chapter Training, 20 January 2007.

"Economics of Technology and the Engineering Career," San Jose State

University, 26 April 2006 (panel discussion).

"RoHS: 1 of 6, Eutectic tin-lead solder is one of 6 prohibited substances,"

ASME/Santa Clara Valley Chapter, Menlo Park, CA, 20 April 2006 (with A.

Fasching-James).

"Economics of Technology and the Engineering Career," Joint Meeting of the

IEEE CPMT and GOLD Chapters, Sunnyvale, CA, 12 April 2006 (with G.

Poliskie).

"Drift in Multilayer Ceramic Capacitors," IEEE CPMT Santa Clara Valley

Chapter, Sunnyvale, CA, Feb. 2006.

"Connect with and Strengthen Your Supply Chain," NEMI Sensor Technology

Working Group, Herndon, VA, June 23, 2004 (with S. Ganesan and M. Pecht).

"Risks to Off-Shoring Strategic Electronic Parts," IMAPS, Baltimore, March

28, 2004 (with M. Pecht).

"Fighting the War in the Airwaves," IMAPS, Baltimore, MD, March 12-14, 2003

(with O. Ramahi and M. Pecht).

"Finance, Physics and Capacitors," IPC Chesapeake Chapter, College Park,

MD, January 2003.

"MEMS Roadmapping," ASME IMECE, New York, NY, November 2001.

"Electronics Packaging," IEEE Utah Section Meeting, Roy, UT, June 2001.

Presentation at ASME (IMECE) on MEMS Roadmapping, New York, NY, November

2001.

Compaq Seminar Series, Houston, TX and College Station, TX, 2000.

Houston Hispanic Career and Education Forum, George R. Brown Convention

Center, Houston, TX, January 2000.

ASME IMCE, Presentation on Engineering Education, Nashville, TN, November

1999.

PATENTS and TRADEMARKS:

"1000 kilometers", Service Mark, Registration Number 3747747, February 9,

2010.

"Method to Sort Capacitors by Electrode Type," U.S. Provisional Patent

Application No. 60/557,590, March 20, 2004.

"Method, System and Apparatus for Indoor and Outdoor Track and Field Split

and Finish Times with Backup Features by Computer Vision," U.S. Provisional

Patent Application No. 60/378,321, May 8, 2002.

"Method, System and Apparatus for Competitive Swimming Split and Finish

Times with Backup Features by Computer Vision," U.S. Provisional Patent

Application No. 60/359,749, February 27, 2002.

"Apparatus for Liquid Cooling of Specific Computer Components," U.S. Patent

Application No. 200********, November 1, 2001.

"Apparatus for Liquid Cooling of Specific Computer Components," U.S. Patent

No. 6496367, December 17, 2002.

"Apparatus for Liquid Cooling of Specific Computer Components," U.S. Patent

No. 6333849, December 25, 2001.

"Apparatus Including Heat Sink Structure for Removing Heat From a Printed

Circuit Board," U.S. Patent No. 5953211, September 14, 1999.

"Method and Apparatus for Transferring Heat from a PCMCIA Card," U.S.

Patent No. 5808869, September 15, 1998.

"PCMCIA Card Heat Removal Apparatus and Methods," U.S. Patent No. 5793609,

August 11, 1998.

"Liquid Cooled Computer Apparatus and Associated Methods," U.S. Patent No.

5757615, May 26, 1998.

"PCMCIA Card Heat Removal Apparatus and Methods," U.S. Patent No. 5475563,

December 12, 1995.

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