Quality Control Design

Objective:

To pursue a career in electronics manufacturing industry where my skills,

expertise and knowledge would be utilized

Education:

Doctor of Philosophy in Industrial and Systems Engineering, State

University of New York at Binghamton,

Expected Date of Graduation: August 2010 (GPA: 3.7/4.0)

Dissertation Title: Resource and Production Planning - Post ERP

Implementation at an EMS Provider

Master of Science in Industrial Engineering, State University of New York

at Binghamton, USA, December 2007

(GPA: 3.67/4.0)

Thesis Title: Evaluating and Improving Pad Robustness under Lead-Free

Environment

Bachelor of Science in Mechanical Engineering, Xi'an Jiaotong University,

China, May 2005 (Aggregate: 82%)

Bachelor of Science in Business Management, Xi'an Jiaotong University,

China, May 2005 (Aggregate: 89%)

Skill Highlights:

. In depth knowledge of electronic materials properties, assembly

processes development, packaging and interconnect techniques,

metallurgy, thermal and mechanical stress analysis.

. In depth knowledge and experience ofwith Lead-free process development,

materials selections, and assembly design for manufacturing.

. Research, identify and document new PCB and advanced packaging

processing technologies. Provide technical leadership and coordination

for manufacturing in qualification and introduction of new assembly

technologies and equipments.

. In depth knowledge of Lean & Six Sigma, Kaizen, Statistical Process

Control (SPC), Design of Experiments (DOE) and other quality control

tools. Certificated by Lean and Six Sigma Black Belt at Sanmina-SCI,

2009.

Working Experience:

Senior Research Engineer

09/2007 - 09/2009

Sanmina-SCI, San Jose, CA

Graduate Research Intern

12/2005

- 08/2007

Area Array Consortium, Unovis Solutions, Binghamton, NY

Key Research Projects:

01005 Passives Assembly Process Development

. Developed and provided the mass production solution for assembly 01005

passive components, including assembly process development, stencil

design, PCB pad design and equipment selections.

. Company won a $ 180 million contract by showing the customer the

capability of assembly 01005 type passive components.

Wave Soldering Issues Aassociated with OSP Surface Finish

. Investigated both OSP coating properties (materials, thickness & micro-

etching levels) and board design factors (pin-to-hole ratios) impacts

on hole-fill penetration at wave.

. In order to avoid using Nitrogen, a tinning process was developed for

125 mils boards with OSP surface finish and adequate hole-fill was

achieved.

Pad Robustness Evaluation for Pad Cratering Issues

. Investigated and evaluated the impact of assembly process, design

factors (pad design, micro-via, BGA location), laminate materials on

pad robustness.

. Developed the evaluation standards for evaluating pad robustness via

pad strength and fatigue resistance measurements under various

mechanical loading conditions.

. Investigated long-term degradation mechanisms of laminate materials and

further investigated the adhesive & cohesive degradation mechanisms.

Joint Level Mechanical Test Standardization

. Investigated the effect of various test settings on single-destructive

pull test and cyclical-fatigue pull test.

. Investigated the correlation between board level mechanical tests (bend

& drop) and joint level tests by simulating corresponding loading

conditions and failure modes.

. Standardized joint level tests in terms of procedures and parameter

settings according to different loading conditions associated with

certain failure modes.

PCB Laminate Material Evaluation

. Tested and evaluated over 40 PCB laminate materials for lead-free

implementation.

. Developed a PCB material database that stores the information of

survivability for lead-free assembly, pad robustness and degradation

trend evaluation, material hydrophilic evaluation and warpage

measurement.

. Developed a 'quick' method to detect inner layer de-lamination of PCB

by using Shadow Moir to characterize the correlation of PCB warpage

behavior and the damage of laminate materials.

Guideline Document Writing

. Developed a Lead-free Assembly Guideline and Stencil Design Guideline

(Sanmina-SCI); Participated in updating a DFX guideline (Sanmina-SCI).

Quote Model for a Worldwide Application

. Lead a team to develop a Labor Quote Model and deployed globally for

electronic product manufacturing cost appraisal and design trade off

analysis.

Research on Photovoltaic (PV) Cell/ Module Production

. Conducted research on photovoltaic products including solar cells based

on c-silicon and thin film techniques. Defined solar cell and module

assembly procedures including equipment selections and line automation

for high throughput. Developed and implemented a method to measure PV

efficiency.

Other Assembly Process Related Projects

. LGA/QFN voiding issues

. Impacts of reflow cooling rate on second-level joint reliability

. "Head-in-Pillow" issue

. Out-gassing capacitor induced BGA bridging issue

Related Courses:

Advanced Electronic Packaging Design of Experiments (DOE)

Process For Electronic Manufacturing Probability and Statistics

Quality Control

MEMS Packaging Multivariate Date Analysis

Mechanics of Materials Modeling and Simulation

Science of Manufacturing Supply Chain Management

Production Management and Control

Computer Skills:

. Statistical Related: SAS 9.1, MiniTab 15, SPSS.

. Others: Microsoft Office, Arena Simulation10.0, Origin, ANSYS 10.0.,

Professional Societies:

Surface Mount Technology Association (SMTA)

Alpha Phi Mu - Industrial Engineering Honor Society

Reference: Available upon request

Publications:

1. Li, J., Tsai, J., Srihari, K., and Abtew, M., "Improving hole-fill in Pb-

free soldering of thick printed circuit board with OSP finish", SMTA

International Conference, Orlando, FL, 2008

2. Li, J., Srihari, K., and Abtew, M., "Design and process development for

the assembly of 01005 passive components", SMTA International Conference,

San Diego, CA, 2009

3. Li, J., Srihari, K., and Abtew, M., and "Reliability assessment of re-

balled BGAs", SMTA International Conference, San Diego, CA, 2009

4. Roggeman, B., Li, J., Borgesen, P., and Srihari, K., "Assessment of PCB

Pad Cratering Resistance by Joint Level Testing", Electronic Components

and Technology Conference (ECTC), Lake Buena Vista, Florida, 2008

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