Engineer Manufacturing

Gary A. Corbin

** **** ********* ****

Carmel, IN 46032

317-***-**** or cell 802-***-****

***********@***.***

SUMMARY:

An experienced Senior Manufacturing Engineer with extensive expertise in

manufacturing development and product line support. An highly motivated

team player with proven excellence in problem solving skills and meeting

goals. Extensive experience in the development, implementation, and

qualifications of multiple production lines in both the US and overseas.

Hands-on engineer that enjoys an challenge with both an electrical and

mechanical background. Well respected and consistently recognized for

superior performance and exceptional work ethic.

TECHNOLOGY:

. Problem-solved product design challenges and assembly equipment

problems

. Implemented yield and product reliability improvements including

equipment uptime and efficiency

. Root cause analyses to resolve manufacturing problems and

eliminate reoccurrence

. Implemented and maintained Gold Wire Bonding process (.0007 inch

to .0025 inches diameter wire) including quality control and

equipment maintenance

. Developed and implemented semiconductor interconnects including

Gold Wire Bonding, Aluminum Wire Bonding, Flip Chip, and Tab

Bonding

. Implemented Lean Manufacturing principles, reduced set-up and

change over time

PROFESSIONAL EXPERIENCE:

ASK-intTag, Essex Junction, VT

MRTD Process Engineer (2009 - Present)

. Developing manufacturing processes and equipment to build MRTD

products (Machine Readable Travel Documents) RFID tags.

. Setting up and developing new materials, processes, identifying

critical processes and building qualification samples.

. Developing methods of reducing scrap, controlling quality, and

security of product.

Delphi Electronics and Safety Division, Kokomo, Indiana

Senior Manufacturing Engineer (1997 - 2009)

. Identified critical processes for building the car seat bladder

system. Developed critical assembly methods. Implemented,

evaluated, and documented the stress-relieving anneal process and

ordered equipment. This program is estimated to save over $1M per

month.

. Developed prototype equipment for evaluating processes and running

design of experiments (DOE)

. Developed a process monitor testing system to verify product

performance after annealing

. Developed methods for modifying and reusing existing bonding

equipment to increase production volume

. Improved quality and reliability of the pressure sensor by over

10% by implementing new suppliers, process changes, and equipment

improvements

. Assisted the Side-Impact Bag Sensor group in resolving product

validation problems

. Built the first 76GHz transceiver prototypes for the Advance

Electronic Packaging group and received a performance award for

the work, June 2006

. Received a performance award for being a member of the RF /

Microwave development team that built customer samples and won

future business, Sept. 2007

. Received a performance award for being a member of the team that

resolved Design and Manufacturing problems with the Side-Impact

Sensor and still met the SOP, January, 2003

Advanced Manufacturing Engineer (1994 - 1997)

. Developed plating, cleaning, die attach, wire bonding and

passivation process for chip on board (COB). Developed design

guidelines for the circuit board and the interconnect process for

both Aluminum and Gold Wire Bonding.

. Implemented a display module using the COB technology

. Worked with the wire bond manufacturing team on the development of

guidelines and best practices

Senior Manufacturing Engineer (1991 - 1994)

. Provided manufacturing support for the Up Integrated Electronic

Spark Control Module that included cost reduction, yield and

quality improvement

. Conducted PFMEA on a new product and adjusted equipment design to

assemble the Plug In Electronic Spark Control Module for

production (reliability rate of < 9 parts per million for the

first two years of production)

. Developed process specification, trained personnel, and made

incremental process and reliability improvements

Manufacturing Engineer (1986 - 1991)

. Developed assembly equipment and processes for GaAs chips for RF /

Microwave products

. Interfaced with multiple Hughes divisions to submit a

manufacturing proposal to the military for military aircraft radar

system

. Developed and manufactured prototypes of a back-up aid (Radar

System) for the automotive market

. Acquired and developed the outer lead bonding process for TAB

bonding

. Developed equipment to combine solder-die attach and tab bonding

for validating design concept

. Provided manufacturing support to install and debug the first high

volume flip chip machines and made yield and quality improvements

Process Engineer (1979 - 1986)

. Worked with the development and implication of high volume

assembly processes and equipment for new IC packages, by

interfacing between IC package design, prototype area, and

production area

. Developed alterative plating process for heat sinks to reduce

package cost

. On the Power Audio Module increased production volume, reduced

scrap and increased quality

. Trained and transferred the assembly process of the Power Audio

Module to Singapore and provided manufacturing support to

Singapore for three years

EDUCATION:

Bachelor of Science in Electrical Engineering, University of Missouri -

Rolla, Missouri

TRAINING:

. Design for Six Sigma . Quality Engineering I, II, III

. Problem Solving . Reliability Engineering

. Global Culture Training . Minitab - Statistical Quality

Analysis

. Preventive Error Proofing . Minitab - Basic Statistics

. Succeeding with Diversity . E - Chip Training

. PFMEA Process Training . Seminar in Wire Bonding

Reliability and Yield

. Lean / DMS / MSD Training . Seminar in Design of

Experiments (DOE)

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