Engineer Project

Jayprakash Chipalkatti

Email: abkcdx@r.postjobfree.com

Phone: 214-***-****

Objective: Seeking a challenging engineering position in a company

utilizing my experiences in thermal modeling, semiconductor package design

and development, material engineering and program management

Education:

1995- Master of Applied Science (M. A. Sc.) Metals and Materials

1999 Engineering, Univ. of British Columbia, Vancouver, BC, Canada.

Research and Teaching Assistant, Dept. of Metals and Materials

Engineering and Dept. of Civil and Mechanical Engineering.

1990- 94 Bachelor of Technology (B. Tech.), Metallurgical Engineering.,

Indian Institute of Technology, Mumbai, India

Strengths:

. Thermal and Stress Analysis of complex IC Packages including WBBGAs,

FCBGAs, Leaded Packages, QFNs, SIP, Package-on-package, Package-in-

package as well as Boards and System using commercial tools such as

FLOTHERM, ICEPACK, ANSYS.

. Semiconductor processing, assembly and packaging

. Project Management

. Exposure to assembly design rules of a wide variety of packages

(Leadframe and BGAs)

. Self Motivated, dedicated and hardworking professional

. Experience working in a medium size to large companies

Major accomplishments in Thermal Engineering:

. System level simulation of an entire wireless mobile device combined

with IR Camera and T/c Measurements to win business

. 3 pending patents in the field thermal performance of IC Packages

Work Experience:

Mar 2005- Present

Packaging Engineer, Analog Packaging, Texas Instruments Inc., Dallas, TX

Major Projects:

. Thermal Simulations for packages and customer systems using FLOTHERM

and ICEPAK

o Performing a large number of simulations to assess the effect of

FET locations, package design, system design for a wide variety

of packages including WB and FCBGAs, leaded packages, WCSP etc.

o Proposing package/die design changes to product groups using the

thermal analysis

o Some Board and System level Simulations for customer systems

using appropriate assumptions

o Create and maintain a database of thermal data (Theta JA, JB,

JC, JP, Psi JT, JB) to be used for datasheets

o Verification of thermal models using IR Camera and T/C

measurements

o Providing thermal training to Product groups and customers and

writing application notes

. BLR Temperature cycling and drop test models using ANSYS

o Plotting Principal, Shear Stress profiles of various interfaces

in packages

o Predicting life using Weibull plots

o Recommending package design features using these results

. Package Development of new leaded and BGA packages

o Running Assembly Rule Check on new LF or substrate designs

o Creating qual requirements based on BLR stress modeling results

o Working with sub-cons, assembly houses to on the schedule

o Review qual plans, reports, MQ data, perform FA

. Other:

o Proposing cost effective board routing solutions to customers

using APD

o Internal short Courses taken: SPC, DOE, FMEA, Time and Project

Management

Jan 2000- Feb 2005

IC Packaging Engineer, PMC-Sierra Inc., Burnaby BC, Canada

Major Projects:

Designed a procedure for generating thermal data (Theta JA, JC, JB, Psi

JB,JT) for PMC IC devices using FLOTHERM and validated the data

experimentally

Generated 2R Compact models which are a part of PMC device design document

Board and System Level thermal simulations of customer layouts as required

Reliability testing of IC devices

Prepared Qualification plans and reports for new package families

Managed Scheduling and resource allocation for all qualification projects

using MS Project

Interface between PMC and qual test houses to control and expedite qual

work

Reliability testing of Thermal Interface Materials

Fabricated an apparatus for high temperature ageing of interface materials

Evaluated a large number of materials for thermal degradation

Fabricated an apparatus to quantify flip chip lid breaking torque

Determined the nature of lid breaking torque, designed an apparatus to

quantify this torque and published a white paper as a customer guideline

Thermal Stress Analysis of Flip Chip Package.

Analyzed a simple flip chip assembly based on Timoshenko, Suhir and

Trimaterial model as an academic exercise

Investigation of Solder Creep as a function of Temperature and Stress

Performed an experiment to determine acceleration factors and predict

solder creep at given stress and temperature

Cost Model:

Suggesting the most cost effective solution utilizing foundry and assembly

house cost data

Other Responsibilities:

Working with assembly houses to ensure adherence to assembly process

specifications

Create and maintain a database for thermal models

Publish device/system specific white Papers

Train engineering and marketing members on thermal issues

Update package specification documents to include qualified material sets,

mechanical drawings, shipping containers etc.

Member of Internal consulting group to suggest effective packages for

devices under development

1995-1998 M. A. Sc. Research Project: Mathematical modeling of

Transformation Kinetics for AISI 4140 Steels

Mathematical modeling (Thermodynamic model and Kirkaldy transformation

kinetics Model) for AISI 4140 steel

GLEEBLE controlled thermal history tests

Modified Kirkaldy model gave satisfactory results

Direct Twin Roll Casting of Steel Strip: Investigated solidification

behavior of a steel strip quenched on directly on steel rolls

1994-1995 Special Steels Ltd, Tarapur, India.:

Trainee Engineer on product and process quality control EAF Steel making,

continuous casting and wire rod mill

Used SPC methods to analyze steel production data

Computer Skills:

Hardware: IBM- PC, SGI Machines

Software: FLOTHERM, ICEPAK, FLOPACK, FLOMOTION, ANSYS, MS Office, MS

Project, Sigma Plot, MATLAB, AUTOCAD, APD Package Desingner and PCB routing

tools

Operating System: DOS, Windows NT, Unix, Linux

Programming Language: C++, HTML

Other Interests:

. Table Tennis, Tennis, Badminton, Swimming, Hiking and Running

. Vice President of a Local cultural organization of ~100 members

. Member of Toastmasters International

. Volunteer for ASHA for education, Natural Science museum at Dallas,

Elementary school tutoring at Dallas school district

References will be furnished upon request

Contact this candidate