ROLANDO CALAPARAN LAGUA

** ********* *****, *** *********, TX 77382

Mobile #: 832-***-****

E-mail: abk5dp@r.postjobfree.com

CAREER OBJECTIVE

To be able to utilize my skills and knowledge and enhance it on a higher level.

PROFILE

Highly skilled Repair/Test Engineer with 8 years experience in testing, debugging, repairing and

troubleshooting different Printed Circuit Board (PCB) and Printed Circuit Board Assembly (PCBA) and

analyzed test results utilizing schematic circuit diagrams and assembly drawings and manufacturer’s

component documentation.

PROFESSIONAL EXPERIENCE

HTC Corporation

January 2002 to Present

• HTC America Inc., 5950 Corporate Drive, Houston, TX 77036

Production Department

October 2006 to Present

• HTC Headquarters, 23 Xing Hua Road, Taoyuan, Taiwan 330 ROC

Module Analysis and Repair Engineering Department

January 2002 to March 2006

Test/Lead Repair Engineer

• Responsible for the Yield improvement for New Product Introduction (NPI) products.

• Participates on New Product Development projects and collaborate with other departments

during the development process in ensuring the design for safety, quality, manufacturability,

and cost position.

• Responsible for identifying and resolving the root cause failure analysis of yield detractors

and reliability quality failures.

• Performed failure analysis, documenting fault analysis (FA) reports and corrective action.

• Responsible in yield improvements and scrap reductions.

• Developed, implemented and troubleshooting failed PCBA’s from Test Machines such as In-

Circuit Test (ICT) fixtures, Automated Test Equipment (ATE) fixtures, Functional Test (FT)

fixtures, RF Test fixtures and to different Test machines fixtures.

• Performed troubleshooting of PCBA’s at component level and related test equipments to

support production needs.

• Diagnosed faulty handheld devices and execute troubleshooting on line.

• Responsible for identifying failure trends and determine issues with components, vendors

and/or manufacturing processes and further analyzing or verifying possible bad components

to be returned to the vendors, and/or manufacturers.

• Responsible for specifying and qualifying RF components and system trouble-shooting and

testing.

• Responsible for creating Fault Tree Analysis (FTA) of error code and resolve its root cause,

provide engineering support by analyzing problems and implementing timely solutions to

maintain continuity of production flow.

• Performed self-devised supplemental fault analysis routines beyond the scope of automated

diagnostics to isolate failure to faulty component in unit under test.

• Utilized skills and knowledge in mobile communication to provide software implementation,

maintenance, and debugging.

• To research and formulate MB repair techniques and tools needed, lead team trainings and

provide technical assistance and trainings to newly hired engineers.

• Provided data collection on product faulty issues and timely feedback.

• Work with engineers in defining, testing and monitoring SMT process issue.

• Recommended employee to relocate in HTC America Inc. to support and improve the

production flow process of the Production Department including PCA/MB Repair

Engineering, Final Test and Quality Assurance Team.

SUMMARY OF QUALIFICATIONS

• Experienced in high soldering techniques.

• Ability to troubleshoot motherboards, PDA and Smartphone MB, board level to function to the

time it is assembled as a completed product unit.

• Trained and certified in soldering of Pb-free components and remounting of BGA’s in Pb-free

PCBAs.

• Advanced knowledge and experience in various testing machines such as In-Circuit Testing

(ICT), Auto Testing Equipment (ATE), boundary-scan test or Joint Test Action Group (JTAG),

Functional Test (FT) and using Boardview, Teradyne, Labview, Genrad, AEX Manager

platform including other Windows-based software for testing and trouble-shooting.

• Familiar with using System General T9600 (Universal Programming System) for programming

chip set such as ROM, NAND and COMBO Flash.

• With hands-on experienced with diagnostic test equipment including Oscilloscope, Power Supply,

Digital Multi-meter, Spectrum Analyzer, Agilent Test Equipment Wireless Communications Test

Set machine and other RF Calibration Equipments for testing and trouble-shooting.

• Familiar with using DAGE XD6500 X-ray Integrated Digital Acquisition Technology (XIDAT )

for 3D x-ray in BGA of PCB.

• Advanced knowledge in Electronics Circuit Analysis, RF Circuit Analysis, updated with latest

Mobile Technologies, and Electronic Circuit Trends.

• Extensive knowledge in recording, understanding, identifying and accurately interpret the

following: schematic diagrams, data books, drawings, parts list, bill of material (BOM),

failure reports, quality, acceptance test procedures and test results .

• Ability to work under pressure; quick learner; dedicated and willing to undergo training.

AWARDS

• Awards of Good Performance Employees (Year 2002, 2003, 2004 and 2005)

HTC Headquarters

23 Xinghua Rd., Taoyuan, Taiwan 330 R.O.C.

Signed By: C. S. Wang, Vice President, MFG Operation Center

• Awards of Top Performance Employees, Year 2008

HTC America Inc., Houston Service Center

Awarded By: Albert Liao, General Manager, Houston Service Center

EDUCATION

Bachelor of Science in Electronics and Communications Engineering

Eulogio Amang Rodriguez Institute of Science and Technology

Nagtahan, Sampaloc, Manila, Philippines

June 1996-March 2001

REFERENCE

(Available upon request)

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