Engineer Design

alberto toledo

**** ***** ***** ***** *********, nc 282**-***-*** 2066 abjsdm@r.postjobfree.com

summary

Sr. Electro Mech Designer, using well founded engineering principals. I offer a rich history in successfully

bringing "New Product Releases" into lean manufacturing environments. Have used parametric tools (ten

years Solidworks, and over two years ProE 3.0) while bridging electrical and mechanical designs using the

latest ECAD/MCAD (CircuitWorks, Mentor, HarnsessExpert) tools while in early product development.

Having been recruited by Raytheon early in my career, and climbing the ladder as Sr. Mechanical Designer

has helped me acquire a unique blend of skill sets that have been used in several World Class organizations.

I do not have my BSME, however have been given title and successfully been doing engineering for most of

the companies I have worked for (supplemented my skill sets with seminars in thermal, structural, and the

latest MCAD, and ECAD tools). Some accomplishments include Incorporating advanced packaging

techniques in the design of several R F power casting modules with unique clamshells for isolating

microwave, digital and analog compartments to pass; FCC, CE, NEBS, and IEC requirements. Working

very closely with Sr. Scientist used Solidworks in packaging several power sources (Semiconductor)

including hybrid circuit design for H Bridge power dies, using AlSic. Designed several Power Sources

enclosures used in different sectors of industry. Designed and fabricated three large Precision Sand Castings

used at Teradyne “Medusa” Test Head, which resulted in 45% cost savings by eliminating complex, and

expensive machined sub assy parts. Design and fabricated large Thermoformed front skins for large 19”

racks giving the appearance of Injection Molded parts at a fraction of the cost.

experience

April, 2010 to Aug 2010 Wave Lab Inc, Reston, VA

Contract E/M Packaging Designer Working directly with VP of Engineering, helped package unique

Indoor Transceiver Module in a 19” used in Microwave Radios. Used my E/M packaging skillets (EMI and

Thermal Management) in successfully producing C&F models using SW 2009, and building proto modules

including thermal mock ups used in higher volume castings. Worked closely with China Manufacturing for

transition in timely manner.

Sept, 2007 to Jan, 2010, ESAB Welding and Cutting Equipment, Florence, SC

Sr, Packaging Engineer Working in an aggressive quick response environment supported various

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Program Managers while enhancing existing, and launching new flag ship family of Plasma Cutters

while in various design stages within a wide family of plasma cutting products. Extensive use of

ProE Wild Fire 3.0, and started training designers using SW 2008. Worked very closely with

manufacturing using Kaisen, and concurrent engineering to manage schedules during all phases of

product development. Introduced using HarnessExpert for cabling and critical harnesses. Worked

closely with Manufacturing using Lean Manufacturing “Hokey Pokey”, especially in cabling, and

creating sub assembly modules, allowing uniform Hi Pot, and Ground Bond Testing while creating

robust rugged designs.

• Thermal management, RF/EMI challenges addressed while compliancy to UL, CE,

ANSI/IEC 60974 1. Alien Cross Talk Shielding. Ground Bond testing and HiPot Testing were

designed in.

• Worked very closely with manufacturing using Kaisen, and concurrent engineering to

manage schedules during all phases of product development. Responsible for design intent

integration to offshore Engineering and Manufacturing departments. I introduced 3Dvia

Composer (3D Authoring tool) for efficient creation of effective Manufacturing and Assembly

work instructions while using existing native CAD file (Solidworks, ProE, Inventor) or STEP

model. With 3D exploded views, annotations, callouts, and balloons while using dynamic 3D

graphics to simplify understanding of documents whether used here or offshore.

Oct, 2006 to Sept 2007, Networkengines, Canton, MA

Mechanical Design Engineer Interfaced with project managers in a very intense product

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development environment. Acted as Lead Designer (using SW 2007) working with directly with

several customers engineering departments in a diverse family of storage and security server

appliance products using my E/M packaging skills. Responsible for all Carton Packaging, and ISTA

shipping testing. Addressed thermal hot spot cooling issues, while reducing case temperatures 18

deg C.

• Designed various front Bezel and rear and covers to customer specifications.

Used Solidworks 2007 in developing solutions for thermal hot spot cooling, EMI, and compliancy

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issues with CE, and IEC.

2003 to 2006, SemEquip Inc. N. Billerica, MA

• Sr. Packaging Engineer Working with several Senior Scientist, helped develop Main Power Supply,

and sub systems used for Ion Sources used for applications in the semiconductor industry.

Responsible for PCB layout for analog, digital, power, and Opto 22 fiber optics interface for

Industrial Ethernet. Designed and fabricated 19" St Stl weldments shipped to Nissin Japan with a

very aggressive 6 month window from concept to delivery. Conceived conceptual design, customer

specific proto build of various small and large Power Sources, controls systems and Beta install for

Ion Implant Processing, and fabrication drawings using Solidworks 2005/2006, and PDM Works.

Design and fabrication of several core electronic modules, including prototype build vendor

expediting, and release into Manufacturing, including innovative thermal management of high

power sources. EMC compliancy was a challenge, with high packaging densities.

Conceived conceptual design for customer specific proto build of various small and large Power

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Sources, including controls system and Beta install for Ion Implant Processing.

Design and fabrication of several core electronic modules, including prototype build vendor

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expediting, and release into Manufacturing.

Innovative thermal designs (validated with thermal mock ups), EMC, and Compliancy issues were

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designed in while shortening the fabrication cycle.

2000 – 2002, MKS/ASTex, Wilmington, MA

• Mechanical Engineer Working with several scientists developed power supplies for igniting Plasma

Chambers. Specific accomplishments included. Design of several R F Power Casting Modules

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Unique clamshells for isolating R F, digital and analog compartments to pass Semi, FCC, TUV, and

UL requirements. Used Solidworks for all designs, including design and fabrication of fixtures for

Hybrid Wire Bonding, Hybrid Circuitry for H Bridge Power dies using patented AlSic Design. SW

CircuitWorks was used for all PCB modeling, and fabrication. Thermal evaluation was

accomplished using thermal mock ups to validate hand calculations. Re design of Ozone Filtration

system process by brazing St Stl and Titanium.

Design of several R F Power Casting Modules Unique clamshells for isolating R F, digital and

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analog compartments to pass Semi, FCC, TUV, and UL requirements. Used Solidworks for all

designs.

Mechanical Hybrid Circuit design for H Bridge Power Dies, using AlSic design (patent pending).

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Circuit Works. Including Wire Bond and Fixtures. Built thermal evaluation mock ups and

validation.

1997 2000, The Windows Connection Design Services, Foxborough, MA

Design Engineer Managed a small 3 person Contract House servicing several companies and Job

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Shops. Packaged E/M equipment within the Semiconductor, Industrial and Commercial sectors

Consultant work done for Raytheon, Axcelis, Network Engines. Redesign of several small product

lines from concept into cost effective manufacturability products including TUV, UL, and FCC

testing. Consulted for several companies in Boston area: Axcelis, Raytheon, Foxboro Company

1988–1997, Teradyne Inc. Boston, MA

Design Engineer Supported two Engineering Divisions in the development, manufacturing and maintenance

of several flagship Automated Test Systems for Intel, Motorola, and AMD. This included multi platform

"Medusa Test Head", large sand castings replacing machined parts (45% cost savings. Design and fabrication

of two small "Blind Mated, patented 8 G Hz, RF module, with semi rigid cabling, and flex circuits. All

designs complied with TUV, FCC, and UL 1244. Responsible for off shore design fabrication of sub

assemblies.

• Designed and fabricated three large sand castings for the Test Head, which resulted in 45% cost

savings by eliminating complex, and expensive machined sub assy parts. This evolved into multi

platform product lines.

Designed and fabrication of two small patented (8G Hz) RF precision sand casting modules, with

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semi rigid coax cables and flexible circuits. Including all intra and inter connection for 10 blind

mates connections.

Education

2010 Trimech, Charlotte, NC

• Solidworks 2010 Essential Training, Advanced Assemblies, Advanced Part Modeling

• Solidworks 2010 Simulation Flow (CFD), and Sheet Metal Glen Allen, VA

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2000 The CFA/CADD Center, Boston, MA

• Proficiency in AutoCAD R14 and 3D Studio MAX R2, and CAD Administration

Bridgeport Engineering Institute, Bridgeport, CT

• Mechanical Engineering evening courses in E/M Packaging, Relocated by Raytheon to Sudbury Ma. While

into my second year.

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