Mechanical Engineering

Kathy Wenjun Liu

Address: ***** ** ***** **. ********, OR 97229 Tel: (503) 616-

**** (home)

E-mail: abjqrj@r.postjobfree.com

503-***-**** (cell)

Objective

Seeking a challenging position that can use my expertise in mechanical

design, thermal management, FEA/CFD, as well as my project management

skills.

Skills and Summary of Qualifications

. Strong technical and project management background

. 10-year experience on product development

. Mechanical design and FEA analysis

. CFD and Fluid Mechanics (Blade, fluid machinery, etc)

. Identify novel thermal solutions and development/applying novel

electronics materials

. Ability to work independently/ team player

Education

Ph.D. in Mechanical Engineering (05/2005), Carnegie Mellon University,

Pittsburgh, PA

M.S. in Thermal Engineering (07/2000), Tsinghua University, Beijing, P.R.

China

B.S. in Thermal Engineering (07/1997), Tsinghua University, Beijing, P.R.

China

Research Experience

Senior Research Engineer (08/2007 -present)

Intel labs, Intel Cooperation, Hillsboro OR

I have demonstrated repeated success at innovation, project management, and

working with cross-functional teams to successful execution of the design,

prototyping, testing and developing simulation tools of complex platforms

at component- and system- level. My responsibility includes (a) identify

and develop novel technologies to support thermal/mechanical design and

solve heat-related issues for thermally constrained devices/platforms and

long-term research agendas; and (b) collaborate with internal groups,

universities, and external companies on developing innovative cooling

technologies to differentiate Intel's platforms.

. Lead thermal/mechanical analysis of handheld electronics project with

novel cooling technique (e.g., phase change and thermo-electric

devices).

. Novel thermal interface material characterization and modeling for

microelectronic packaging.

. Developed FEA/CFD models at system- and package- level for servers.

. Performed thermal and fluid/ structure analysis of electronics component

and systems with novel air movers.

. Joint path finding with business group and product development on energy

harvesting for next generation mobile electronics.

. Managed university projects for new research directions.

. Supervised junior engineers and interns.

Assistant Professor (08/2005 - 07/2007)

Dept. of Aerospace and Mechanical Engineering, University of Notre Dame, IN

Director of the small scale heat transfer Lab. Research centers on small

scale heat transfer in semiconductor and data storage devices, as well as

thermal management of microelectronics and MEMS chips.

. Thermal/electrical characterization and modeling of small scale

semiconductor and data storage materials, such as thin film silicon,

metal, novel thermoelectric materials, phase change materials for data

storage, and other nano-materials.

. Simulation of thermal-aware scheduling and assignment for real-time

applications on multi-processor systems-on-chip.

. Thermal transport phenomena associated with lab-on-a-chip and biomedical

systems, especially using nanofluids for cooling and lubrication

applications.

. Performed FEA/CFD analysis for thermal/mechanical design of MEMS chips.

Research Assistant (09/2001 - 05/2005)

Dept. of Mechanical Engineering, Carnegie Mellon University, PA

. Contributed to the understanding of thermal transport in thin silicon

layers by measuring the thermal conductivity of pure and doped single

crystalline silicon thin films.

. Modeled the reduction of thermal conductivity in ultra-thin single

crystal silicon layers due to phonon-boundary and phonon-impurity

scattering.

. Optimized the magnetic head design in hard disk drive using FEA/CFD

analysis.

. Proposed a novel analytical model to predict the self-heating and

electrostatic discharge (ESD) damage of SiGe and SOI transistors, and

further verified the result with commercial software.

. Predicted thermal transport properties of thin metallic and

semiconductor films using Boltzmann Transport Equations (BTE).

Research Assistant (09/1997 - 07/2000)

Dept. of Thermal Engineering, Tsinghua University, P. R. China

. CFD/FEA analysis of the Turbine blade design.

. Simulated the two-phase flow field inside a Kaplan turbine runner with

Fluent.

. CFD/FEA analysis of 3-D unsteady periodic turbulent flow in hydraulic

turbine blade.

. Conducted various 3-D velocity of flow field measurement of fluid

machineries using PIV.

Technical Skills

Analytical skills include modeling and multi-physics simulation using

analytical/numerical methods and FEA/CFD software. Proficient with various

programming languages/packages, e.g., ANSYS, COMSOL, Flotherm, MATLAB,

FORTRAN, C and LabVIEW. Very familiar with general engineering experimental

methods, and has rich experience in development and applying thermal and

fluid measurement systems. I also had several trainings on Design of

Experiments (DOE) methods and Six Sigma methodologies.

Professional Activities

I serve as a referee or panelist for various journals/conferences, e.g.,

Journal of Heat Transfer, Measurement Science and Technology, and Journal

of Micromechanics and Microengineering, and federal funding agencies

including Department of Energy (DOE) and National Science Foundation (NSF),

etc. I received various awards in research and am an ASME and IEEE

member.

Publications I have published over 40 papers (including invited papers)

in peer-reviewed journals and conferences in thermo-fluids fields. I also

have 5 invention disclosures/pending patents. (Available upon request)

Citizenship Permanent resident.

Contact this candidate