System Technician

*** **** ****** • Fort Collins, CO *****

Phone 970-***-**** • Email: abjagq@r.postjobfree.com

Cuong G. Cung

OBJECTIVE:

Seeking a responsible position as a Manufacturing Operations Support where experience and training will be further developed

EDUCATION:

1998 San Jose City College San Jose, Ca

Certificate of Specialization for Electronic Technology

1992 Valley Technology Center San Jose, Ca

Certificate of Electronic Technician

1985 Santa Clara Unified School District Santa Clara, Ca

Certificate of Electronic Assembly

QUALIFICATION:

• Excellent communication skill, reliable, quick learner, multitasking, patient, organized, friendly, work as a team, and truthful

WORK EXPERIENCE:

Avantek/Hewlett-Packard/Agilent Technologies/Avago Technologies

October 1985 San Jose/Newark, CA & Fort Collins, CO

to August 2010

• Black Half Area

• Fab Clean Room Contamination Control

• 6” Wafers Production & Handling

• Roth and RAU ION Scan 800

• ON TRAK SYNERGY/DSS-200 Series II System, CMP = Chemical Mechanical Polishing (Speed Fan & CMP-V Model name)

• APS 2000 Sensor --- Automated programmable sensor

• Manufacturing UV Bake 150 Operating --- To hardens the photo resist and gives high temperature stability to photo resist patterns

• LAM Raibow --- a stand-alone tool platform with a sequential single load socked, single wafer

• LAM 4520XL/4520 --- Etch Chamber, LAM 4520 --- Photo resist patterned PSG & TEOS oxide

• LAM 4520XL-08 --- Photo resist patterned BSG (Boron silicate glass) & CDO (Carbon doped oxide)

• LAM 4520XL-09 --- Photo resist patterned TEOS oxide and nitride

• LAM Research Alliance – 4720, LAM Research 9600, LAM 790 (auto etch), LAM 590, AME 8330

• GaSonics/IPC L 3500 --- Creates a plasma by injecting gas into an evacuated plasma reactor chamber

• VERTEQ Model 1600-44 --- Spin rinse dryer is used for rinsing/on drying 6” wafers

• Metapulse-200 Series --- used to measure film thickness of test and production wafers, between 20 angstroms to over 3 microns

• DESPATCH Oven --- Pre-bake hardens the photo resist, provides corrosion protection after post-etch rinse

• AMT (Applied Materials Precision 5000), Novellus (Concept one-W)

• Focus ELLIPSOMETER Model FE-111, Microscope NIKON NWL 860, NIKON Eclipse L 200, Eclipse Mark II, Endura HP PVD

• AG 4100, RTP (Centura Rapid Thermal Processor), Flexus 5400 Stress Measurement System, FSI (Mercury Map)

• UWH (Universal Wafer Handler) --- Randomizer wafer reading

• AIT (Advanced Inspection Tool)/KLA 2133 --- Used to inspect & detect patterned & un-patterned wafers

• AMS --- A modular cluster 3 deposition chambers

• Flexus F2300 --- Thin film measurement system

• FSM 3800 --- Thin film stress measurement system

• Wet Benches (Santa Clara Plastics Bench)

B 224 NOE (Neutral Oxide Etch) --- The bench is equipped with an automatic HALON fine suppression system. Removes

plasma etch residue from the surface of the wafers &from sides of metal lines, used to remove particles after

planarization/via/contact.

B204 --- Uses AQUA REGIA remove un-reacted platinum

B 218 --- Mixture of HF & NH4F remove oxide

B 228 --- Mixture of NH4OH & H2O2 remove un-reacted titanium

B 225 --- Uses 16:1:1:2 aluminum etch also known as PAN etch to remove molybdenum

530 11th Street • Fort Collins, CO 80524

Phone 970-***-**** • Email: abjagq@r.postjobfree.com

B 216 --- 10:1 HF used to etch silicon oxide off used monitor wafers (recycle wafers)

• TENCOR UV 1080 & Metrology UV 1250 --- Used to measure film thickness

• RS75 (KLA TENCOR) --- Resistivity mapping system collect and analyzes sheet resistance data in a semiconductor process

environment

• Surfscan 6420 (TENCOR) --- To detect defects on un-patterned wafers, used to monitor a variety of equipment and processes in the

FAB

• SCQS Chart, Smart Dash Board

• New product R&D

Contact this candidate