Paul Hoffman

***** ******* ***** *****, *** Diego, CA 92130

mobile 858-***-**** home 858-***-****

abj6q7@r.postjobfree.com

Education: Stanford University. M.S., Engineering Management 6/82. B.S., Mechanical Engineering 6/81.

Executive Program at Northwestern University: Mergers & Acquisitions.

Experience: Consultant in Intellectual Property to high-tech and consulting companies and law firms.

• Evaluate IP and patents for purchasing or licensing, including detailed patent

10/08 to analysis, claims construction, prior art searches and related tools to value IP

present • Worked with a Client Corporate Finance and Strategic IP group on a valuation

methodology for IP and a strategic plan for IP

• My consulting spans multiple technology areas including IC / wafer Back-End

structures and processes, packaging, printed circuit board technology. Also GPS –

through sub-contractors hired by me

• Work with internal groups (finance, legal, engineering, technology, product

management) and external groups (product analysis / teardowns, legal) to best position

the client company with respect to IP

• Key member of a team that evaluated, valued, negotiated and closed a $65M

acquisition of company to gain their IP portfolio. Subsequently worked on the plan

to manage and improve the portfolio

President and CEO, Amulaire Thermal Technology (San Diego, CA & Taipei, Taiwan). A

7/05 to 10/08 post-revenue start-up specializing in thermal cooling solutions for electronics ($ 5M

revenue in ’07). Sales, Engr, Mktg and HQ are in the US, and Engr, Sales, and factory are

in Taipei, 100 people total.

• Successfully closed several funding rounds (B round of $16M, C round of $4.5M

and a Bridge Loan of $1.5M)

• Prior to B-round, assisted lead VC with due diligence and structuring the deal.

• Joined company as the B-round funding was closing. Assisted the complicated

closing process (required not only a funding round but also the establishment of

a US corporation with a legal Taiwan branch, and the merger of the pre-existing

Taiwan corporation into the US entity).

• Recast the forecast and revenue plan, established the salary and option plan, and

created a company budget. Hired the corporate and patent lawyers, accountants,

bankers, money management company and other business service providers.

• Changed the culture of the company to allow open communication and more

effective decision-making at lower levels.

• Instituted a strategic and operational planning process.

• Expanded the company internationally – bringing on directs, rep’s and

distributors in Europe, North America, Korea and Japan.

• Redirected the company strategy to focus on the top customer opportunities (the

leading computer OEM’s and ODM’s and leading high power IC companies).

• Established outstanding opportunities cooling critical components in Green

Technology areas (Hybrid Electric Vehicles and Wind Turbines) as well as high

performance Servers and Supercomputers, and other areas.

• Targeted and won opportunities with world-class customers such as IBM, HP,

Fujitsu, Infineon, Toyota, Hitachi, Fuji Electric, Mitsubishi and others.

• Re-organized the key management team, including replacing and upgrading.

Instituted a formal performance review and employee development process and

other HR activities (job descriptions, etc).

• Upgraded the company’s technical capabilities (hired specialist engineers,

upgraded lab equipment & software, quality control, etc).

• Established a close working relationship with the board members, which included

US and Taiwanese members.

• Improved operational effectiveness in Sales, Engineering and Manufacturing.

• Attended LP meetings for the lead VC – presenting the Company. Also spoke

with potential LP’s as a reference during periods the VC was raising new funds.

10/06 to Advisory Board Member, National University School of Engineering (San Diego, CA) One

present of the largest Universities in California.

• Invited to join the board advising the Dean and School of Engineering in all

matters related to the improvement, growth and business success of the School

2/05 to 7/05 CEO, Ethertronics (San Diego, CA). A post-revenue start-up specializing in internal

antennas.

• Hired on as COO (see below) and assumed CEO duties after Board relieved

previous CEO due to lack of confidence.

• Recast the revenue plan, budget and required funding.

• Redirected the company strategy to take advantage of higher growth

opportunities to result in higher company valuation.

• Established an honest and close working relationship with the board members.

• Improved operational effectiveness in Sales, Engineering and Manufacturing.

• Provided a vision for the company and energized the employees.

• Successfully completed a $4.75 million funding round.

1/02 to 1/05 Chief Operating Officer, Ethertronics (San Diego, CA). CEO Ethertronics China. A post-

revenue, start-up specializing in internal antennas for mobile phones and portable

systems.

• Strategic and operational input on all phases of a start-up company.

• Major financial involvement: created business operating model, set Sales targets .

Determined headcount, capital equipment and operating expense plans for the

company. Performed company financial analyses and budgeting with Controller &

CFO.

• Created Asian Sales from scratch: selected, negotiated & signed reps in Taiwan,

Korea, Japan, Hong Kong, and China. Determined commission schedules and

splits, stock option incentive program with reps. Established Asian sales

strategy – market segments, products, target customers. Heavily involved in all

aspects of Sales process – customer visits/closes, quotes, agreements &

contracts, sales pitches.

• Established Chinese Design Center and Trading Company to provide antenna

design & rapid prototyping as well as within-China business (local shipping, local

currency transactions). Chairman and CEO of the Ethertronics China company.

• Set up two Korean Design Centers, Korean Business Office and Taiwan FAE.

• Partnered with CEO in funding pitches to Investors and VC’s.

• Set and focused company product & market strategy: instrumental in kick-

starting the commercial product effort (product definition, value propositions,

customer pitch…).

• Set up Operations team (Design, Mfg, QC, Doc Control, etc) – design, product

release, mfg (rapid proto and high volume). Outsourced Mfg to low cost Far East

contractors

• Achieved 50 to 60% cost reduction for products (by redesign & supplier

selection)

• Maintained 55% margins across all products, 60 - 80% margins for many

products.

• Established and participated in ongoing effort to prepare for ISO9001:2000

registration.

• Established Product Management function: contract review, pricing, market &

product strategy, go/no on customer projects, project management & customer

interface.

• Managed patent and IP strategy.

1/02 to 6/05 Consultant to Sequoia Communications

• Consulting in IC packaging, test and assembly for this transceiver IC start-up.

7/99 to 1/02 Senior Vice President of System in Package (SiP) SBU, Amkor Technology (Chandler,

AZ). The world’s largest subcontract IC assembly and test supplier.

• Created a new packaging technology & paradigm, System in Package (SiP), now

widely adopted in the industry.

• Created the first SBU within Amkor. Focused on assembly and test of low cost,

high volume Modules and Sub-Systems (parts with multiple IC’s, passive

components and other elements like connectors, plastic housings, etc). Created

business plan and established functional capabilities including Business

Development & Marketing, Quoting, Financial Analysis, Supply Chain

Management & Systems, Product Management, Design & Simulation, Test

Development, and Technology Development (grew group from 2 to 50 people).

• Had P&L responsibility for all System in Package products. Sales revenue of $

6.7 million in first year of production and break-even profit, $ 36 million in

revenue and $ 3.6 million profit in 2 nd year, $102 million in revenue and $10 million

in profit in 3rd year.

• Part of due diligence team for several acquisition candidates.

• Raised $26M in ’00 and $48M in ’01 of internal capital for manufacturing capacity.

• Directed factory strategy (Mfg lines in Philippines, Korea, Taiwan, and China).

Worked closely with Manufacturing on equipment selection, cost reduction,

capacity planning, materials selection, and all other manufacturing aspects.

• Produced 3 million units per week by the end of 2001 ( fastest volume ramp of any

Amkor product). SBU supported by 1100 people in the factories. ASP’s ranged

from $ 0.40 to over $ 100 (versus average ASP at Amkor of $ 0.26).

• Created design projects where Amkor was involved, for the first time, in the

customers’ functional design of the product (RF: filters, baluns, matching

circuitry, and in some cases assisting with the IC designs. Digital: signal integrity,

advanced substrate design).

• Worked with Sales to win new business – established close relationships with

both IDM’s and OEM’s worldwide. Successful selling to foreign companies.

• Negotiated partnering agreements and licensing agreements affecting this

business unit (three partnering and one license agreement concluded).

• Negotiated preferred supplier status with our largest customer (RFMD).

7/98 – 7/99 Vice President of Advanced Product Development, Amkor Technology (Chandler, AZ).

• Oversaw package R&D and commercialization. In one year grew team from 12 to

40 technologists in Chandler (Flip Chip CSP and High Performance Flip Chip to

2000 balls, Stacked CSP, wafer scale CSP, DRAM memory CSP, MultiChip

Modules, Ultrathin BGA (0.5mm mounted height)), thermal and electrical

simulation and characterization, and an Advanced Product Development Center

capable of supporting wirebond and flip chip assembly. Most of the packages

listed above were developed, qualified, and transferred to production within 18

months. New products introduced during my leadership of the R&D group

realized more than $ 200 million in sales in 2002.

• Oversaw more than $26M in development project and first manufacturing

capacity expenditures during this period.

• Product Management for uBGA ramp from 400K to 1800K units/wk, sales of $35M,

reduced costs 60%, increased yields to 99.7%, and qualified 4 new customers.

• Chairman of the Corporate Technology Steering Committee, set company

technology direction including prioritization and resourcing of projects. Funding

& management for R&D groups in Korea, Chandler and the Philippines with a

total of 160 engineers.

• Negotiated license of Sharp Stacked CSP and a co-development alliance with

Shinko.

• Initiated university internship program.

• Chairman of a task force to coordinate efforts between Amkor Assembly & Wafer

Fab.

• Redefined Amkor’s NPI Process (New Product Introduction).

4/96 – 7/98 Vice President of Chip Scale Products, Amkor Electronics ( Chandler, AZ). New product

development, introduction and commercialization, and product management.

• Developed uBGA package business. Within 6 months put together a dev and mfg

team, and installed the first two manufacturing lines ($10M investment).

Negotiated material and equipment sales terms with suppliers.

• Responsible for the product: pricing, mfg capacity, sales & marketing strategy,

etc.

• Oversaw direct reports in Arizona, California and the Philippines.

• First year production > 400K/week, > 99.0% yield for a very tough customer (Intel).

• Negotiated customer upfront capacity reserve payments of $ 5.6M.

• Second year revenue of $35M.

10/94 - 4/96 Business Development Manager, Olin Interconnect Technologies (Manteca, CA). Product

development and strategic marketing for a component supplier to the IC assembly

marketplace.

• Invented a Metal Ball Grid Array (MBGA) chip package. Wrote Business Plan and

obtained corporate funding. Staffed development and manufacturing

departments, negotiated licenses and contracts with outside suppliers. Directed

sales and marketing for MBGA. Decided pricing and distribution strategy.

• Responsible for $ 2.7 M expense and $ 1 M capital budget in 1995.

• Responsible for company-wide Strategic Marketing. Created a Marketing Plan

including market segment identification, competitor analysis, key customer list,

annual customer surveys and marketing mix (product, price, distribution,

promotion). Decided advertising and marketing communications materials (press

releases, literature, newsletter, etc). Instituted a computerized customer database.

• Key interface with attorneys on patents, trademarks, and license agreements.

• Set up a thermal and electrical characterization lab.

12/90 – 10/94 Technology Manager, Olin Interconnect Technologies (Manteca, CA). New product

development and pilot line for an IC assembly subcontractor.

• Managed 12 person group to develop new packages, materials, and processes for

the MQUAD high thermal performance package. Defined and staffed a Pilot Line.

• Introduced a system for package development and release to Manufacturing.

• Technical interface to customers & direction of off-site R&D budget ($1.5

million/yr).

• Won 1994 Kiver best product award - Electronic Packaging & Production

Magazine.

• Created department for TAB assembly: staffing (15), equipment, SPC, processes,

specifications and operator training. Customers included VLSI, NCR, TI, IBM, etc.

1/88 – 12/90 TAB Development and Applications Manager, Olin Mesa (Santa Clara, CA). A TAB circuit

material provider and assembly development partner to IC customers.

• Developed leading edge TAB solutions for customer applications: TAB tape and

assembly equipment design, process development, & prototype assembly.

• Directed a major project that developed a new copper alloy for TAB tape.

• Pioneered a high performance two metal layer TAB tape . Used novel Mfg

processes (excimer laser vias) & personally won a contract from DEC for this

product.

8/82 – 1/88 Lead Packaging Development Engineer, IBM (Essex Junction, VT). IC package

development for one of the world’s leading edge and largest IC design and wafer

fabrication facilities.

• Technical leadership for 12 people.

• Worked with IBM plants worldwide (3 US, France, Japan, England) for a TAB

product.

• Led a task force that set IC packaging direction for the IBM Corporation.

• Helped develop first LOC (Lead On Chip) plastic DRAM package . More than 10

billion have been produced.

• Group leader for development of the first surface mount package with IBM chips.

• Created assembly processes and equipment for the industry’s first one Megabit

DRAM. Transferred process to 3 manufacturing plants worldwide.

Papers: 24 papers presented at electronics industry conferences and 7 articles published in industry

magazines. Session chair at multiple conferences.

Patents:

Thirty-eight patents issued (U.S. #7,176,062 #7,064,009; #7,045,883; #6,919,631; #6,900,527;

#6,837,032; #5,189,363; #5,239,131; #5,342,888; #5,360,942; #5,399,805; #5,455,386; #5,455,387;

#5,477,008; #5,506,446; #5,545,850; #5,578,869; #5,629,835; #5,764,484; #5,805,427; #5,877,551,

#5,952,719; #6,028,354, #6,262,477, #6,300,673, #6,414,396, #6,423,576, #6,462,274, # 6,489,667,

#6,576,998, # 6,597,059, #6,603,183, #6,614,102, #6,630,661, #6,632,997, #6,707,168, #6,737,750,

#6,759,266) in the area of electronics.

Paul Hoffman – Functional Overview

Business / Financial

• Have written multiple business plans

• P&L responsibility (grew a business to $102M in revenue, grew several to over $20M in revenue)

• Negotiated contracts, licenses, partnerships

• Understand financial statements (income statement, balance sheet, cash flow)

• Funding pitches to Venture Capital companies

• Part of due diligence team for acquisitions

• Established company budgets and financial plans

• Part of due diligence team for a Venture Capital company evaluating new investments

International

• Experienced dealing in Asia, Europe and North America with customers and suppliers

• Successfully outsourced manufacturing in Asia (Taiwan, China, and Hong Kong)

• Set up design centers, sales and business offices in China, Korea and Taiwan. Ran a factory in Taiwan

Sales & Marketing

• Set up & managed direct & Rep sales networks (contracts, commissions, splits…)

• Product Management (product definition, pricing, target segments, value propositions…)

• Marketing Plans and market segment analysis

• Have managed Marcomm & Advertising

• Markets / Applications: familiar with mobile phones, PC’s, servers, Hybrid Electric Vehicles (HEV’s), Wind

Turbines, motor drives, WLAN, camera components / image sensors, IC-based display devices (LCOS,

DLP), hard drives, memory cards, IC components – flash & DRAM, ASICS, RF, DSP’s, cross-switches,

microprocessor, IGBT’s, high brightness LED, Solar PhotoVoltaic, servers, some opto-electronic.

Intellectual Property / R&D / Development / Design

• Evaluated the technical strength (including claim analysis, claim construction, prior art, etc) and set

monetary valuations on patents; Sat on Patent Review Boards

• Successful at bringing new projects from R&D to commercialization

• Directed large R&D organization (160 engineers in 3 countries)

• Have more than 35 patents in IC assembly and test

• Have set up and run design centers

Operations / Manufacturing / Test

• Know how to set up manufacturing lines in-house or find outsourced suppliers, to support

extremely high volume manufacturing (e.g. 3 million units per week)

• Knowledgeable about operational systems (ERP…) and quality systems (ISO 9001)

• Cost reduction methodologies

• Have set up electrical test organizations (engineering & Mfg personnel and capital equipment)

Technical Depth

• Understand many manufacturing methods & materials (from wafer to PCB to assembly to systems)

o Photo (resist apply, image, bake, develop) – including lift-off

o Wet Etching / Dry Etching (RIE, plasma)

o Metal deposition (sputtering, organometallic, PECVD, etc)

o Plating (electroless, electrolytic)

o CNC, EDM, laser ablation / milling

o Stamping, extruding, coining

o Injection molding (plastic and metal), transfer molding (plastics)

o Sintering, soldering, brazing, diffusion bonding

o Expert in IC packaging

o Surface Mount Technology

• Understand antenna design and development

• Deep knowledge of thermal solutions (heat sinks, heat pipes, cold plates, vapor chambers,

etc)

• Understand design & design tools (from IC to component to system)

oLayout (Cadence, ProE, Solidworks…)

oSimulation (electrical, thermal & stress)

• Understand test (from IC to package; digital, analog, and RF)

Contact this candidate